[hpc-announce] HotI 2025: Call for Papers & Tutorials [DEADLINE UPDATES]

Artem Polyakov artpol84 at gmail.com
Thu Apr 24 09:23:40 CDT 2025 

Dear colleagues!

We invite you to attend the 32nd IEEE Symposium on High-Performance
Interconnects,
Hot Interconnects (HotI’25) conference.
The conference will take place virtually from August 20 – 22, 2025

----------------------------------------------------------------
Submissions and Schedules
----------------------------------------------------------------

Call for Papers (https://urldefense.us/v3/__https://hoti.org/call-for-papers__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmOTBZ6GY$ )
Paper abstract due:   May 9, 2025
Submission deadline:  May 23, 2025
Notification:         June 27, 2025 (Previously: June 27, 2025)

Call for Tutorials (https://urldefense.us/v3/__https://hoti.org/call-for-tutorials.html__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmoXCWbMc$ )
Proposals due:  June 3, 2025 (Previously: May 27, 2025)
Notification:   June 10, 2025 (Previously: June 3, 2025)
Materials due:  August 2, 2025

----------------------------------------------------------------
Hot Interconnects conference
----------------------------------------------------------------

IEEE Hot Interconnects is the premier international forum for
researchers and developers of state-of-the-art hardware and
software architectures and implementations for
interconnection networks of all scales, ranging from multi-core,
on-chip interconnects to those within systems, clusters,
data centers, and clouds. This yearly conference is attended by
leaders in industry and academia.

----------------------------------------------------------------
HotI’25 Theme
----------------------------------------------------------------

** Interconnect Software: You can't touch it but you need it **

The latest advancements in photonics, chips, parallel paths, and other
cutting-edge
interconnect technologies are dazzling. However, the picture is incomplete
without
the system software needed to exploit their full potential.

This edition of Hot Interconnects will explore the underlying software
ecosystems
that empower interconnect fabrics to support a wide array of applications.

----------------------------------------------------------------
Confirmed Keynote Speakers
----------------------------------------------------------------

* Amin Vahdat: Vice President of ML, Systems, and Cloud AI at Google
* Deepak Bansal: Vice President and Technical Fellow in
  Azure Core Engineering organization at Microsoft

----------------------------------------------------------------
Topics of Interest
---------------------------------------------------------------

Contributions should focus on real experimental systems,
prototypes, or leading-edge products, and their performance
evaluation. We invite paper submissions across a wide range
of topics and levels, ranging from fundamentals to the latest
advances in hot topic areas, not particularly limited to the
following:
* Systems software for communication
* Novel and innovative interconnect architectures
* Accelerator interconnects, e.g., NVLINK, Infinity Fabric
* Network software/hardware designed for AI/ML workloads
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Chiplet-interconnect technologies such as UCIe and BOW
* Advanced chip-to-chip communication technologies
* Optical interconnects
* Protocol and interfaces for inter-processor communication
* Survivability and fault-tolerance of interconnects
* High-speed packet processing engines and network processors
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Pb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud & grid computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance interconnects
* Traffic characterization for HPC systems and commercial data centers
* Software-defined networking and software overlay networks
* Software for network bring-up, configuration, and performance management
  (OpenFlow, OpenSM)
* Data Center Networking

----------------------------------------------------------------
Best Paper Awards
----------------------------------------------------------------

High-impact papers will be considered for
* "Best Industry Paper" (primary author(s) from industry) and
* "Best Academic Paper" (primary author(s) from academia or
  non-profit research laboratories) categories.

