[hpc-announce] International Workshop on Advanced Network Technologies and IoT | Milan, Italy | July 6-8, 2020

Wed Jan 15 15:25:54 CST 2020

****   International Workshop on Advanced Network Technologies and IoT   
*****
**** https://tsp.vutbr.cz/documents/TSP2020_CFP_WS2_v1.pdf   ***

/2020 43rd International Conference on Telecommunications and Signal 
Processing (TSP)//
//July 6-8, 2020, Milan, Italy //
//Web: http://tsp.vutbr.cz///
//
//Full Paper Submissions: February 15, 2020//
/
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*Technical co-sponsors: */IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section 
VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia 
Section SP/CAS/COM Joint Chapter, and Scientific Association for 
Infocommunications, a Sister Society of the IEEE and the IEEE 
Communications Society.//
//
//The TSP 2020 Proceedings, containing presented papers at the 
Conference, will be submitted for indexing to the IEEE Xplore® Digital 
Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings 
Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar 
databases./

*After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process): **
*
• Special Issue Selected Papers from the 2020 43rd International 
Conference on Telecommunications and Signal Processing (TSP) of an 
*Applied Sciences* (ISSN 2076-3417), an international peer-reviewed open 
access journal on all aspects of applied natural sciences published by 
MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 
2.217)
• *International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems (IJATES)* (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals
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*Dear Colleague,*

During the past few years, key functionalities and elements of computer 
networks have shown tremendous evolution. Examples include new 
congestion control algorithms that have challenged paradigms established 
over 30 years ago; continued evolution of Software-defined Networks 
(SDNs) and Network Function Virtualization (NFV); network 
programmability at the data plane and the advent of the P4 language that 
facilitate custom network designs and enhance performance; offloading of 
functions to network interface cards and switches; and the rise of the 
Internet of Things (IoT) for connecting a wide variety of “things” into 
the Internet. While these new technologies offer potentially 
revolutionary benefits, many open research issues must still be addressed.

Within the framework of the 2020 43rd International Conference on 
Telecommunications and Signal Processing (TSP) held during July 6-8, 
2020 in Milan, Italy, this workshop will enable practitioners and 
researchers to present and discuss novel approaches, solutions, and 
recent results that help answering research questions on advanced 
network technologies and IoT. Topics include, but are not limited to:

• Architectures, protocols and standards
• Programmable switches
• Transport protocols and congestion control
• P4 language
• Network Function Virtualization (NFV)
• Network Function Chaining (NFC)
• Energy efficient communication
• Fog and cloud computing architectures and technologies
• Security, privacy and reliability
• IoT infrastructure, applications, and services
• Software-Defined Networking
• QoS for mission critical communications Industrial IoT applications
• Time-sensitive networking
• Autonomous context-aware traffic classification
• Routing protocols and algorithms
• Congestion management protocols and algorithms
• Cross-platform architecture, infrastructure and performance control
• Security, privacy and reliability

For more details please visit the Conference website at 
https://tsp.vutbr.cz/?page_id=4461#WS2-20 .

*EDITORIAL BOARD:*

• Assoc. Prof. Jorge Crichigno (University of South Carolina, U.S.A.; 
E-mail: jcrichigno at cec.sc.edu)
• Assoc. Prof. Gautam Srivastava (Brandon University, Canada; E-mail: 
srivastavag at brandonu.ca)
• Prof. Dr. Neset Hikmet (University of South Carolina, U.S.A.; E-mail: 
nhikmet at cec.sc.edu)

*STUDENT BEST PAPER AWARD:*

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.

*TSP ORGANIZERS:*

The TSP 2020 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
• Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
• Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia 
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

*IMPORTANT DATES:*

• Full Paper Submissions: February 15, 2020
• Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020

*CONTACTS:*

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to tsp at feec.vutbr.cz .

Looking forward to meeting you in Milan, Italy.

With best regards,

Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz

Follow us on:
• Facebook https://www.facebook.com/tspconf/
• Twitter https://twitter.com/tspconf/
===================================================
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome
Italy

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/TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference./
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