[hpc-announce] SIAM PP second call for submissions with deadline extension

[Dubey, Anshu]

2nd Call for Contributions (minisymposia, talks, posters) 
SIAM Conference on Parallel Processing for Scientific Computing – SIAM PP24
March 5–8, 2024 – Lord Baltimore Hotel, Baltimore, MD
 
Conference Website: http://www.siam.org/conferences/cm/conference/pp24 

The SIAM Conference on Parallel Processing for Scientific Computing (SIAM PP24) and the SIAM Activity Group on Supercomputing (SIAG-SC) invite minisymposia (deadline extended!) as well as contributed talks and posters on the following
Topics:
Compilers and programming systems
Data analysis and visualization
Education in HPC
Fault-tolerance
Large-scale parallel applications
Parallel computer systems
Performance analysis, tuning, and debugging
Reproducibility
Scalable parallel algorithms
Scientific workflows
Contributions are especially welcome in:
Algorithms and applications on multiphysics and multiscale computing
Frontiers of scientific computing
Integration of scientific computing and machine learning methods
Post Moore systems and algorithms
Verification, validation, and uncertainty quantification
Extened Submission Deadline: 
September 4, 2023 (11:59 p.m. Eastern Time) for
Minisymposia (deadline extended)
Contributed Lecture, Poster, and Minisymposium Presentation Abstracts
For details on submission formats and how to submit, please refer to the website https://www.siam.org/conferences/cm/submissions-and-deadlines/pp24-submissions-deadlines

Co-Chairs:
Michael Bader, Technical University of Munich
Anshu Dubey, Argonne National Laboratory, U.S.
Committee:
Hartwig Anzt, University of Tennessee, U.S.
Paolo Bientinesi, Umeå University, Sweden
Aparna Chandramowlishwaran, University of California, Irvine, U.S.
Laura Grigori, INRIA Paris, France
Jeff Hammond, NVIDIA, Finland
Jaejin Lee, Seoul National University, Republic of Korea
Bethany Lusch, Argonne National Laboratory, U.S.
Karla V. Morris Wright, Sandia National Laboratories, U.S.
Johann Rudi, Virginia Tech, U.S.
Tetsuya Sakurai, University of Tsukuba, Japan
Edgar Solomonik, University of Illinois at Urbana-Champaign, U.S.