[hpc-announce] TSP 2020 | Milan, Italy | Special Session on Multimodal Signal Processing and Classification

Wed Jan 8 07:28:52 CST 2020

****   Special Session on Multimodal Signal Processing and 
Classification   ****
***        https://tsp.vutbr.cz/documents/TSP2020_CFP_SS1_v1.pdf ***

/2020 43rd International Conference on Telecommunications and Signal 
Processing (TSP)//
//July 6-8, 2020, Milan, Italy //
//Web: http://tsp.vutbr.cz///
//
//Full Paper Submissions: February 15, 2020//
/
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*Technical co-sponsors:* /IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section 
VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia 
Section SP/CAS/COM Joint Chapter, and Scientific Association for 
Infocommunications, a Sister Society of the IEEE and the IEEE 
Communications Society.//
//
//The TSP 2020 Proceedings, containing presented papers at the 
Conference, will be submitted for indexing to the IEEE Xplore® Digital 
Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings 
Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar 
databases./

*After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process): *

• Special Issue Selected Papers from the 2020 43rd International 
Conference on Telecommunications and Signal Processing (TSP) of an 
*Applied Sciences* (ISSN 2076-3417), an international peer-reviewed open 
access journal on all aspects of applied natural sciences published by 
MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 
2.217)
• *International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems* (IJATES) (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals
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*Dear Colleague,**
*
Our experience over the world is multimodal, e.g., we see objects, hear 
sounds, smell odors. More precisely, we sense the environment through a 
multimodal and complex system. In order to build intelligent perceiving 
systems that analyze information acquired by sensors with different 
physical properties, multimodal analysis systems require powerful tools 
in terms of signal processing, machine learning and data mining. The 
implications cover a wide range of domains, from audio-visual speech 
recognition to multimodal human-computer interfaces and media 
description. Under the framework of /2020 43rd International Conference 
on Telecommunications and Signal Processing (TSP)/ held during /July 
6-8, 2020/ in /Milan, Italy/, the aim of this special session is to 
foster the use of multimodal machine learning and data analysis tools 
among the signal processing community, to bridge the gap between 
researchers from academia and industry professionals in AI-related 
fields and identify possible collaborations. This special session will 
provide a forum of discussion on the recent advances and development 
experiences, with the goal of creating a synergy between signal 
processing and machine learning domains. Topics include but are not 
limited to:

• Models and methods for extracting information from multimodal data
• Applications in Computer Vision, Natural Language Processing, Spoken 
Language Technology, Biomedical Engineering
• Data fusion
• Machine Learning
• Deep neural networks
• Data mining
• Knowledge discovery
• Data visualization and communication

For more details please visit the Conference website at 
https://tsp.vutbr.cz/?page_id=4461#SS1-20 .

*EDITORIAL BOARD:*

• Prof. Corneliu Burileanu (University Politehnica of Bucharest, 
Romania; E-mail: corneliu.burileanu at upb.ro)
• Dr. Anamaria Radoi (University Politehnica of Bucharest, Romania; 
http://E-mail:%20anamaria.radoi@upb.ro/)

*STUDENT BEST PAPER AWARD:*

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.

*TSP ORGANIZERS:*

The TSP 2020 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
• Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
Croatia
• Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia 
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

*IMPORTANT DATES:*

• Full Paper Submissions: February 15, 2020
• Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020

*CONTACTS:*

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to tsp at feec.vutbr.cz .

Looking forward to meeting you in Milan, Italy.

With best regards,

Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz

Follow us on:
• Facebook https://www.facebook.com/tspconf/
• Twitter https://twitter.com/tspconf/
===================================================
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome
Italy

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/TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference./
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