[hpc-announce] Registration is open: IEEE Hot Interconnects 2024

Artem Polyakov artpol84 at gmail.com
Tue Aug 6 11:48:04 CDT 2024 

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!!! Important Announcement – Registration Open – it’s FREE !!!
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We invite you to attend the 31st IEEE Symposium
on High-Performance Interconnects,
Hot Interconnects (HotI 2024) conference.

The conference will take place virtually from August 21 – 23, 2024

REGISTRATION LINK: https://urldefense.us/v3/__https://hoti.org/registration/__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_l5wlwnNM$ 

! REGISTRATION IS FREE !

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Hot Interconnects conference
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IEEE Hot Interconnects is the premier international forum for
researchers and developers of state-of-the-art hardware and
software architectures and implementations for
interconnection networks of all scales, ranging from multi-core,
on-chip interconnects to those within systems, clusters,
data centers, and clouds. This yearly conference is attended by
leaders in industry and academia.

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HotI 2024 Theme
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** Can Interconnects Keep up With AI? **

The explosion of AI and workloads related to machine learning and
deep learning boggles the mind. Whether in massive data centers,
edge locations, automobiles, or consumer appliances, AI stands
to improve many tasks useful to people at work or at leisure.
The demand for GPUs, DPUs, TPUs, and IPUs taxes the ability of
their manufacturers to meet the market demand. Efficient utilization
of these xPUs requires high-speed and highly scalable interconnects.
Whether between xPUs or between an xPU and memory, data transfer
can easily become a bottleneck in computing efficiency.

In this edition of IEEE Hot Interconnects, we explore advances
in interconnection networks that alleviate this bottleneck. Solutions
including optical circuit switching, dense photonic data paths,
high-performance fabrics, and more will expand from the specialized
applications of HPC to the pervasive applications of AI and in the
process will become more affordable. This year’s HotI will thus be
captivatingly relevant.

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Advanced Program (https://urldefense.us/v3/__https://hoti.org/program-2/__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_lqUPU78k$ )
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Day 1: 21st Aug
08:50 - Introduction and Welcome
09:00 - Technical Paper Session A: Networks for Large Language Models
      * Rail-Only Network for Hyperscale Large Language Model Training
            Weiyang Wang, Manya Ghobadi, Kayvon Shakeri, Ying Zhang
and Naader Hasani
      * Characterizing Communication in Distributed
Parameter-Efficient-Fine-Tuning for Large Language Models
            Nawras Alnaasan, Horng-Ruey Huang, Aamir Shafi, Hari
Subramoni and Dhabaleswar K. Panda
10:00 - Keynote: Keeping Pace: Micro-Models, Large Language Models,
and the Co-Evolution of Chip and Data Center Design in a Rapidly
Shifting AI Landscape
            Speaker: Mark Baciak (CTO, NeuralFabric)
11:00 - Platinum Sponsor Talk – Eliyan
11:15 – Break
11:25 - Technical Paper Session B: Interconnection Network
      * Quality-of-Service Provision for BXI3-based Interconnection Networks
            Miguel Sánchez de la Rosa, Gabriel Gabriel Gomez-Lopez,
Francisco J. Andújar, Jesús Escudero-Sahuquillo, José L. Sánchez,
Francisco J. Alfaro and Pierre-Axel Lagadec
      * A new Mechanism to Identify Congesting Packets in
High-Performance Interconnection Networks
            Cristina Olmedilla, Jesus Escudero-Sahuquillo, Pedro
Javier Garcia, Francisco J. Quiles, Wenhao Sun, Long Yan, Yunping Lyu
and Jose Duato
12:15 – Lunch
13:00 - Keynote: Connectivity for AI Everywhere: The Role of Chiplets
            Speaker: Tony Chan Carusone (CTO, Alphawave semi)
14:00 - Panel: Bandwidth Scaling for AI Interconnect – More
Wavelengths vs More Fiber?
            Moderator: Dr. Katharine Schmidtke
            Panelists: Dr. Dan Kuchta (IBM Research), Dr. Peter Winzer
(Nubis Communications), Dr. Rebecca Schaevitz (MixxTech, Inc), Dr.
Amit Nagra (Intel), Dr. Alan Liu (Quintessent Inc.), Dr. Bardia
Pezeshki (Avicena Tech)

