[hpc-announce] CfP CASES 2023: Int. Conf. on Compilers, Architectures, and Synthesis for Embedded Systems

Lars Bauer lars.bauer at kit.edu
Thu Feb 16 11:23:56 CST 2023

                                 CASES 2023
                              Call for Papers
                        International Conference on
       Compilers, Architectures, and Synthesis for Embedded Systems
                  Hamburg, Germany, September 17-22, 2023

CASES is a premier forum, where researchers, developers, and
practitioners exchange information on the latest advances in design,
optimization, validation, and applications of embedded systems, Internet
of Things (IoT), and the emergent trend of integrating Artificial
Intelligence into IoT (AIoT). The conference has a long tradition of
showcasing cutting-edge research in these broad areas, covering topics
including, but not limited to, hardware-software co-design and co-
validation, edge AI, embedded architecture, memory/storage technology,
security/reliability, energy-efficiency of embedded systems, and domain-
specific hardware accelerators. We solicit submission of original
research articles on these topics divided into five technical tracks.
Each submission needs to specify one primary and one secondary track
relevant to the paper’s technical content.


Journal Track:
- Abstract Submission: March 16, 2023 (AoE)
- Full Paper Submission: March 23, 2023 (AoE, firm)
- Notification of Acceptance: June 30, 2023

Work-in-Progress Track:
- Paper Submission: May 22, 2023 (AoE, firm)
- Notification of Acceptance: June 19, 2023

Topics of Interests / Tracks
TRACK 1: AI Systems and Applications of AI at Edge
Artificial Intelligence of Things (AIoT), Edge intelligence,
Architectures, accelerators, and compilers for artificial intelligence
hardware; Applications of machine learning techniques to embedded
systems, IoT, and Cyber-Physical Systems (CPS); Neuromorphic and
cognitive computing, analytics for embedded applications; and validation
techniques for AI components.

TRACK 2: Embedded Systems and IoT/CPS Security, Safety, Reliability, and
Secure architectures, hardware security, software security for embedded
systems, IoT, and CPS; Architecture, design, and compiler techniques for
energy-efficiency, reliability, and aging; Modeling, analysis, and
optimization for timing and predictability; Validation, verification,
testing, and debugging of embedded software.

TRACK 3: Memory and Storage
Memory system architecture; Persistent memory, Emerging memory
technologies (e.g., ReRAM, MRAM, FeRAM, DNA); Caches, scratchpad
memory, and compiler-controlled memory; Reconfigurable memory;
and storage systems.

TRACK 4: Accelerators, Emerging Technologies, and Applications
Synthesis, optimization, and design-space exploration of high-
performance, low-power, reliable accelerators; Domain-specific
accelerators for emerging applications including AI training/
inference, graph analytics, scientific computing; Compilers for
accelerators; Biologically-inspired computing; Heterogeneous and
domain-specific multi-core SoC; Approximate computing; Flexible
hybrid electronics (FHE); Augmented/virtual reality.

TRACK 5: Architectures, Compilers, System-level Design
Embedded and mobile processor micro-architecture, Many-core processors,
GPU architectures, Reconfigurable computing including FPGAs and CGRAs
for embedded systems and IoT/CPS, Application-specific processor design,
3D-stacked architectures; Networks-on-Chip (NoC) architectures; I/O
management in embedded systems; and compiler support for CPU, GPU,
reconfigurable computing, compilation for memory, storage, and on-chip

Journal-Integrated Publication Model
CASES 2023 has a dual publication model with two tracks. Journal track
papers will be published in ACM Transactions on Embedded Computing
Systems (TECS) and Work-in-Progress track papers will be published in the
ESWEEK Proceedings. See details at https://esweek.org/author-information/

CASES Program Chairs:
Swarup Bhunia, University of Florida, USA
Jana Doppa, Washington State University, USA

ESWEEK General Chairs:
Xiaobo Sharon Hu, University of Notre Dame, USA
Alain Girault, INRIA, France


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