[hpc-announce] TSP 2020 | Milan, Italy | Special Session on Photonic Fibre Networks and their Applications (Theory, Design, Modelling, Simulations, Operation, Trials)

IEEE R8 Tech. Co-Sponsored TSP 2020 tspprmng at feec.vutbr.cz
Mon Feb 10 02:02:55 CST 2020

*** *Special Session on Photonic Fibre Networks and their Applications 
(Theory, Design, Modelling, Simulations, Operation, Trials)*   ***
***        https://tsp.vutbr.cz/documents/TSP2020_CFP_SS2_v1.pdf ***

*2020 43rd International Conference on Telecommunications and Signal 
Processing (TSP)**
**July 7-9, 2020, Milan, Italy **
**Web: http://tsp.vutbr.cz/*

/Full Paper Submissions: February 15, 2020/

*Technical co-sponsors: */IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section 
VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia 
Section SP/CAS/COM Joint Chapter, and Scientific Association for 
Infocommunications, a Sister Society of the IEEE and the IEEE 
Communications Society.//
//The TSP 2020 Proceedings, containing presented papers at the 
Conference, will be submitted for indexing to the IEEE Xplore® Digital 
Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings 
Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar 
/*/After the conference, authors of about 25% highest rated papers will 
also be invited to submit the extended version for publishing in Special 
Journal Issues (papers to be published after significant extension and 
new review process): /**/
//• Special Issue Selected Papers from the 2020 43rd International 
Conference on Telecommunications and Signal Processing (TSP) of an 
Applied Sciences (ISSN 2076-3417), an international peer-reviewed open 
access journal on all aspects of applied natural sciences published by 
MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor: 
//• International Journal of Advances in Telecommunications, 
Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed 
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen 
Zeitschriftenbibliothek, and Directory of Open Access Journals/

*Dear Colleague,*

Optical networks maintain major part of fast data transmission over long 
distances and also advancing into the access networks. Software defined 
networking concept supports flexible modulation schemes in order to 
achieve high spectral efficiency. The unused part of optical spectrum 
can be so provided as a service also used to transfer – photonic 
services, providing very high optical signal fidelity including the 
preservation of timing. Such services can be used for security 
monitoring and distributed sensing along fibre paths; and also for 
precise time or ultra-stable frequency disseminations etc. New 
application for optical fibre also emerges in terms of support of future 
proof method of secure cryptography keys exchange – Quantum Key 
Distribution (QKD). Here mentioned use of photonics networks, with no 
interference with the commodity data traffic, is a rapidly growing area 
of research and development. Within the framework of the *2020 43rd 
International Conference on Telecommunications and Signal Processing 
(TSP)* held during *July 7-9, 2020* in *Milan, Italy *we invite you to 
present and discuss advances in the research and development of flexible 
in the fields mentioned below. Topics of interest include, but are not 
limited to, the following:

• Software defined  networks (SDN)
• Flexible and elastic optical (fibre) networks
• Photonic services
• Optical spectrum as a service, spectrum allocation
• High speed optical data transmission in global and local networks
• Precise time / stable frequency transmission
• Quantum key distribution (QKD) over fibre
• Optical networks security
• Optical fibre sensors
• Distributed fibre sensing
• Quality of Services (QoS)
• Routing and wavelength assignment (RWA)
• Routing and spectrum assignment (RSA)
• Optical access networks

For more details please visit the Conference website at 
https://tsp.vutbr.cz/?page_id=4461#SS2-20 .


• Dr. Josef Vojtech (CESNET a.l.e., Czech Republic)
• Dr. Tomas Horvath (CESNET a.l.e. and Brno University of Technology, 
Czech Republic).


In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 5 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Plaque and a Certificate of Appreciation.


The TSP 2020 is IEEE technically co-sponsored Conference organized in 
cooperation with eighteen universities:

• Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
• Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical 
Engineering, Computer Science and Information Technology Osijek, Osijek, 
• Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia 
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia, 
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de 
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on 
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland


• Full Paper Submissions: February 15, 2020
• Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020


For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to tsp at feec.vutbr.cz .

Looking forward to meeting you in Milan, Italy.

With best regards,

Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz

Follow us on:
• Facebook https://www.facebook.com/tspconf/
• Twitter https://twitter.com/tspconf/
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic


Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome

TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference.

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