Day 2: 22nd Aug
09:00 - Day 2 Welcome
09:10 - Technical Paper Session C: Collectives for Deep Learning
      * Towards a Standardized Representation for Deep Learning
Collective Algorithms
            Jinsun Yoo, William Won, Meghan Cowan, Nan Jiang, Benjamin
Klenk, Srinivas Sridharan and Tushar Krishna
      * Unified Collective Communication (UCC): An Unified Library for
CPU, GPU, and DPU Collectives
            Ferrol Aderholdt, Manjunath Gorentla Venkata, Valentine
Petrov, Sergey Lebedev, Devendar Bureddy, Joshua Ladd, Gil Bloch, Mike
Dubman and Gilad Shainer
10:00 - Keynote: Powering Llama 3: A Sneak-peek into Meta’s Massive
Infrastructure for Generative AI
            Speaker: Pavan Balaji (Meta)
11:00 - Gold Sponsor Talks
            Arista
            GigaIO
11:20 - Break
11:30 - Invited Talk: “Can Interconnects Keep up with AI? YES.”
            Speaker: Andy Bechtolsheim (Arista)
12:00 - Lunch
13:00 - Technical Paper Session D: Optimizing Collective Operations
      * OHIO: Improving RDMA Network Scalability in MPI_Alltoall
through Optimized Hierarchical and Intra/Inter-Node Communication
Overlap Design
            Tu Tran, Goutham Kalikrishna Reddy Kuncham, Bharath
Ramesh, Shulei Xu, Hari Subramoni, Mustafa Abduljabbar and Dhabaleswar
K. Panda
      * Demystifying the Communication Characteristics for Distributed
Transformer Models
            Quentin Anthony, Benjamin Michalowicz, Jacob Hatef, Lang
Xu, Mustafa Abduljabbar, Aamir Shafi, Hari Subramoni and Dhabaleswar
Panda
14:00 - Silver Sponsor talks
           Nutanix
            Lenovo
14:10 - Break
14:20 - Invited Talk: Standardizing Interconnect Test and Repair:
Motivation and On-Going Effort
            Speaker: Sreejit Chakraverty (Ampere Computing)
15:15 - HOTI Closing Remarks

Day 3: 23rd Aug
Tutorials Track 1-
08:00 - Linear Electro-Optical Interface: Standardization, Design
Principles & Silicon Correlation
            Priyank Shukla and Ruben Sousa (Synopsis)
10:00 - OFI Libfabric, APIs for MPI & CCL
            Rajalaxmi Angadi, Juee Himalbhai Desai, and Peinan Zhang (Intel)
11:30 - Lunch
12:30 - Chip-let Interconnect Test and Repair
      Sreejit Chakravarty
15:00 - ASTRA-sim and Chakra: Enabling Software-Hardware Co-design
Exploration for Distributed Machine Learning Platforms
      Tushar Krishna and William Won (Georgia Tech)

Tutorials Track 2-
08:00 - High-Performance and Smart Networking Technologies for HPC and AI
            Dhabaleswar K. (DK) Panda and Hari Subramoni
10:45 - Short Break
11:00 - Leveraging SmartNICs for HPC and Data Center Applications
            Jeffrey Young, Rich Graham, Oscar Hernandez, Antonio Peña,
and Richard Vuduc
13:45 - Short Break
14:00 - Principles and Practice of Scalable and Distributed Deep
Neural Networks Training and Inference
            Dhabaleswar K. (DK) Panda, Hari Subramoni, Aamir Shafi,
and Nawras Alnaasan

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Financial Sponsorship
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Hot Interconnects is 100% financially sponsored by the Technical Committee for
Microprocessors and Microcomputers (TCMM) of the IEEE Computer Society.

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Sister Conferences
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Hot Chips:                                         https://urldefense.us/v3/__https://hotchips.org/__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_lUAYJ1aA$ 
Cool Chips:                                       https://urldefense.us/v3/__http://www.coolchips.org/__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_la_ZvWHU$ 
Multi-Core Systems-on-Chip:                https://urldefense.us/v3/__https://mcsoc-forum.org/__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_lzX6XQqU$ 

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Social media
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Twitter: https://urldefense.us/v3/__https://twitter.com/IEEEHOTI__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_lKCwszCs$ 
Facebook: https://urldefense.us/v3/__https://www.facebook.com/hoti.org__;!!G_uCfscf7eWS!dhdvLbQhJSc6pozcBqoQMCpUPHy6dUsnJNcW5rU0qbpHH5TJfhY94tZ3balzOVEipCLhkPHFXv-PID_lcnYBwPs$ 

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Contacts
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Send questions relating to the conference operation to the General Chair
Matthew Dosanjh and to the Vice-Chair,  Artem Polyakov at: info at hoti.org


Send questions relating to the program to the Technical Program Co-Chairs
Rohit Zambre and Sayan Ghosh at: program at hoti.org

Send questions relating to the tutorials to the Tutorial Chairs
Amanda Bienz and David Ozog at: tutorials at hoti.org

Sponsor Hot Interconnects for 2024!
Raj Channa at : sponsor at hoti.org

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С Уважением, Поляков Артем Юрьевич
Best regards, Artem Y. Polyakov

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