[hpc-announce] Final Call for Participation: International Conference on LLM-Aided Design

[Jeff Goeders]

FINAL CALL FOR PARTICIPATION
The 2nd IEEE International Conference on LLM-Aided Design (LAD)
July 30–31, 2026 | Stanford University, Stanford, CA, USA
https://urldefense.us/v3/__https://iclad.ai/__;!!G_uCfscf7eWS!Zv9Cw5zijuYXhG6QPlTYMZZT_nMso65j1lPC-i0J7N4C91CgRTTwTM0po182WIYpiTTc6e6LVRM8NqhkJ9_zkjlIEA$ 
The 2026 IEEE International Conference on LLM-Aided Design (LAD) focuses on how Large Language Models (LLMs) can transform the design of circuits, software, and computing systems by improving quality, productivity, robustness, and cost. As the premier international conference dedicated to LLM-aided design, LAD brings together leading researchers and practitioners from academia and industry to present the latest advances in AI-driven design automation, software development, verification, optimization, benchmarking, datasets, and open-source tools.
Early registration ends July 19. Register at: https://urldefense.us/v3/__https://iclad.ai/registration__;!!G_uCfscf7eWS!Zv9Cw5zijuYXhG6QPlTYMZZT_nMso65j1lPC-i0J7N4C91CgRTTwTM0po182WIYpiTTc6e6LVRM8NqhkJ99bMQo6tg$ 
This year’s program features research on agentic optimization, inference-time scaling methods, and a broad range of advances in LLM-aided design automation, software development, EDA, verification, datasets, benchmarks, and emerging applications.
Program: https://urldefense.us/v3/__https://iclad.ai/program__;!!G_uCfscf7eWS!Zv9Cw5zijuYXhG6QPlTYMZZT_nMso65j1lPC-i0J7N4C91CgRTTwTM0po182WIYpiTTc6e6LVRM8NqhkJ9-rHj4lug$ 
Keynotes

  *   Jason Cong, UCLA
  *   Kevork Kechichian, Intel

Invited Speakers

  *   Dan Fu, Together AI & UC San Diego
  *   Caroline Trippel, Stanford University
  *   Bryan Catanzaro, NVIDIA
  *   Juan Rey, Siemens

The conference also features two panel discussions bringing together experts from Google, Qualcomm, Synopsys, Cadence, MediaTek, Cognichip, Ricursive, Stanford, NYU, and ASU to discuss the future of LLMs and AI agents in electronic design automation.
New this year, LAD will feature a mini-career fair during the conference coffee breaks, where students and attendees can meet with sponsoring companies, learn about internship and full-time opportunities, and discuss careers in LLM-aided design, EDA, and AI.
In conjunction with the conference, the ICLAD-DAC 2026 GenAI Chip Hackathon will showcase the latest advances in applying Generative AI to chip design challenges across the RTL-to-GDSII flow. More information is available at https://urldefense.us/v3/__https://iclad.ai/hackathon__;!!G_uCfscf7eWS!Zv9Cw5zijuYXhG6QPlTYMZZT_nMso65j1lPC-i0J7N4C91CgRTTwTM0po182WIYpiTTc6e6LVRM8NqhkJ9-ZGF2JQg$ . Registration is still open for the on-premises track.