[hpc-announce] Call for Paper - IEEE Cybermatics Congress 2024 (Includes IEEE Blockchain 2024, IEEE iThings 2024, IEEE CPSCom 2024, IEEE GreenCom 2024 and IEEE SmartData 2024) Copenhagen, Denmark, August 19-22, 2024
Rui Jin
ruij.zui at gmail.com
Tue Apr 16 21:44:50 CDT 2024
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Call for Paper - IEEE Cybermatics Congress 2024 (Includes IEEE Blockchain
2024, IEEE iThings 2024, IEEE CPSCom 2024, IEEE GreenCom 2024 and IEEE
SmartData 2024)
Copenhagen, Denmark, August 19-22, 2024
Website: https://urldefense.us/v3/__https://ieee-cybermatics.org/2024__;!!G_uCfscf7eWS!Y_MCPv4mQSjn1iruO_1PTBgpiQiEf5nuR1STJuSaZRzuE5KVRP8RFJ4bQlEzJSe4oHsZNQHznozBKozXO02OXM4$
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- * Overview * -
The 2024 IEEE Cybermatics Congress is held in Copenhagen, Denmark, August
19-22, 2024. Advances in computers, information and networks is bringing a
digital cyber world to our daily lives. Numerous digital things or cyber
entities are generated and will reside in the cyber components, to have a
cyber existence in cyber world. Cyberization is an emerging trend forming
the new cyber world and reforming conventional worlds towards cyber-enabled
hyper worlds. Cybermatics is to build systematic knowledge about new
phenomena, behaviors, properties and practices in cyberspace, cyberization
and cyber-enabled hyper-worlds. Cybermatics is characterized by not only
catching up with the human intelligence (e.g., Intelligent sensing, making
decision and control, etc), but also learn from the nature-inspired
attributes (e.g., dynamics, self-adaptability, energy-saving).
The IEEE Cybermatics Congress originated from the 2013 World Cybermatics
Congress (Beijing, China). Cybermatics 2024 is the continuation after the
success of Cybermatics 2023 in Ocean Flower Island, Cybermatics 2022 in
Finland, Cybermatics 2021 in Australia, Cybermatics 2020 in Greece,
Cybermatics 2019 in Atlanta, Cybermatics 2018 in Halifax, Cybermatics 2017
in Exeter, Cybermatics 2016 in Chengdu, Cyermatics 2015 in Sydney, and
Cybermatics 2014 in Taipei. IEEE Cybermatics 2024 aims to provide to
high-profile platform for researchers and engineers to exchange and explore
state-of-art innovations in cyber technology and their applications in
physical, social and mental worlds.
- * Important Dates * -
* Paper Submission Deadline: May 1, 2024 (Firm)
* Author Notification: May 20, 2024
* Camera-ready and Registration: June 15, 2024
* Conference Date: August 19-22, 2024
- * Scope and Interests * -
The technological trends in HPC system evolution indicates an increasing
burden placed on application developers due to the management of the
unprecedented complexity levels of hardware and its associated performance
characteristics. Many existing scientific applications codes are unlikely
to perform well on future systems without major modifications or even
complete rewrites. In the future, it will be necessary to utilize, in
concert, many characteristics such as multiple levels of parallelism, many
lightweight cores, complex memory hierarchies, novel I/O technology, power
capping, system-wide temporal/spatial performance heterogeneity and
reliability concerns. The parallel and distributed computing (PDC)
community has developed new programming models, algorithms, libraries and
tools to meet these challenges in order to accommodate productive code
development and effective system use. However, the scientific application
community still needs to identify the benefit through practical evaluations.
Thus, the focus of this workshop is on methodologies and experiences used
in scientific and engineering applications and algorithms to achieve
sustainable code development for better productivity, application
performance and reliability. In particular, we will focus on the following
topics in parallel and distributed scientific and engineering applications,
and not limited to:
* Big Scientific Data
* Performance modeling and simulation for the execution of scalable
scientific applications on new heterogeneous architectures.
* Graph analytics with their (scientific) applications
* Code modernization methodologies and experiences for adapting the changes
in future computing systems.
* Languages for scientific computing on hybrid systems. (e.g., Python,
MPI+X where X is OpenMP, OpenCL, CUDA etc.)
* Tools and techniques for improving the performance, reliability and
resilience if scientific applications.
* Use cases of enterprise distributed computing technology (Such as
MapReduce, Data Analytics and Machine-learning tools) in scientific and
engineering applications.
* Scalable parallel and distributed algorithms supporting science and
engineering applications.
* Performance portability across heterogeneous architecture.
- * Paper Submission Guidelines * -
All papers must be submitted electronically and in PDF format. The material
presented should be original and not published or under submission
elsewhere. Authors should submit eitherfull papers of up to 10 pages, or
short papers fo up to 4 pages, following strictly the IEEE Computer Society
Proceedings Manuscript style, using two-column, single-space format, with
10-point font size. Figures and references must be included in the page
limit. Oversized papers will be automatically rejected by the PC chairs. At
least one of the authors of each accepted paper must register early to
attend the conference, in order for the paper to appear in the conference
proceedings.
- * Five Conferences under the Congress * -
The 7th IEEE International Conference on Blockchain (Blockchain 2024)
The 10th IEEE International Conference on Smart Data (SmartData 2024)
The 17th IEEE International Conference on Cyber, Physical and Social
Computing (CPSCom 2024)
The 17th IEEE International Conference on Internet of Things (iThings 2024)
The 20th IEEE International Conference on Green Computing and
Communications (GreenCom 2024)
- * Organising Committee * -
General Chairs:
Weizhi Meng, Technical University of Denmark, Denmark
Chonggang Wang, InterDigital Inc., USA
Hironori Washizaki, Waseda University, Japan
Schahram Dustdar, TU Wien, Austria
Program Chairs:
Vincenzo Piuri, Universita' degli Studi di Milano, Italy
Mianxiong Dong, Muroran Institute of Technology, Japan
Man Lin, St. Francis Xavier University, Canada
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