[hpc-announce] Call for Papers: Thirty-Third IEEE Heterogeneity in Computing Workshop (HCW)
Hari Subramoni
subramoni.1 at osu.edu
Mon Jan 8 20:46:54 CST 2024
========================================================================
Call For Papers
Thirty-Third IEEE Heterogeneity in Computing Workshop (HCW)
to be held in conjunction with
IPDPS 2024, May 27, 2024
San Francisco, California
https://hcw-ipdps.org/
========================================================================
In conjunction with the 38th IEEE International Parallel and
Distributed Processing Symposium (IPDPS 2024)
Sponsored by the IEEE Computer Society through the Technical
Committee on Parallel Processing (TCPP)
Most modern computing systems are heterogeneous, either for
organic reasons because components grew independently, as it
is the case in desktop grids, or by design to leverage the
strength of specific hardware, as it is the case in
accelerated systems. In any case, all computing systems have
some form of hardware or software heterogeneity that must be
managed, leveraged, understood, and exploited. The
Heterogeneity in Computing Workshop (HCW) is a venue to
discuss and innovate in all theoretical and practical
aspects of heterogeneous computing: design, programmability,
efficient utilization, algorithms, modeling, applications,
etc. HCW 2024 will be the thirty-third annual gathering of
this workshop.
Topics
------
Topics of interest include but are not limited to the following areas:
* Heterogeneous multicore systems and architectures: Design,
exploration, and experimental analysis of heterogeneous
computing systems such as Graphics Processing Units,
heterogeneous systems-on-chip, Artificial Intelligence
chips, Field Programmable Gate Arrays, big.LITTLE, and
application-specific architectures.
* Heterogeneous parallel and distributed systems: Design and
analysis of computing grids, cloud systems, hybrid clusters,
datacenters, geo-distributed computing systems, and
supercomputers.
* Deep memory hierarchies: Design and analysis of memory
hierarchies with SRAM, DRAM, Flash/SSD, and HDD
technologies; NUMA architectures; cache coherence
strategies; novel memory systems such as phase-change RAM,
magnetic (e.g., STT) RAM, 3D Xpoint/crossbars, and
memristors.
* On-chip, off-chip, and heterogeneous network architectures:
Network-on-chip (NoC) architectures and protocols for
heterogeneous multicore applications; energy, latency,
reliability, and security optimizations for NoCs; off-chip
(chip-to-chip) network architectures and optimizations;
heterogeneous networks (combination of NoC and off-chip)
design, evaluation, and optimizations; large-scale parallel
and distributed heterogeneous network design, evaluation,
and optimizations.
* Programming models and tools: Programming paradigms and
tools for heterogeneous systems; middleware and runtime
systems; performance-abstraction tradeoff; interoperability
of heterogeneous software environments; workflows;
dataflows.
* Resource management and algorithms for heterogeneous
systems: Parallel algorithms for solving problems on
heterogeneous systems (e.g., multicores, hybrid clusters,
grids, or clouds); strategies for scheduling and allocation
on heterogeneous 2D and 3D multicore architectures; static
and dynamic scheduling and resource management for
large-scale and parallel heterogeneous systems.
* Modeling, characterization, and optimizations: Performance
models and their use in the design of parallel and
distributed algorithms for heterogeneous platforms;
characterizations and optimizations for improving the time
to solve a problem (e.g., throughput, latency, runtime);
modeling and optimizing electricity consumption (e.g.,
power, energy); modeling for failure management (e.g., fault
tolerance, recovery, reliability); modeling for security in
heterogeneous platforms.
* Applications on heterogeneous systems: Case studies;
the confluence of Big Data systems and heterogeneous systems;
data-intensive computing; scientific computing.
This year we wish to focus on and expand submissions and
presentations in the following “hot topics” areas; therefore,
we especially invite submissions in the following three areas:
* Heterogeneous Integration of Quantum Computing: Design,
exploration, and analysis of architectures and software
frameworks enabling heterogeneous integration of classical
computing and quantum computing (e.g., heterogeneous quantum
computers, error correction, and heterogeneous applications that
use both classical and quantum logic, benchmarks for
heterogeneous quantum computers).
