[hpc-announce] CfP: 2nd International Workshop on Testing Distributed Internet of Things Systems (TDIS 2022)

Ilja Behnke i.behnke at tu-berlin.de
Mon May 2 07:28:53 CDT 2022

Call for Papers: 2nd International Workshop on
Testing Distributed Internet of Things Systems (TDIS 2022)

Co-located with the
10th IEEE International Conference on Cloud Engineering (IC2E 2022)

Sep 27, 2021, in Pacific Grove, California

The TDIS workshop aims to provide a forum for current work by 
researchers and
practitioners in the different research areas and application domains 
to testing IoT systems. We welcome submissions that describe initial 
ideas and
visions, just as much as reports on novel approaches, practical tools, and
completed projects. In case that the workshop will have to take place
virtually, we will make sure there will be ample opportunities for 
feedback, lively discussions, and direct interactions.

Topics of interest include but are not limited to:
   - physical and hybrid IoT testbeds
   - simulation and emulation of IoT environments
   - co-simulation within IoT domains
   - model-based and model-supported approaches
   - simulation-based integration testing
   - testing and benchmarking on heterogeneous IoT devices
   - testing and benchmarking of network technologies and protocols
   - testing and benchmarking of real-time behavior
   - testing and benchmarking of fault tolerance mechanisms (fault 
injection, chaos - engineering, etc.)
   - dependability modeling and assessments (high availability, 
consistency, etc.)
   - testing and modeling of resource usage and energy consumption
   - resource management and scheduling in testbeds
   - scalability and efficiency of test runs and testbeds
   - testing frameworks for edge and fog computing
   - testbed automation and orchestration
   - distributed monitoring, tracing, and error detection
   - usability of testbeds and testing frameworks
   - representativeness, reproducibility, and repeatability of test results

For more information please visit our website: https://tdis22.diselab.berlin

Important Dates

* Submission deadline: June 21, 2022
* Notification of acceptance: July 24, 2022
* Camera-ready submission: August 1, 2022

Submission of Papers

Papers should not exceed 6 double-column pages, including figures and 
in the IEEE Manuscript Template for Conference Proceedings. References 
can be up
to two additional pages. The submitted papers should include the names and
affiliations of all authors. Submitted papers will be peer-reviewed by our
Program Committee. Submissions should not have been published earlier 
and not
be currently under review submission anywhere else. Accepted papers will be
published with the main conference proceedings via IEEE Xplore.


We welcome your submission to TDIS 2022 and are happy to answer any 
Furthermore, please consider forwarding this call to other researchers!

Best regards,
Ilja Behnke, Philipp Wiesner, and Lukas Pirl
Publicity Chairs

Ilja Behnke
i.behnke at tu-berlin.de

Technische Universität Berlin
Faculty IV - Electrical Engineering and Computer Science
Distributed and Operating Systems

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