[hpc-announce] TSP 2020 | Milan, Italy | Special Session on Photonic Fibre Networks and their Applications (Theory, Design, Modelling, Simulations, Operation, Trials)
IEEE R8 Tech. Co-Sponsored TSP 2020
tspprmng at feec.vutbr.cz
Mon Feb 10 02:02:55 CST 2020
*** *Special Session on Photonic Fibre Networks and their Applications
(Theory, Design, Modelling, Simulations, Operation, Trials)* ***
*** https://tsp.vutbr.cz/documents/TSP2020_CFP_SS2_v1.pdf ***
*2020 43rd International Conference on Telecommunications and Signal
Processing (TSP)**
**July 7-9, 2020, Milan, Italy **
**Web: http://tsp.vutbr.cz/*
/Full Paper Submissions: February 15, 2020/
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*Technical co-sponsors: */IEEE Region 8 (Europe, Middle East and
Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section
VT/COM Joint Chapter, IEEE Czechoslovakia Section, IEEE Czechoslovakia
Section SP/CAS/COM Joint Chapter, and Scientific Association for
Infocommunications, a Sister Society of the IEEE and the IEEE
Communications Society.//
//
//The TSP 2020 Proceedings, containing presented papers at the
Conference, will be submitted for indexing to the IEEE Xplore® Digital
Library - IEEE Conference Record #49548, SCOPUS, Conference Proceedings
Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar
databases.//
//
/*/After the conference, authors of about 25% highest rated papers will
also be invited to submit the extended version for publishing in Special
Journal Issues (papers to be published after significant extension and
new review process): /**/
/*/
//• Special Issue Selected Papers from the 2020 43rd International
Conference on Telecommunications and Signal Processing (TSP) of an
Applied Sciences (ISSN 2076-3417), an international peer-reviewed open
access journal on all aspects of applied natural sciences published by
MDPI and indexed by Web of Science (2018 JCR Q3; current Impact Factor:
2.217)//
//• International Journal of Advances in Telecommunications,
Electrotechnics, Signals and Systems (IJATES) (ISSN 1805-5443), indexed
by Google Scholar, CrossRef, WorldCat, EZB Elektronischen
Zeitschriftenbibliothek, and Directory of Open Access Journals/
************************************************************************************
*Dear Colleague,*
Optical networks maintain major part of fast data transmission over long
distances and also advancing into the access networks. Software defined
networking concept supports flexible modulation schemes in order to
achieve high spectral efficiency. The unused part of optical spectrum
can be so provided as a service also used to transfer – photonic
services, providing very high optical signal fidelity including the
preservation of timing. Such services can be used for security
monitoring and distributed sensing along fibre paths; and also for
precise time or ultra-stable frequency disseminations etc. New
application for optical fibre also emerges in terms of support of future
proof method of secure cryptography keys exchange – Quantum Key
Distribution (QKD). Here mentioned use of photonics networks, with no
interference with the commodity data traffic, is a rapidly growing area
of research and development. Within the framework of the *2020 43rd
International Conference on Telecommunications and Signal Processing
(TSP)* held during *July 7-9, 2020* in *Milan, Italy *we invite you to
present and discuss advances in the research and development of flexible
in the fields mentioned below. Topics of interest include, but are not
limited to, the following:
• Software defined networks (SDN)
• Flexible and elastic optical (fibre) networks
• Photonic services
• Optical spectrum as a service, spectrum allocation
• High speed optical data transmission in global and local networks
• Precise time / stable frequency transmission
• Quantum key distribution (QKD) over fibre
• Optical networks security
• Optical fibre sensors
• Distributed fibre sensing
• Quality of Services (QoS)
• Routing and wavelength assignment (RWA)
• Routing and spectrum assignment (RSA)
• Optical access networks
For more details please visit the Conference website at
https://tsp.vutbr.cz/?page_id=4461#SS2-20 .
*EDITORIAL BOARD:*
• Dr. Josef Vojtech (CESNET a.l.e., Czech Republic)
• Dr. Tomas Horvath (CESNET a.l.e. and Brno University of Technology,
Czech Republic).
*STUDENT BEST PAPER AWARD:*
In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint
Chapter, to recognize outstanding technical contributions by students,
as evidenced by the quality of papers, their presentations, and their
technical excellence, the authors of the Best 5 Student Papers will be
awarded during the conference by the Technical Committee. The Best
Student Paper Award consists in a Plaque and a Certificate of Appreciation.
*TSP ORGANIZERS:*
The TSP 2020 is IEEE technically co-sponsored Conference organized in
cooperation with eighteen universities:
• Brno University of Technology, Department of Telecommunications, Brno,
Czech Republic
• Budapest University of Technology and Economics, Department of
Telecommunications and Media Informatics, Budapest, Hungary
• Czech Technical University in Prague, Department of Telecommunication
Engineering, Prague, Czech Republic
• Isik University, Department of Electrical and Electronics Engineering,
Sile/Istanbul, Turkey
• Istanbul Technical University, Electronics and Communication
Engineering Department, Istanbul, Turkey
• Josip Juraj Strossmayer University of Osijek, Faculty of Electrical
Engineering, Computer Science and Information Technology Osijek, Osijek,
Croatia
• Karadeniz Technical University, Department of Electrical and
Electronics Engineering, Trabzon, Turkey
• National Taiwan University of Science and Technology, Department of
Electronic and Computer Engineering, Taipei, Taiwan
• Seikei University, Graduate School and Faculty of Science and
Technology, Information Networking Laboratory, Tokyo, Japan
• Slovak University of Technology in Bratislava, Institute of Multimedia
Information and Communication Technologies, Bratislava, Slovak Republic
• Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
• Technical University of Sofia, Faculty of Telecommunications, Sofia,
Bulgaria
• Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de
Saint-Denis (LIASD), France
• University “Politehnica” of Bucharest, Center for Advanced Research on
New Materials, Products and Innovative Processes (“CAMPUS”)
• University of Ljubljana, Laboratory for Telecommunications, Ljubljana,
Slovenia
• University of Patras, Physics Department, Patras, Greece
• VSB - Technical University of Ostrava, Department of
Telecommunications, Ostrava, Czech Republic
• West Pomeranian University of Technology, Faculty of Electrical
Engineering, Szczecin, Poland
*IMPORTANT DATES:*
• Full Paper Submissions: February 15, 2020
• Notification of Paper Acceptance: April 15, 2020
• Final Paper Submission: April 30, 2020
• Authors' Early Registration and Payment: May 10, 2020
• Authors' Late Registration and Payment: May 20, 2020
*CONTACTS:*
For more information please visit the Conference website at
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed
to tsp at feec.vutbr.cz .
Looking forward to meeting you in Milan, Italy.
With best regards,
Norbert Herencsar and Francesco Benedetto
TSP 2020 General Co-Chairs
Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz
Follow us on:
• Facebook https://www.facebook.com/tspconf/
• Twitter https://twitter.com/tspconf/
===================================================
Assoc. Prof. Norbert Herencsar, Ph.D.
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic
&
Prof. Francesco Benedetto
Signal Processing for Telecommunications and Economics (SP4TE)
University of "Roma TRE"
via Vito Volterra, 62
00146 Rome
Italy
************************************************************************************
TSP Organizers reserve the right to exclude a paper from distribution
after the Conference (e.g., non-indexing in IEEE Xplore® and other
databases) if the paper is not presented at the Conference.
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