[hpc-announce] CALL FOR POSTERS: 27th International Symposium on High Performance Interconnects 2020 (Hoti 2020) - due July 13, 2020

[Si, Min]

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                          CALL FOR POSTERS 
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   27th International Symposium on High Performance Interconnects 2020
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             QCT, San Jose, California, August 19-21, 2020
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Safety and Well-Being
HOT Interconnects is scheduled to be held as planned, beginning on August 19.
Given the uncertainty of the Coronavirus, we are planning for a virtual, online
conference but we are also holding open the possibility of a physical conference.

The safety and well-being of all conference participants is our priority. We
will continue to monitor official travel advisories related to the Coronavirus
and update the event website to keep you informed. We encourage you to review
the conference’s “Travel and Safety Information” page for tips and travel
recommendations. If you have any questions or need additional information,
please email us for further details: info at hoti.org

As well as a Travel and Safety Information page with these links:

World Health Organization: https://www.who.int/health-topics/coronavirus
Centers for Disease Control: https://www.cdc.gov/coronavirus/2019-ncov/index.html
European Center for Disease Control: https://www.ecdc.europa.eu/
National Health Commission of the People’s Republic of China: http://en.nhc.gov.cn/

Call for Posters


Hot Interconnects is the premier international forum for researchers and
developers of state-of-the-art hardware and software architectures and
implementations for interconnection networks of all scales, ranging from
multi-core on-chip interconnects to those within systems, clusters, data
centers, and clouds.  This yearly conference is attended by leaders in
industry and academia. The atmosphere provides for a wealth of
opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking
technologies, and communication protocols for high-performance
interconnection networks. This conference is directed particularly at new
and exciting technology and product innovations in these areas.
Contributions should focus on real experimental systems, prototypes, or
leading-edge products and their performance evaluation. 

This year, we are inviting poster abstract submissions. Abstracts will consist
of a one page description of the proposed poster and should highlight
technical merit, relevance to HotI, and novelty of the content. Additionally,
abstracts should include title and author information.  

POSTER SCHEDULE:

* Poster abstract deadline:                  July 13th, 2020
* Poster notification of acceptance:     July 20th, 2020

To submit, go to  https://easychair.org/conferences/?conf=hoti27​
Topics of interest include, but are not limited to:

* Novel and innovative interconnect architectures 
* Multi-core processor interconnects 
* System-on-Chip Interconnects 
* Advanced chip-to-chip communication technologies 
* Optical interconnects Protocol and interfaces for inter-processor 
  communication 
* Survivability and fault-tolerance of inter-connects 
* High-speed packet processing engines and network processors 
* Systems software for communication
* System and storage area network architectures and protocols
* High-performance host-network interface architectures 
* High-bandwidth and low-latency I/O 
* Pb/s switching and routing technologies 
* Innovative architectures for supporting collective communication 
* Novel communication architectures to support cloud & grid computing 
* Centralized and distributed cloud interconnects 
* Requirements driving high-performance interconnects
* Traffic characterization for HPC systems and commercial data centers
* Software-defined networking and software overlay networks
* Software for network bring-up, configuration and performance management 
  (OpenFlow, OpenSM)
* Data Center Networking

Sponsor HOT Interconnects!  email the Sponsorship chair, Raj Channa
at    sponsor at hoti.org 

Send questions relating to the conference operation to: 

Co-General Chairs: 
 
Khaled Hamidouche, AMD
Don Draper, ProPrincipia International Associates

at    info at hoti.org
 
Send questions relating to the program to 

TECHNICAL PROGRAM CHAIRS: 

Manjunath Gorentla Venkata, Mellanox Technologies, Inc
Ryan E. Grant, Sandia National Laboratories

at    program at hoti.org

Sponsored by the IEEE Computer Society Technical Committee for 
Microprocessors and Microcomputers

Sister conferences:

www.hotchips.org
http://www.coolchips.org/ 
http://www.mcsoc-forum.org/


Go to the HOT Interconnects web site for updates:   http://www.hoti.org