2024 Hot Interconnects best papers:
* [Best Industry Paper]
  Unified Collective Communication (UCC): A Unified Library for CPU,
  GPU, and DPU Collectives
  (Ferrol Aderholdt, Manjunath Gorentla Venkata, Valentine Petrov,
   Sergey Lebedev, Devendar Bureddy, Joshua Ladd, Gil Bloch, Mike Dubman,
   and Gilad Shainer)
  [https://urldefense.us/v3/__https://ieeexplore.ieee.org/document/10664373__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmp97kxvY$ ]

* [Best Academic Paper]
  A New Mechanism to Identify Congesting Packets in High-Performance
  Interconnection Networks
  (Cristina Olmedilla, Jesus Escudero-Sahuquillo, Pedro Javier Garcia,
   Francisco J. Quiles, Wenhao Sun, Long Yan, Yunping Lyu, and Jose Duato)
   [https://urldefense.us/v3/__https://ieeexplore.ieee.org/document/10664227__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmAsV0P6o$ ]

----------------------------------------------------------------
Paper Format
----------------------------------------------------------------

This year we invite papers to be submitted either as regular (long) papers
(up to 10 pages) or as hot topic papers (up to 4 pages). Hot topic papers
could be positional papers, industry papers, or papers describing
hot-off-the-press breaking research results and will be judged accordingly
and independently from the regular papers.

* Papers need sufficient technical detail to judge quality and suitability
  for presentation. Submissions must conform to IEEE ethics standards:

https://urldefense.us/v3/__https://conferences.ieeeauthorcenter.ieee.org/author-ethics/guidelines-and-policies/submission-policies/__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmjCPT-Cw$ 
* Submissions should include title, author, abstract, and paper in
  double-column format; for details, see IEEE format description:
  https://urldefense.us/v3/__https://www.ieee.org/conferences/publishing/templates.html__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmQXw-FeQ$ 
* Papers will be submitted electronically through EasyChair (
https://urldefense.us/v3/__https://easychair.org/conferences?conf=hoti2025__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmnZF0NQ0$ )
  and will undergo a single-blind review process.
* Regular papers: up to 10 pages (including technical content and figures),
  excluding references and any appendices. Appendices (if any) are limited
  to 5 pages (the limit might be extended upon committee approval in
advance).
  Reproducibility appendices are encouraged, but no official verification is
  provided by the HotI program committee.
* Hot topic papers: up to 4 pages (including technical content and figures)
   excluding references. Appendices are not allowed for hot topic papers.
* Materials other than the abstract, main paper body, and references will
be read
   at the committee’s discretion.
* Accepted papers will be submitted for inclusion into IEEE Xplore, subject
to meeting
  IEEE Xplore’s scope and quality requirements. We plan to invite the best
papers for
  an IEEE Micro (https://urldefense.us/v3/__https://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=40__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmSjN-UfE$ 
)
  Special issue submission.
* After a paper is accepted, the authors must follow the conference and
IEEE CPS
  guidelines for publishing the paper:
  https://urldefense.us/v3/__https://www.computer.org/conferences/cps__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmRY5Hu6M$ 

----------------------------------------------------------------
Tutorials Submission Format
----------------------------------------------------------------
Submit a single PDF file with the following sections, each on a separate
page:

* Title page:
* Title
* Name, organization, and email of each author
* 200-word abstract
* (Optional) URL with samples of visual aids
* Tutorial content description (1 page max):
* Goals and takeaways
* Relevance to HOTI 2025 attendees
* Target audience
* Content level: beginner, intermediate, or advanced
* Previous presentations and differences
* Detailed outline (2 pages max)
* Resume/CV for each presenter (2 presenters max, 1 page each)
* Statement agreeing to release notes to HOTI 2025 attendees

----------------------------------------------------------------
Social media
----------------------------------------------------------------

To receive up-to-date information, follow us on social networks:
LinkedIn:   https://urldefense.us/v3/__https://www.linkedin.com/company/hot-interconnects/__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRm1ZLz7p8$ 
Twitter:      https://urldefense.us/v3/__https://twitter.com/IEEEHOTI__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRm2xzLhMY$ 
Facebook: https://urldefense.us/v3/__https://www.facebook.com/hoti.org__;!!G_uCfscf7eWS!ZCn-Zlnatpn8mcG3bSocUDkarsu2sb5BHX0jvZvfyl6FArQFSOfQu-3MLYupakXf7kxFNGvzq2aLwgRmAHK1EVs$ 

--
Best regards, HotI'25 Organizing Committee

More information about the hpc-announce mailing list