[hpc-announce] VLSI Design 2022: Call for Papers, Deadline 22.October.2021

Muhammad Shafique mshafique at ecs.tuwien.ac.at
Mon Oct 4 14:09:22 CDT 2021


35^th International Conference On VLSI Design

&

21^st International Conference On Embedded Systems

*Silicon Catalyzing computing, Communication and Cognitive Convergence*

19^th – 23^rd February 2022 (Virtual)

Dear Colleague,

*"Call for Papers"*dates for “*35th International Conference on VLSI 
Design and 21st International Conference on Embedded Systems* (*VLSID 
2022*)” are now extended. You can submit your papers through *22nd 
October 2021.*

For more details please visit www.vlsid.org 
<https://r20.rs6.net/tn.jsp?f=001gULPHJuc7UXyG9x_UdA-TQnQ0uoXksBytLgRd-tsYbmbwzOE70gjvyed2iB57A51wzvRD5heC6XvXAJt19BCJl3fYwrOZgfk5W5pJatHKtggmDKmzDDwakH0ndoCOXcQ_QYKeTrZ-jNdmoOx_PcEt-MB_oMenwXndU4-iqxxP2uI6MN9Whs1fwK700Ug4-w3TcVT7x6k2obzsi2Hh5NKjlK9cjj2qjAOxBuOpXQKQRfgJTKwsBY7Uz4xWm6TxrTWOHcR6h61HOwtMaYrlTXRdzIzXqZeDQ5UXX-5SgFBJT2x_X6DlqbjwxSibKY0BEqIhhmlxM2_IFKfQGlTQbBKJTOpe3KKq3fg2hKX0yunW4aWe9yyjTZ1HbBEBMGUNq4JxRgrmOx69o0N7L54CQNTdnwNWewDO-vA_qnLL-2iGYzuBr50sa7uGJBKG6xT3f8EzlvYbYOEOkXoHAB7uQGIvVPVIkH0clQiSfLBMwCRX--BlwRLu_CPJsqtQVF35v8fev6Nxhcz-nYhtL8MNBQlEkpxT1jX-tGD3jf0hMOwYIAoov71LK68Cqn4mBGY16e1XjVWnTOODlEJ6u8u5yfT7SqeRRpTvYbmrypWdi3OSo-PPFnRBLQbcn_rCmSyN3r9osB98mlKc75TxcBqP6pyK-3sGxeyU465A45ow5YkB_o=&c=aE2RzVG1zFw5AiVqot82K_LiV-daDVs_77SsRtXvAGoSCDoZElDjng==&ch=1CFHvZ7cAeY1n8GtnR-qPaAb4eruOlR49NP1woEcw9XW3jomH-_Qzw==>or 
refer below.

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Warm Regards,

VLSID 2022 Team

vlsidc2022 at gmail.com

Silicon continues to fuel and enhance the power of every emerging 
technology. Last few decades saw Silicon enabling the Digital revolution 
among all the verticals – Compute, Connectivity, AI/ML and Smart 
Infrastructure. This decade is starting to witness a complete paradigm 
shift of “Confluence” of these verticals with Silicon continuing to be 
the Masterpiece harnessing the power of each of these verticals in a way 
that is unimagined thus far.

VLSID Conference brings together leaders from Industries, Academia, 
Research Bodies, Government and Standard organizations to a common 
platform. This edition VLSID 2022 brings you a unique opportunity to 
time travel the future of technologies and to explore the role of 
Silicon in decades to come!

CFP Topics

*Artificial Intelligence, Machine Learning and their Applications*

VLSI for AI, AI for VLSI, AI Accelerators, Edge Computing, TinyML, 
Approximate Computing, Autonomous Intelligence (ADAS), AI ethics, AI 
Security, AI Resilience, Energy Efficient AI

	

*Security and Safety*

Functional Safety, Privacy, Cryptography, PUFs, TRNGs, Hardware Trojans, 
Trusted Computing, Network Security, Side-Channel and Fault Analysis and 
Countermeasures

*Analog and Mixed Signal Design*

Analog Circuits for Various Applications, Data Converters, High Speed 
Interfaces, Power Management Circuits, Energy Harvesting Circuits & 
Systems, Circuits & Systems for AI-oriented Applications

	

*Sensors Circuits and Systems*

Sensor Interfacing, Instrumentation, Biomedical Circuits and Healthcare 
Systems, Low Noise Circuits, EMI Immune Design, Autocalibration 
Techniques, Wearable Electronics, Autonomous Sensors Systems

*Digital Integrated Circuits and Systems*

Digital Circuits for Communication, Arithmetic Circuits, System-on-Chip 
Design, Network-on-Chip Design, Low-power Logic Design

	

*Power Electronics*

High Power Circuits, Power Convertors, Power Optimization Techniques, 
Power Delivery Networks, Power Switches, High Voltage Circuits and 
Systems, Power Management for High Voltage Applications, Power Amplifiers

*Emerging Technologies and Devices*

Quantum Computing, Neuromorphic Computing, Synaptic Devices, CMOS 
Technology and Devices, New Age Nano-Electronics, MEMS Devices, GaN and 
SiC Devices

	

*RF Circuits and Systems*

Transceiver Architectures, Short-Range Communication, IoT/IoE, WPAN, 
Ultra-Low Power Wireless Designs, Effective Spectrum Utilization, RF 
Power Amplifiers, RF Energy Harvesting

*Embedded System Design*

IoT Systems, Cyber-Physical Systems, Hardware/Software Co-design, 
Embedded Software, Embedded Operating Systems

	

*Test and Reliability*

EMIR, Interconnect, Power Integrity-Signal Integrity (PISI), EMI/EMC 
Compatibility, Built-in Self-Test, Design for Test, Self-X (Awareness, 
Repair, Test), On-line Test, Fault Tolerance

*Electronic Design Automation*

Verification, Synthesis, Physical Design, Silicon Engineering, 
Just-in-time Synthesis, AI enabled algorithms, Formal Verification, 
Optimization

	

*Architectures*

Chip Architecture, Computer Architecture, High Performance Computing, 
Configurable Computing, (Embedded) FPGA, Memory Subsystems, In Memory 
Computing Systems

*Packaging and Interconnects*

On-chip interconnects, 3D packaging, Wafer-level packaging, Interconnect 
Technologies

	



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