[hpc-announce] [TSP 2021 | virtual | July 26-28] Invitation for Papers & Workshop/Special Session Proposals

IEEE R8 Tech. Co-Sponsored TSP 2021 tspprmng at feec.vutbr.cz
Tue Mar 2 06:47:53 CST 2021 

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*2021 44th International Conference on Telecommunications and Signal 
Processing (TSP - IEEE Conference Record #52935)
*July 26-28, 2021 (virtual conference)
Web: http://tsp.vutbr.cz/

• *Deadline for Special Session and Workshop Proposals*: April 1, 2021
• *Deadline for Full Paper Submissions*: April 1, 2021

#StaySafeAtHome

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*/Technical co-sponsors:/*/IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Czechoslovakia Section, IEEE Czechoslovakia Section 
SP/CAS/COM Joint Chapter, and Scientific Association for 
Infocommunications, a Sister Society of the IEEE and the IEEE 
Communications Society.

The TSP 2021 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library - 
IEEE Conference Record #52935, SCOPUS, Conference Proceedings Citation 
Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases./

*After the conference, the authors of about 40% of the highest rated 
papers will also be invited to submit the extended version for 
publishing in Special Journal Issues (papers to be published after 
significant extension and new review process):
*
/• *Applied Sciences* - Special Issue 'Selected Papers from the 2020 
43rd and 2021 44th International Conference on Telecommunications and 
Signal Processing (TSP)' of Applied Sciences (ISSN 2076-3417), an 
international peer-reviewed open access journal on all aspects of 
applied natural sciences published by MDPI and indexed by Web of Science 
(CiteScore 2019 Scopus data: 2.4, which equals rank 85/299 (Q2) in 
'General Engineering' and 233/460 in 'General Materials Science'; 
current Impact Factor: 2.474)
• *Remote Sensing* - Special Issue 'Advances in Signal Processing 
Techniques for Ground Penetrating Radar Applications' of Remote Sensing 
(ISSN 2072-4292), an international peer-reviewed open access journal 
about the science and application of remote sensing technology published 
by MDPI and indexed by Web of Science (JCR category rank: 9/30 (Q2) in 
'Remote Sensing';current Impact Factor: 4.509)
• *Sensors* - Special Issue 'Signal Processing Circuits and Systems for 
Smart Sensing Applications' of Sensors (ISSN 1424-8220), an 
international peer-reviewed open access journal on the science and 
technology of sensors published by MDPI and indexed by Web of Science 
(CiteScore (2019 Scopus data: 5.0; ranked 17/129 (Q1) in 'Physics and 
Astronomy: Instrumentation' and 147/670 (Q1) in 'Electrical and 
Electronic Engineering' and 70/300 (Q1) in 'Computer Science: 
Information Systems';current Impact Factor: 3.275)
• *International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems (IJATES)* (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals/
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Dear Colleague and Friend,

You are kindly invited to participate in the */2021 44th International 
Conference on Telecommunications and Signal Processing (TSP - 
http://tsp.vutbr.cz/ - IEEE Conference Record #52935)/*, which will be 
organized online during */July 26-28, 2021/*. The TSP Conference serves 
as a premier annual international forum to promote the exchange of the 
latest advances in telecommunication technology and signal processing. 
The aim of the conference is to bring together both novice and 
experienced scientists, developers, and specialists, to meet new 
colleagues, collect new ideas, and establish new cooperation between 
research groups from universities, research centers, and private sectors 
from the whole Europe, America, Asia, Australia, and Africa.

*/TOPICS:
/*
TSP 2021, driven by the theme '*/The age of A.I./*', has opened Calls 
for Workshop and Special Session Proposals and Full Paper Submissions 
with deadline set April 1, 2021. We look forward to your innovative 
contributions in any of the following areas:

/AREA 1: Telecommunications
/
1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement

/AREA 2: Signal Processing
/
6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing

For more details, please visit the Conference website at 
http://tsp.vutbr.cz/?page_id=121 .

*/WORKSHOPS AND SPECIAL SESSIONS:
/*
Prospective Organizers are invited to submit proposals for Workshops and 
Special Sessions held during the TSP 2021 Conference. The following 
Workshop was approved so far:

• *WS1*: 5th International Workshop on Recent Advances in Biometrics and 
its Applications organized by Assoc. Prof. Dr. Larbi Boubchir and Prof. 
Boubaker Daachi (both from the LIASD – University of Paris 8, France)

Organizing guidelines are available at http://tsp.vutbr.cz/?page_id=3492 .

