[hpc-announce] High-Performance Interconnects (HotI 2026) Announcement – Aug 19–21, 2026

[Emilio Paolini]

We are pleased to announce that the 33rd IEEE Symposium on High-Performance Interconnects (HotI 2026) will be held virtually on August 19–21, 2026.

Conference website: https://urldefense.us/v3/__https://hoti.org/2026/__;!!G_uCfscf7eWS!fnHSupok4gHbF-LdlHeW-zQGve6d53R8rA_CWZ7sS9DBdy1vTSwrchDVgwEPlGDb8caO53CH3oRVKnEEt4Lzcsg-23FS-UlZv3lGrA$ 

HotI continues to be the premier forum for presenting and discussing advances in interconnection networks, spanning HPC systems, cloud and datacenter platforms, AI/ML infrastructure, and emerging disaggregated and accelerator-centric architectures.

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HotI 2026 Theme: Scale-Up, Scale-Out, Scale-Across: Do they really differ?
Complex high-capacity training and disaggregated inference workloads are being scaled-across multiple sites, blurring the lines between contemporary scale-out and scale-up interconnection stacks. All the classical issues, such as jitter, bursts, flow/congestion, long-tail latencies, etc., are amplified over long distances, requiring deliberate interventions across the full interconnection stack: algorithms, operational tools, communication frameworks, and network fabrics. This edition of Hot Interconnects will explore these interventions behind operationalizing interconnects over long, short, and shorter distances.
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Call for Papers
HotI 2026 solicits original research papers addressing the design, analysis, implementation, and evaluation of high-performance interconnects and closely related technologies. Topics of interest include, but are not limited to, interconnect architectures, network protocols, networking software, communication runtimes, congestion control, optical and emerging fabrics, accelerator and chiplet interconnects, disaggregated systems, and system–network co-design.
Paper submissions are expected to open in March 2026. Like the previous years, we will consider regular and hot-topic papers. The full Call for Papers, including important dates and submission guidelines, will be released closer to the submission opening. Please monitor relevant CFP information here: https://urldefense.us/v3/__https://hoti.org/2026/call-for-papers.html__;!!G_uCfscf7eWS!fnHSupok4gHbF-LdlHeW-zQGve6d53R8rA_CWZ7sS9DBdy1vTSwrchDVgwEPlGDb8caO53CH3oRVKnEEt4Lzcsg-23FS-UmEKNfvcw$ 
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Call for Tutorials
HotI 2026 will feature half-day tutorials on timely topics of broad interest to the interconnects community. Tutorials may cover emerging technologies, tools, experimental platforms, or cross-layer approaches spanning hardware, systems, and applications.
Tutorial proposal submissions are expected to open in May 2026.
Additional details and submission instructions will be announced in advance of the opening date. Refer to 2025 tutorials program: https://urldefense.us/v3/__https://hoti.org/2025/program.html*tutorial--conference-day-3-friday-august-22__;Iw!!G_uCfscf7eWS!fnHSupok4gHbF-LdlHeW-zQGve6d53R8rA_CWZ7sS9DBdy1vTSwrchDVgwEPlGDb8caO53CH3oRVKnEEt4Lzcsg-23FS-Ukjiv4WnA$ 
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Call for Sponsorship
HotI 2026 invites industry partners to support the conference and engage with a focused community of experts from academia and industry working on high-performance interconnects and systems.
Sponsorship information and levels are available here: https://urldefense.us/v3/__https://hoti.org/2026/sponsors.html__;!!G_uCfscf7eWS!fnHSupok4gHbF-LdlHeW-zQGve6d53R8rA_CWZ7sS9DBdy1vTSwrchDVgwEPlGDb8caO53CH3oRVKnEEt4Lzcsg-23FS-UkJACQcvw$ 
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Additional information will be posted on the HotI 2026 website as details are finalized.
We look forward to your participation in HotI 2026.

*Contact:*
Please send any inquiry to: info at hoti.org