[hpc-announce] IEEE SMARTCOMP 2021 [Paper registration deadline: Jan 24, 2021]

[Yusuf Sarwar]

[Apologies if you receive multiple copies of this message]
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                  CALL FOR PAPERS
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The 7th IEEE International Conference on Smart Computing (SMARTCOMP 2021),
August 23-27, 2021 in Irvine, Orange County, California, USA
https://www.smart-comp.info
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SMARTCOMP 2021, the 7th edition of the conference, will be held in Irvine,
Orange County, California, USA. SMARTCOMP is the premier conference on
smart computing. Smart computing, a multidisciplinary domain is based on
the synergistic influence of advances in Sensor-based technologies, the
Internet of Things (IoT), Cyber-Physical Systems, Edge computing, Big Data
analytics, Machine Learning, Cognitive Computing, and Artificial
Intelligence.

Applications of smart computing can be found in different societal domains
including, but not limited to, transportation, energy, environmental
protection, smart and connected communities, healthcare, banking,
entertainment, and social media. Algorithmic and system advancements of
cloud computing, mobile/pervasive computing, cyber-physical systems, sensor
networking and social computing are taking smart computing to a new
dimension and improving our ways of living. Selected papers from SMARTCOMP
2021 will be considered for publication in Elsevier’s Journal of Pervasive
and Mobile Computing.

It is planned to have the conference in Irvine, Orange County, California,
USA. However, there is a possibility of moving to either a hybrid or fully
online mode depending on the pandemic situation.


TOPICS
SMARTCOMP 2021 solicits submissions that address the fundamental questions
of smart computing, namely how to design and build scalable and reliable
smart computing systems, and how to use computing technology for resource
sustainability to improve the human experience. Topics include, but not
limited to the following:

 * Future Smart Computing Paradigms
 * Models of Smart Environments
 * Algorithms for Smart Computing
 * AI and Machine Learning in Smart Computing
 * Security, Privacy, and Trust issues in Smart Computing
 * Fairness and Socio-technical issues of Smart Computing
 * Cyber-physical System Platforms for Smart Environments
 * Middleware Platforms for Smart Environments
 * Mobile and Ubiquitous Platforms for Smart Environments
 * Cloud, Edge and Fog Computing Platforms for Smart Systems
 * Data Architectures and Analytics for Smart Computing
 * Applications of Smart Computing

SUBMISSION GUIDELINES
Paper submissions must be no longer than 8 pages (the page count limit
includes the references list) and formatted according to the two-column
IEEE proceedings template. IEEE provides corresponding formatting templates
at *IEEE conference template*. Make sure to use the conference mode of the
template, i.e., LaTeX users must use the conference option of the IEEEtran
document class.

Papers must be submitted electronically as a single PDF file on US Letter
size paper (not A4), with all fonts embedded (the PDF-A standard complies
with that), through EDAS. Prior to submission, ensure that any running
headers/footers, page numbering, as well as blue underlining for URLs and
email addresses has been removed.

All submitted papers will be subject to peer reviews by Technical Program
Committee members and other experts in the field. All presented papers will
be published in the conference proceedings and submitted to the IEEE Xplore
Digital Library.

Extended versions of selected high quality papers accepted in IEEE
SMARTCOMP 2021 will be considered for publication in the Elsevier's
Pervasive and Mobile Computing journal.

IMPORTANT DATES:
* Paper Registration Deadline: 24 January 2021
* Paper Submission Deadline: February 1 2021
* Acceptance Notification: April 15, 2021
* Camera Ready Deadline: May 15, 2021
* Registration Deadline: TBD

ORGANIZATION COMMITTEE:
* General Co-Chairs
  - Marco Conti, IIT-CNR, Italy
  - Nalini Venkatasubramanian, University of California, Irvine, USA

* Technical Program Co-Chairs
  - Mohan Kumar, Rochester Institute of Technology, USA
  - Valerie Issarny, INRIA Paris, France

* Workshop Co-Chairs
  - Carlo Giannelli, University of Ferrara, Italy
  - Flora Salim, RMIT University, Australia

* Publicity Co-Chairs
  - Yusuf Sarwar, University of Missouri, Kansas City, USA
  - Mattia Campana, IIT-CNR, Italy

* Publication Chair
  - Francesco Longo, University of Messina, Italy
  - Chenghsin Hsu, National Tsinghua University,  Taiwan

* Web Co-Chairs
  - Georgios Bouloukakis, Telecom SudParis, France
  - Shantanu Sharma, University of California, Irvine, USA

* Online Session Coordination Chairs
  - Carlo Vallati, University of Pisa, Italy

* Steering Committee Co-Chairs
  - Jiannong Cao, Hong Kong Polytechnic University, Hong Kong
  - Sajal K. Das, Missouri University of Science and Technology, USA

* PhD Forum Co-Chairs
  - Paolo Bellavista, University of Bologna, Italy
  - Qi Han, Colorado School of Mines, USA

* Finance and Registration Chair
  - Maciej Zawoeniok, Missouri University of Science & Tech, USA

* WiP and Demo Co-Chairs
  - Franca Delmastro, IIT-CNR, Italy
  - Simone Silvestri, University of Kentucky, USA

* Industry Track Co-Chairs
  - Bhaskar Krishnamachari, University of Southern California, USA
  - Mallik Tatipamula, Ericsson Silicon Valley, USA

* Panel Chair
  - Nikil Dutt, University of California, Irvine, USA

* Registration Chair
  - Qi Alfred Chen, University of California, Irvine, USA

* Local Arrangements Committee
  - Yasser Shoukry, University of California, Irvine, USA
  - Salma Elmalaki, University of California, Irvine, USA

CONTACTS
For any Information about the conference, please contact the
TPC Co-Chairs, Mohan Kumar (mjkvcs at rit.edu) and Valerie Issarny (
Valerie.ISSARNY at inria.fr).