[hpc-announce] IEEE DataCom 2016 - Submission Deadline: April 30, 2016 (Firm)

CSPlus-Admin cfp-admin at grid.chu.edu.tw
Wed Apr 20 18:55:04 CDT 2016

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Date: Thu, 21 Apr 2016 07:54:59 +0800 (CST)

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Dear Colleagues:

April 30 will be the firm deadline to submit research paper to the IEEE DataCom 2016 which will be held in Auckland, New Zealand, August 8-12, 2016.

We cordially invite you to share your latest research results related to Big Data, and Cloud Computing at the IEEE DataCopm 2016 conference.  Proceedings of the conference will be published by IEEE CS Press and indexed by EI.  Selected papers will be published in special issues of prestigious international journals.

IEEE DataCom 2016 also welcomes works-in-progress paper, industry paper, demo & poster papers.

IEEE International Conference on Big Data Intelligence and Computing(IEEE DataCom 2016)





Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications.

The goal of the IEEE International Conference on Big Data Intelligence and Computing (IEEE DataCom 2016) is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. IEEE DataCom 2016 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data. Authors of selected papers will be invited to submit an extended version (with at least 30% new material) for review and publication in special issues of international journals. 

IEEE DataCom 2016 will be held on Aug. 8-12, 2016 in Auckland, New Zealand. Topics of interest include, but are not limited to:

- 	The 5Vs of the data landscape: volume, variety, velocity, veracity, value

- 	Big data science and foundations, analytics, visualization and semantics

-	Software and tools for big data management.

-	Security, privacy and legal issues specific to big data

-	Big data economy, QoS and business models

-	Scientific discovery and business intelligence

-	Software, hardware and algorithm co-design, high-performance computing

-	Large-scale recommendation systems and graph analysis

-	Infrastructures and systems for big data analytics and managements

-	Middleware and tools for big data analytics and managements

-	Algorithmic, experimental, prototyping and implementation

-	Data quality issues: such as validation, metrics, optimizations and consistency

-	Data-driven innovation, computational modelling and data integration

-	Data intensive computing theorems and technologies

-	Big data for advanced manufacturing and productivity

-	Modeling, simulation and performance evaluation

-	Green data centers / environmental-friendly perspectives

-	Computing, scheduling and resource management for sustainability

-	Complex applications in areas where massive data is generated




IEEE CS proceedings, indexed by 

 - IEEE Xplore

 - Scopus

 - EI Engineering Index

 - ACM Digital Library

 - dblp

 - Google Scholar

Extended version of the selected papers will be invited for publication in prestigious international journals.




Paper Submission (Firm deadline): 	April 30, 2016

Demo/Poster Submission:			May 5th, 2016

Author Notification:		 	May 20, 2016

Camera ready / registration deadline: 	May 31, 2016




Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Papers should be prepared in IEEE CS format and submitted via the IEEE DataCom 2016 web site, https://easychair.org/conferences/?conf=ieeedatacom2016

IEEE formatting information:


- Proposals for organizing tutorials, workshops and special sessions need to be submitted to the Tutorials, Workshops and Special Sessions Chairs, respectively. A proposal should include title, theme, scope and main presenters/organizers.

- Research paper (8 pages) should explore a specific technology problem and propose a complete solution to it, with experimental results. 

- Works-in-Progess (WIP) (6 pages) papers are expected to present either work currently in progress or less developed but highly innovative ideas. 

- Demo/Poster papers (4 pages) must describe working systems and be related to DataCom. These systems may be innovative prototype implementations or mature systems that use related technology.  Papers/proposals need to be submitted to the Demo/Poster Chair.

- Workshop and Special Session papers need to be submitted to the corresponding workshops and special sessions. 

All accepted papers in the main tracks, workshops, special sessions and demos/posters will be published in an IEEE Computer Society proceedings (EI indexed). Extended versions of selected excellent papers will be considered for publication in special issues of prestige journals (SCI/EI indexed).


Organizing Committees


General Chairs 

Yuanyuan Yang, Stony Brook University, USA

Jie Li, University of Tsukuba, Japan

Domenico Talia, Università della Calabria, Italy

General Executive Chairs

Yang Xiang, Deakin University, Australia

Kevin Wang, The Univ. of Auckland, New Zealand

Program Chairs

Jinsong Wu, University de Chile, Chile 

Rajiv Ranjan, Newcastle University, UK

Vincent S. Tseng, National Chiao Tung Univ. Taiwan

Song Guo, University of Aizu, Japan

Workshop Chairs

Bahman Javadi, Univ. Western Sydney, Australia

Che-Rung Lee, National Tsinghua Univ., Taiwan

Shui Yu, Deakin University, Australia

Demo/Poster Chair

Cho-Li Wang, The Univ. of Hong Kong, Hong Kong

Special Session Chair

Bingsheng He, Nanyang Technological University, Singapore

Award Chair

Patrick K. Hung, University of Ontario Institute of Technology, Canada

Tutorial/Panel Chair

Junwei Cao, Tsinghua Univ., China

Zuqing Zhu, University of Science and Technology of China, China

International Liaison & Publicity Chair

Hai Jiang, Arkansas State University, USA

David Taniar, Monash Univ., Australia

Alex Kuo, University of Victoria, Canada

Mianxiong Dong, Muroran Inst. Tech., Japan

Victor Malyskin, RAS, Russia

Jun Huang, CQUPT, China 

Luis Veiga, Instituto Superior Técnico, Portugal

Yonghong Peng, University of Bradford, UK

Bhekisipho Twala, Univ. Johannesburg, South Africa

William Liu, Auckland University of Technology, New Zealand

Publication Chair

Amir H. Alavi, Michigan State University, USA

Local Arrangement Chair

Sheng Wen, Deakin University, Australia

Please visit the IEEE DataCom 2016 website http://grid.chu.edu.tw/datacom2016/tpc.php

for the complete listing of organizing committee and TPC members.

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