[hpc-announce] COOL Chips 27 - Call for Contributions

[Ryohei KOBAYASHI]

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        IEEE Symposium on Low-Power and High-Speed Chips and Systems,
                                COOL Chips 27

              Takeda Hall, The University of Tokyo, Tokyo, Japan

                             April 17 - 19, 2024
                          http://www.coolchips.org

                           CALL FOR CONTRIBUTIONS
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* Submission site: https://easychair.org/conferences/?conf=coolchips27

* Author Schedule for Technical Papers:
   - Feb. 27, 2024: Paper / Extended Abstract Submission (Web site)
   - Mar. 15, 2024: Acceptance Notified (by e-mail)
   - Mar. 29, 2024: Final Manuscript Submission

* Author Schedule for Posters:
   - Mar. 22, 2024: Poster Abstract Submission (Web site)
   - Mar. 25, 2024: Poster Acceptance Notified (by e-mail)

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COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems.
The symposium covers leading-edge technologies in all areas of
microprocessors and their applications.
The COOL Chips 27 is to be held in Tokyo on April 17-19, 2024,
and is targeted at the architecture, design and implementation of chips
with special emphasis on the areas listed below.
All papers are published online via IEEE Xplore.
Especially, selected papers are encouraged to submit to the IEEE Micro
(https://publications.computer.org/micro/) and the special section
in the IEICE Transactions on Electronics
(https://search.ieice.org/bin/index.php?category=C&lang=E).

Contributions are solicited in the following areas:

   - *Low Power-High Performance Processors* for AI, IoT, Multimedia,
     Digital Consumer Electronics, Mobile, Graphics, Encryption,
     Robotics, Automotive, Networking, Medical, Healthcare, and
     Biometrics.

   - *Novel Architectures and Schemes* for Single Core, Multi/Many-Core,
     NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
     Dependable Computing, GALS and 3D Integration.

   - *Cool Software* including Parallel Schedulers, Embedded Real-time
     Operating System, Binary Translations, Compiler Issues and Low
     Power Application Techniques.

Proposals should should be organized in a full paper format (6 pages)
or an extended abstract format (up to 3 pages) describing the topic
to be presented. If the proposal is a not-yet-announced product,
and you would like to keep the submission confidential,
please indicate it. We will do our best to maintain confidentiality.
Proposals will be selected by the program committee's evaluation
of interest to the audience.

Please prepare the proposal using the given guidelines and template
(See: https://www.coolchips.org/2024/call-for-contributions/).

Submission should be made through website:
https://easychair.org/conferences/?conf=coolchips27


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Program Committee:

-Chairs:
     Ryusuke Egawa (Tokyo Denki Univ.)
     Yasutaka Wada (Meisei Univ.)

-Vice Chair:
     Ryohei Kobayashi (Univ. of Tsukuba)
     Ryuichi Sakamoto (Tokyo Tech.)

-Poster Chair:
     Koji Hashimoto (Fukuoka Univ.)

-Special Session Chair:
     Jun Shiomi (Osaka Univ.)

-Members:
     Masaki Gondo (eSOL)
     Koji Hashimoto (Fukuoka Univ.)
     Teppei Hirotsu (NSITEXE)
     Megumi Ito (IBM Research – Tokyo)
     Tetsuya Odajima (Fujitsu)
     Takeshi Ohkawa (Kumamoto Univ.)
     Hiroki Ohtsuji (Fujitsu Lab.)
     Yasunori Osana (Kumamoto Univ.)
     MM Hafizur Rahman (King Faisal Univ.)
     Yukihiro Sasagawa (Socionext)
     Yuichiro Shibata (Nagasaki Univ.)
     Kotaro Shimamura (Hitachi)
     Jubee Tada (Yamagata Univ.)
     Shinya Takamaeda-Yamazaki (Univ. of Tokyo)
     Hiroyuki Takizawa (Tohoku Univ.)
     Tomoaki Tsumura (Nagoya Institute of Tech.)
     Toshiyuki Tsutsumi (Meiji Univ.)
     Tomohiro Ueno (RIKEN)
     Hiroshi Yamada (Tokyo Univ. of Agriculture and Tech.)
     Hayato Yamaki (Univ. of Electro-Communications)
     Renyuan Zhang (NAIST)
     Masayuki Sato (Tohoku Univ.)

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-- 
Ryohei KOBAYASHI
University of Tsukuba
Center for Computational Sciences
E-mail: kobayashi at cs.tsukuba.ac.jp