[hpc-announce] CFP 4th ReWorDS workshop eScience Osaka July 8 deadline
Lofstead, Jay F
gflofst at sandia.gov
Tue Jun 11 19:16:03 CDT 2024
Submission Deadline (firm): July 8, 20204, AoE
Responses to Authors: August 7, 2024
Camera Ready due: August 12, 2024
Call for Papers for the 4th ReWorDS Workshop at eScience 2024
This workshop seeks to explore ideas and experiences on what kinds of infrastructure developments can improve upon the state of the art. Explorations of component packaging via containers and virtual machines, automation scripting, deployment, portability builds, and system support for these and other relevant activities are key infrastructure. Provenance collection, exploration, and tracking are key for a well-documented scientific output. Using existing systems to achieve these goals via experiences is important for developing best practices that span application domains. Data privacy techniques such as multi-party encryption and differential privacy are important as well. Issues with managing large data sets and workflow intermediate data, particularly those intended to manage publicly accessed data for use and reuse are encouraged. New techniques and technologies that address reproducibility requirements are also requested. We seek work on all of these, and related, topics as well as position and experience papers looking to drive the conversation for practitioners and researchers in these spaces.
This workshop contributes by sharing experiences and exploring the various technological infrastructure needs to support effective, convenient workflow systems and application composition structures and approaches across a broad spectrum of HPC environments from clusters to supercomputers to cloud systems.
Papers should be formatted in IEEE format following eScience formatting rules and can be 6 pages not including references.
https://urldefense.us/v3/__https://easychair.org/conferences2/submissions?a=32847117__;!!G_uCfscf7eWS!byNU8SeqQSrOmtRx7Gw7nfYDbzb-JLxEYXPe4kK9MM9a1v41qPdcEhKJ5U3Wp5bY8yepYXfrjg9uhZ3eRnCubtQJXg$
More information about the hpc-announce
mailing list