* Heterogeneity and Interoperability in Software & Data
Systems: Design, exploration, and analysis of architectures
and software frameworks for interoperability in software and
data systems (e.g., semantic frameworks, interoperability
for heterogeneous Internet-of-Things systems, model-driven
frameworks).
* Heterogeneous Computing for Machine Learning (ML) and Deep
Learning (DL): Design, exploration, benchmarking, and
analysis of accelerators and software frameworks for ML and
DL applications on heterogeneous computing systems.
Important Dates
---------------
Abstract submission (required): January 22, 2024
Full paper submission: January 29, 2024
Author notification: February 19, 2024
Camera-ready submission: February 29, 2024
Paper Submissions
-----------------
Manuscripts submitted to HCW 2024 should not have been
previously published or be under review for a different
workshop, conference, or journal.
Submissions must use the latest IEEE manuscript templates
for conference proceedings. Submissions may not exceed a
total of ten single-spaced double-column pages using
10-point size font on 8.5×11 inch pages. The page limit
includes figures, tables, and references. A single-blind
review process will be followed.
Files should be submitted by following the instructions at
the IPDPS 2024 submission site.
It is required that all accepted papers will be presented at
the workshop by one of the authors.
Workshop Organization
---------------------
General Co-Chairs: Anne C. Elster (elster at ntnu dot no)
and Jan Christian Meyer (jan dot christian dot meyer at ntnu
dot no), Norwegian University of Science and Technology,
Norway
Technical Program Committee Co-Chairs: D. K. Panda (panda.2
at osu dot edu) and Hari Subramoni (subramoni.1 at osu dot
edu), The Ohio State University, USA
Contact Persons: Please contact the General Co-Chairs or the
Technical Program Committee Co-Chairs.
Technical Program Committee (Confirmed so far)
---------------------------
Shashank Adavally, Micron Technology, USA
Gonzalo Brito Gadeschi, NVIDIA Corporation, Germany
Nick Brown, Edinburgh Parallel Computing Centre (EPCC), University of
Edinburgh, UK
Mattan Erez, University of Texas, USA
Richard Graham, NVIDIA Corporation, USA
Yanfei Guo, Argonne National Laboratory, USA
Diana Göhringer, Technical University Dresden, Germany
H. Peter Hofstee, Distinguished Research Staff Member, IBM, USA
Emmanuel Jeannot, INRIA/University of Bordeaux, France
Joanna Kolodziej, Cracow University of Technology/NASK National Research
Institute, Poland
Hatem Ltaief, King Abdullah University of Science and Technology (KAUST),
Saudi Arabia
Pankaj Mehra, Elephance Memory, Inc.;/University of California at Santa
Cruz, USA
Raymond Namyst, INRIA/University of Bordeaux, France
Marko Scrbak, AMD, USA
Aamir Shafi, The Ohio State University, USA
Sameer Shende, University of Oregon, USA
Devesh Tiwari, Northeastern University, USA
Steering Committee
------------------
Kamesh Madduri, Pennsylvania State University, USA (Co-Chair)
Behrooz Shirazi, Washington State University, USA (Co-Chair)
H. J. Siegel, Colorado State University, USA (Past Chair)
John Antonio, University of Oklahoma, USA
David Bader, New Jersey Institute of Technology, USA
Anne Benoit, École Normale Supérieure de Lyon, France
Jack Dongarra, University of Tennessee, USA
Alexey Lastovetsky, University College Dublin, UK
Sudeep Pasricha, Colorado State University, USA
Viktor K. Prasanna, University of Southern California, USA
Yves Robert, École Normale Supérieure de Lyon, France
Erik Saule, University of North Carolina at Charlotte, USA
Uwe Schwiegelshohn, TU Dortmund University, Germany
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