[hpc-announce] COOL Chips 28 - Call for Contributions

Ryohei KOBAYASHI kobayashi at scrc.iir.isct.ac.jp
Fri Nov 8 00:47:58 CST 2024


---------------------------------------------------------------------------
        IEEE Symposium on Low-Power and High-Speed Chips and Systems,
                                COOL Chips 28

              Takeda Hall, The University of Tokyo, Tokyo, Japan

                             April 16 - 18, 2024
                          https://urldefense.us/v3/__https://www.coolchips.org__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1Gq-pI40$ 

                           CALL FOR CONTRIBUTIONS
---------------------------------------------------------------------------

* Submission site: https://urldefense.us/v3/__https://easychair.org/conferences/?conf=coolchips28__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1OuXCflU$ 

* Author Schedule for Technical Papers:
   - Feb.  7, 2025: Paper / Extended Abstract Submission (Web site)
   - Mar. 14, 2025: Acceptance Notified (by e-mail)
   - Mar. 28, 2025: Final Manuscript Submission

* Author Schedule for Posters:
   - Mar. 21, 2025: Poster Abstract Submission (Web site)
   - Mar. 24, 2025: Poster Acceptance Notified (by e-mail)

---------------------------------------------------------------------------

COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems.
The symposium covers leading-edge technologies in all areas of
microprocessors and their applications.
The COOL Chips 28 is to be held in Tokyo on April 16-18, 2025,
and is targeted at the architecture, design and implementation of chips
with special emphasis on the areas listed below.
All papers are published online via IEEE Xplore.
Especially, selected papers are encouraged to submit to the IEEE Micro
(https://urldefense.us/v3/__https://publications.computer.org/micro/__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1wIPEYqc$ ) and the special section
in the IEICE Transactions on Electronics
(https://urldefense.us/v3/__https://search.ieice.org/bin/index.php?category=C&lang=E__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1W7qi0Po$ ).

Contributions are solicited in the following areas:

   - *Low Power-High Performance Processors* for AI, IoT, Multimedia,
     Digital Consumer Electronics, Mobile, Graphics, Encryption,
     Robotics, Automotive, Networking, Medical, Healthcare, and
     Biometrics.

   - *Novel Architectures and Schemes* for Single Core, Multi/Many-Core,
     NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
     Dependable Computing, GALS and 3D Integration.

   - *Cool Software* including Parallel Schedulers, Embedded Real-time
     Operating System, Binary Translations, Compiler Issues and Low
     Power Application Techniques.

Proposals should consist of a title, the name, job title, address, phone number and e-mail address of the presenter in a full paper format (6 pages) or an extended abstract format (up to 3pages) describing the product or topic to be presented. The status of the product or topic should precisely be described. Proposals will be selected by the program committee’s evaluation of interest to the audience. Submission should be made through website. Detailed instructions are in author's kit obtained from our Web-site.

Please prepare the proposal using the given guidelines and template
(See: https://urldefense.us/v3/__https://www.coolchips.org/2025/call-for-contributions/__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1TRaU3Rk$ ).

Submission should be made through website:
https://urldefense.us/v3/__https://easychair.org/conferences/?conf=coolchips28__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1OuXCflU$ 


---------------------------------------------------------------------------

Program Committee:

-Chairs:
     Ryusuke Egawa (Tokyo Denki Univ.)
     Yasutaka Wada (Meisei Univ.)

-Vice Chair:
     Ryohei Kobayashi (Science Tokyo)
     Ryuichi Sakamoto (Science Tokyo)

-Poster Chair:
     Koji Hashimoto (Fukuoka Univ.)

-Special Session Chair:
     Jun Shiomi (Osaka Univ.)

-Members:
     Masaki Gondo (eSOL)
     Teppei Hirotsu (DENSO)
     Megumi Ito (IBM Research – Tokyo)
     Tatsuya Kaneko (Hokkaido Univ.)
     Koyo Nitta (Univ. of Aizu)
     Naoya Niwa (Tokyo Univ. of Agriculture and Tech.)
     Tetsuya Odajima (Fujitsu)
     Takeshi Ohkawa (Kumamoto Univ.)
     Hiroki Ohtsuji (Fujitsu Lab.)
     Yasunori Osana (Kumamoto Univ.)
     Hafizur Rahman (King Faisal Univ.)
     Yukihiro Sasagawa (Socionext)
     Masayuki Sato (Tohoku Univ.)
     Yuichiro Shibata (Nagasaki Univ.)
     Kotaro Shimamura (Hitachi)
     Jubee Tada (Yamagata Univ.)
     Hiroyuki Takizawa (Tohoku Univ.)
     Tomoaki Tsumura (Nagoya Institute of Techn.)
     Toshiyuki Tsutsumi (Meiji Univ.)
     Tomohiro Ueno (RIKEN)
     Hayato Yamaki (Univ. of Electro-Communications)
     Renyuan Zhang (NAIST)

---------------------------------------------------------------------------

-- 
Ryohei KOBAYASHI
Supercomputing Research Center
Institute of Integrated Research
Institute of Science Tokyo
E-mail: kobayashi at scrc.iir.isct.ac.jp
URL: https://urldefense.us/v3/__https://www.ac2.scrc.iir.isct.ac.jp/__;!!G_uCfscf7eWS!bQhk6T0dnwXFLaO5TKM17cd5pDKB9mL3hVf8-VJ_Fr6WtmjkNNh8OUVmSJiSEmzHXFv-a4SNInsj5vKOplXjVjf7MIU1QoAn8sk$ 



More information about the hpc-announce mailing list