[hpc-announce] [GOING VIRTUAL] CFP NOCS 2020 - 14th IEEE/ACM International Symposium on Networks-on-Chip
Lizhong Chen
chenliz at oregonstate.edu
Sat May 2 18:25:04 CDT 2020
In light of COVID-19, the International Symposium on Networks-on-Chip (NOCS
2020) will go virtual. All accepted papers will be published in the
proceedings and a mechanism for virtual presentation and participation will
be provided. More details will be announced in a timely manner, so please
stay tuned to the official website for more updates:
http://nocs2020.engr.uky.edu/
We remind prospective authors that the submission was extended to May 7th
(Abstract) and May 15th (full paper). The call for papers is appended below.
====================
CALL FOR PAPERS
====================
14th IEEE/ACM International Symposium on Networks-on-Chip
September 24 - 25, 2020, Virtual Presentation and Participation
(Co-located with Embedded Systems Week 2020, also virtual)
http://nocs2020.engr.uky.edu/
The International Symposium on Networks-on-Chip (NOCS) is the premier event
dedicated to interdisciplinary research on on-chip, package-scale,
chip-to-chip, and datacenter rack-scale communication technology,
architecture, design methods, applications and systems. NOCS brings
together scientists and engineers working on network-on-chip (NoC)
innovations and applications from inter-related research communities,
including discrete optimization and algorithms, computer architecture,
networking, circuits and systems, packaging, embedded systems, and design
automation. Topics of interest include, but are not limited to:
## NoC Architecture and Implementation
- Network architecture (topology, routing, arbitration)
- Timing, synchronous/asynchronous communication
- NoC reliability issues and solutions
- Security issues and solutions in NoC architectures
- Power/thermal issues at NoC un-core and system-level
- Network interface issues and solutions
- Signaling and circuit design for NoC links and routers
## Communication Analysis, Optimization, & Verification
- NoC performance analysis and Quality of Service
- Modeling, simulation, and synthesis of NoC
- Verification, debug and test of NoC
- NoC design and simulation methodologies and tools
- Benchmarks, experiences on NoC-based hardware
- Communication-efficient algorithms
- Communication workload characterization & evaluation
## Novel NoC Technologies
- Optical, wireless, CNT, and other emerging technologies
- NoC for 2.5D and 3D packages
- Package-specific NoC design
- Network coding and compression solutions
- Approximate computing for NoC and NoC-based systems
## NoC for Intelligent Physical Systems
- NoC design for Deep Learning
- Mapping of existing and emerging applications onto NoC
- NoC case studies, application-specific NoC design
- NoC for FPGA, structured ASIC, CMP and MPSoC
- NoC designs for heterogeneous systems
- NoC for CPU-GPU and data-center-on-a-chip (DCoC)
- Scalable modeling of NoC
- Machine learning for NoC and NoC-based Systems
## NoC at the Un-Core and System-level
- Design of memory subsystem (un-core) including memory controllers,
caches, cache coherence protocols in NoC
- NoC for new memory/storage technologies
- NoC support for processing-in-memory
- OS support for NoC
- Programming models for NoCs
- Interactions between large-scale systems (datacenter, edge and fog
computing) and NoC-based building blocks
## Inter/Intra-Chip and Rack-Scale Network
- Unified inter/intra-chip networks
- Hybrid chip-scale and datacenter rack-scale networks
- All aspects of inter-chip and rack-scale network design
#############################################
Electronic paper submission requires a full paper, up to 8 double-column
IEEE format pages, including figures and references. The program committee
will use a double-blind review process to evaluate papers based on
scientific merit, innovation, relevance, and presentation. Submitted papers
must describe original work that has not been published before or is under
review by another conference or journal at the same time. Each submission
will be checked for any significant similarity to previously published
works or for simultaneous submission to other archival venues, and such
papers will be rejected. Proposals for special sessions and demos are
invited. Paper submissions and demo proposals by industry researchers or
engineers to share their experiences and perspectives are also welcome. A
percentage of accepted papers will be recommended for publication in an
IEEE journal after revision according to the reviewers comments. Please
find the detailed submission instructions for paper submission, special
session, and demo proposals at the submission webpage.
############################################
Important Dates (Anywhere on Earth)
Abstract registration (Extended): May 07 (AoE), 2020
Full paper submission (Extended): May 15 (AoE), 2020
Notification of acceptance: July 08, 2020
Final version due: August 07, 2020
General Chairs
Sudeep Pasricha (Colorado State University)
Ajay Joshi (Boston University)
Technical Program Chairs
Tushar Krishna (Georgia Institute of Technology)
John Kim (KAIST)
Publicity Chairs
Lizhong Chen (Oregon State University)
Sergi Abadal (Universitat Politecnica de Catalunya)
Pengju Ren (Xi'an Jiaotong University)
Web Chair
Ishan Thakkar (University of Kentucky)
Publication Chair
Akram Ben Ahmed (Keio University)
Steering Committee Chair
Radu Marculescu (University of Texas, Austin)
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