[hpc-announce] Call for Papers-The 10th IEEE International Conference on Dependable Systems and Their Applications

[clarkep]

DSA 2023

The 10th IEEE International Conference on Dependable Systems and Their 
Applications

http://dsa.techconf.org

August 10-11, 2023
Waseda University, Tokyo, Japan

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Important Dates
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May 05, 2023:     Regular & Short papers
May 15, 2023:     Workshop Papers
June 01, 2023:     Fast Abstract
June 01, 2023:     Industry Track
July 01, 2023:     Author Notification

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Best Paper Award
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At least one Best Paper Award will be presented.

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Topics of Interest
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* Algorithms, Architecture, Framework, Design Patterns, and
    Maintenance for Dependable Systems and Software
* Security, Threats, Privacy, Safety, and Risk Management
* Dependability and Reliability Modelling and Measurement
* Fault Tolerance, Survivability, Resilience, and Availability
* Metrics, Measurement, and Quality Assessment
* Requirements, Process, Standards, Productivity, and Project Management
* Quality Assurance, Maintenance, Reverse Engineering, and Re-Engineering
* Verification, Validation, Testing, Analysis, Debugging,
    Model Checking, and Program Repair
* Formal Methods and Theories
* Communication, Networking, Optimization, and Performance
* Pervasive, Ubiquitous, Service-Oriented, and Cloud Computing
* Collaborative, Distributed, Embedded, Real-Time, High Performance,
    Highly Dependable, Intelligent, Multimedia Systems
* Big Data and Storage
* Prognostics and Health Management
* IoT, Supply Chain, Cyber-Physical Systems, Industry 4.0, and Smart City
* Empirical Studies, Benchmarking, and Industrial Best Practices
* Applications and Tools and Automation
* Approaching Artificial Creativity

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Conference Proceedings
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The proceedings will be published by IEEE Conference Publishing
Services. Accepted papers will also be submitted for inclusion into
the IEEE Xplore and to other abstracting and indexing partners
such as the Ei Compendex.

Submission page: https://dsa23.techconf.org/submission

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SCI Journal Publication
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Papers of top quality will be invited to submit their extended versions
to a special issue of a selected SCI journal.

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Organizing Committee
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General Chairs:
Professor Hironori Washizaki, Waseda University, Japan
Professor Gordon Fraser, University of Passau, Germany

Program Chairs
Professor Rui Maranhão, University of Porto, Portugal
Professor Ying Qian, Chongqing University of Posts and 
Telecommunications, China

https://dsa23.techconf.org/committee/organizing
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General Inquiries
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For more details and updated information, please refer to
http://dsa.techconf.org, or send emails to dxl170030 at utdallas.edu