[hpc-announce] CfP: SI on Intelligent Embedded Systems Architectures and Applications

Lars Bauer lars.bauer at kit.edu
Fri Nov 9 13:04:34 CST 2018


-------------------------------------------------------
Apologies if you receive multiple copies of this email.
-------------------------------------------------------

Call for papers:

Special Issue on Intelligent Embedded Systems Architectures and Applications
(Elsevier Microprocessors and Microsystems)

https://www.journals.elsevier.com/microprocessors-and-microsystems/call-for-papers/special-issue-on-intelligent-embedded-systems-architectures

The purpose of this special issue is to provide an up-to-date picture of
intelligent embedded systems architectures and applications with emphasis on
Smart IoT and Cyber Physical Systems, including hot topics such as accelerating
deep learning. The proposal covers several aspects, from the hardware related
ones to embedded software and application issues.

Topics include, but not limited to, the following:
- Special purpose hardware to support deep learning in embedded architectures
- Edge computing for smart embedded systems: hardware and software aspects
- Run-time resource management for smart IoT/Edge Computing systems
- HW/SW codesign of Cyber Physical Systems
- Programming models for IoT/Edge computing applications
- Applications and case studies of intelligent embedded systems
- Design methodologies and platforms for wearable computing
- In-memory computing for unsupervised learning

Submissions will be evaluated on Novelty, Generality, Significance, Clarity and
Support criteria. We invite the submission of full length papers to this special
issue that will details the state-of-the-art technology and trends in
Intelligent Embedded Systems Architectures and
Applications.

Important dates:
- Paper submission deadline: Jan. 15, 2019.
- Notification of the first review: Mar. 15, 2019.
- Revisions due: Apr. 15, 2019.
- Final notice of acceptance: May. 15, 2019.
- Final version manuscripts due: Jun. 15, 2019.
- Special issue to appear: Sep 2019.

Guest Editors: Maurizio Martina and William Fornaciari

Maurizio Martina
Department of Electronics and Telecommunications,
Politecnico di Torino, Torino, Italy.
maurizio.martina at polito.it
http://personal.det.polito.it/maurizio.martina/index.htm

William Fornaciari
Dipartimento di Elettronica, Informazione e Bioingegneria
Politecnico di Milano, Milano, Italy
william.fornaciari at polimi.it
http://home.deib.polimi.it/fornacia/doku.php



More information about the hpc-announce mailing list