*/STUDENT BEST PAPER AWARD:
/*
In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of the papers, their presentations, and 
their technical excellence, the authors of the Best 5 Student Papers 
will be awarded during the conference by the Technical Committee. The 
Best Student Paper Award consists of a Certificate of Appreciation.

*/ORGANIZERS:
/*
The TSP 2021 is an IEEE technically co-sponsored conference organized in 
cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
• Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
• Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia 
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

*/COMMITTEES:
/*
• Honorary Chair - Miloslav Filka, Brno University of Technology, Czech 
Republic – Full Professor, TSP Conference Founder
• General Chair - Norbert Herencsár, Brno University of Technology, 
Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter 
Chair, IEEE Senior Member
• Publications & Student Paper Contest Chair - Jiří Hošek, Brno 
University of Technology, Czech Republic – IEEE Member
• Finance Chair - Nándor Mátrai, Asszisztencia Congress Bureau, Hungary 
– Managing Director
• Registration Chair - Csilla Fülöp, Asszisztencia Congress Bureau, 
Hungary – Project Manager

/Steering Committee:
/
• Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor, 
IEEE Senior Member
• Larbi Boubchir, Université Paris 8, France – Associate Professor, IEEE 
Senior Member
• Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataró, 
Tecnocampus, Spain – Full Professor, Dean
• Izzet Cem Göknar, Işik University, Turkey – Institute of Science 
Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full 
Professor, IEEE Life Fellow
• Ray-Guang Cheng, National Taiwan University of Science and Technology 
(NTUST), Taiwan – Full Professor, IEEE Senior Member
• Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
• Jaroslav Koton, Brno University of Technology, Czech Republic – 
Vice-dean for Research, IEEE Senior Member
• Sridhar Krishnan, Ryerson University, Canada – Full Professor & 
Associate Dean, IEEE Senior Member
• Mario Kušek, University of Zagreb, Croatia – IEEE Croatia Section 
Communications Chapter Chair, IEEE Member
• Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair 
Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior 
Member
• Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior 
Member
• Jiří Mišurec, Brno University of Technology, Czech Republic – Full 
Professor, Department Chair
• Ram M. Narayanan, The Pennsylvania State University, USA – Full 
Professor, IEEE Fellow
• Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior 
Member
• Serdar Özoguz, Istanbul Technical University, Turkey – Full Professor, 
Associate Chair
• Jakub Pęksiński, West Pomeranian University of Technology, Poland
• Hector Perez-Meana, National Polytechnic Institute, Mexico – Full 
Professor, IEEE Senior Member
• Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full 
Professor, Dean, IEEE Senior Member
• Costas Psychalinos, University of Patras, Greece – Full Professor, 
IEEE Senior Member
• Markus Rupp, Vienna University of Technology, Austria – Full 
Professor, Dean, IEEE Fellow
• Zdeněk Smékal, Brno University of Technology, Czech Republic – Full 
Professor, IEEE Senior Member
• Attila Vidács, Budapest University of Technology and Economics, 
Hungary – Deputy Head of Department
• Miroslav Vozňák, VŠB-Technical University of Ostrava, Czech Republic – 
Full Professor, Department Chair, IEEE Senior Member
• Drago Žagar, Josip Juraj Strossmayer University of Osijek, Croatia – 
Full Professor, Dean, IEEE Senior Member

*/IMPORTANT DATES:
/*
• *Deadline for Special Session and Workshop Proposals*: April 1, 2021
• *Deadline for Full Paper Submissions*: April 1, 2021
• *Notification of Paper Acceptance*: June 15, 2021
• *Final Paper Submission*: June 30, 2021
• *Authors' Registration and Payment*: June 15 - July 15, 2021
• *Virtual Conference*: July 26-28, 2021

*/CONTACTS:
/*
For more information, please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to tsp at feec.vutbr.cz .

Looking forward to meeting you at the conference.

With best regards,

Norbert Herencsar
TSP 2021 General Chair

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz

Follow us on:
• *Facebook*: https://www.facebook.com/tspconf/
• *Twitter*: https://twitter.com/tspconf/
===================================================
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

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TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the conference.
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