[hpc-announce] ESWEEK 2021: Call for WiP papers
Lars Bauer
lars.bauer at kit.edu
Fri May 7 04:13:41 CDT 2021
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EMBEDDED SYSTEMS WEEK
CASES * CODES+ISSS * EMSOFT * NOCS * Workshops * Tutorials
Call for Work-in-Progress Papers
Virtual Conference, October 10 - 15, 2021
www.esweek.org
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About Embedded Systems Week (ESWEEK)
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Embedded Systems Week (ESWEEK) is the premier event covering all
aspects of hardware and software design for smart, intelligent and
connected computing systems. By bringing together three leading
conferences (CASES, CODES+ISSS, EMSOFT), one symposium (NOCS), and
several workshops and tutorials, ESWEEK allows attendees to benefit
from a wide range of topics covering the state of the art in embedded
systems research and development.
https://esweek.org/esweek_2021_cfp/
Registered attendees can attend sessions in any of the ESWEEK
conferences (CASES, CODES+ISSS, EMSOFT), the NOC symposium, tutorials
and workshops.
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Timeline
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Work-in-Progress Track:
- Paper Submission: June 4, 2021 (firm)
- Notification of Acceptance: July 5, 2021
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Covid-19 planning
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Given the continued uncertainty, the next ESWEEK is currently planned as
a virtual event. We will, however, closely monitor the situation and if
it improves significantly consider a hybrid in-person/virtual event in
an appropriate location that will be announced well in advance. In all
cases, virtual attendance and remote presentations of accepted papers
will be possible. Please watch the website or social media channels for
updates.
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Paper Process
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ESWEEK 2021 continues a dual publication model comprising the Journal
track and the Work-in-Progress (WiP) track for the three conferences
(CASES, CODES+ISSS, and EMSOFT). Journal track papers are full-length
papers describing mature work. They will be published in the ACM
Transactions on Embedded Computer Systems (TECS). The WiP track papers
are short (2-page) papers representing not-yet-mature but promising
research. They will be published in the ESWEEK proceedings and will be
listed as regular publications within the IEEE and/or ACM digital
libraries. Authors of WiP papers have the opportunity to publish an
extended form of their work in any conference or journal they prefer.
Journal and WiP papers are mutually exclusive, i.e., a work can only be
in submission in one of the two tracks. For more information on the
ESWEEK dual-track publishing process, please refer to
https://esweek.org/author-information
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CASES: International Conference on Compilers, Architectures,
and Synthesis for Embedded Systems
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CASES is a premier forum where researchers, developers and practitioners
exchange information on the latest advances in compilers and
architectures for high-performance, low-power embedded systems. The
conference has a long tradition of showcasing leading edge research in
embedded processor, memory, interconnect, storage architectures and
related compiler techniques targeting performance, power, predictability,
security, reliability issues for both traditional and emerging application
domains. In addition, we invite innovative papers that address design,
synthesis, and optimization challenges in heterogeneous and accelerator-
rich architectures.
https://esweek.org/cases/
CASES Program Chairs:
Umit Ogras, University of Wisconsin-Madison, US
Preeti Panda, IIT Delhi, IN
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CODES+ISSS: International Conference on Hardware/Software Codesign
and System Synthesis
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The International Conference on Hardware/Software Codesign and System
Synthesis (CODES+ISSS) is the premier event in system-level design,
hardware/software co-design, modeling, analysis, and implementation
of modern Embedded Systems, Cyber-Physical Systems (CPS), and Internet-
of-Things (IoT), from system-level specification and optimization to
system synthesis of multi-processor hardware/software implementations.
The conference is a forum bringing together academic research and
industrial practice for all aspects related to system-level and
hardware/software co-design.
https://esweek.org/codes-isss/
CODES+ISSS Program Chairs:
Jason Xue, City University of Hong Kong, HK
Chengmo Yang, University of Delaware, US
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EMSOFT: International Conference on Embedded Software
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The ACM SIGBED International Conference on Embedded Software (EMSOFT)
brings together researchers and developers from academia, industry, and
government to advance the science, engineering, and technology of
embedded software development. Since 2001, EMSOFT has been the premier
venue for cutting-edge research in the design and analysis of software
that interacts with physical processes, with a long-standing tradition
for results on cyber-physical systems, which compose computation,
networking, and physical dynamics.
https://esweek.org/emsoft/
EMSOFT Program Chairs:
Linh Thi Xuan Phan, University of Pennsylvania, US
David Broman, KTH Royal Institute of Technology, SE
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Organization
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ESWEEK 2020 General Chairs:
Andreas Gerstlauer, University of Texas Austin, US
Aviral Shrivastava, Arizona State University, US (Vice General Chair)
Tulika Mitra, National University of Singapore, SG (Past Chair)
Virtual Conference Chairs:
Sudeep Pasricha, Colorado State University, US
Hoeseok Yang, Ajou University, KR
www.esweek.org
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