[hpc-announce] [CFP] SUBMISSION DEADLINE: Jan. 15, 2020, IEEE ICTE 2020 (International Conference on Technology and Entrepreneurship)

Luca Foschini luca.foschini at unibo.it
Tue Nov 12 10:43:44 CST 2019

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*Call for Papers*
IEEE International Conference on Technology and Entrepreneurship 2020 - 
Connecting IoT, AI, the Cloud with Entrepreneurship
Bologna, Italy, April 19 – 22, 2020
Conference link: https://icte.ieee-tems.org 

*Scope and Motivation*
Technology evolution opens novel opportunities to employ the technology 
in many businesses. The internet opened e-commerce and marketing and 
that also changed global marketing strategies as well as discovery of 
new application areas.
Now, Internet of Things devices (IoT) gives us information collected 
from billions of devices, the cloud lets us store, process and forward 
this and AI gives us tools to analyze information, predict and make 
smart decisions. Utilizing these technologies, entrepreneurs can build 
products that enable essentials so we can make advanced solutions for 
biomedical systems, transportation, education, manufacturing, 
agriculture, and many other areas.

*Main Topics of Interest:*
- Entrepreneurship and its ecosystem
- Business Model Innovation in new Technologies
- Technology Advancements in IoT devices
- Technology Advancements in Artificial Intelligence
- New Opportunities using Technology in BioMedical, Farming, 
Transportation, and Cyber Physical Systems
- Managing Globalization Challenges
- People and Organizations
- Legal, Ethics, and Social Issues

There will be an opportunity to publish in a Special Issue of our 
journal IEEE Transactions on
Engineering Management for selected papers submitted to the conference.
For further details, please refer to http://icte.ieee-tems.org/ 
The conference will host an Industry Forum inviting speakers from 
industry leaders around the world that will provide
visions and industry in a rapidly developing technology world.

*Paper Submission*
Authors submit papers on EDAS paper processing system at the link 
Note that every author must have an EDAS account. It only requires an 
email address and there is no cost, anyone can sign up at 
htto://edas.info.   All submitted papers for review are full papers not 
All authors are advised to be familiar with IEEE guidelines before 
submitting their manuscript, including the IEEE Policy on Plagiarism and 
on Double Submission. The Technical Program Committee will verify the 
originality of submitted manuscripts by using CrossCheck, which is an 
antiplagiarism software, comparing submitted papers with previously 
published work worldwide. Manuscripts that violate IEEE’s publication 
principles will be immediately rejected. If the violation is deemed 
severe, then disciplinary actions may also be taken by IEEE.

*Paper Format, Length, Template*
All paper submissions must be written in English and must be formatted 
in standard IEEE 2-column format. The mandatory IEEE template in 
Microsoft Word and LaTeX format can be found at the IEEE templates page. 
Only PDF files will be accepted for the review process. All submissions 
must be made electronically through EDAS.
In particular, submitted manuscripts for IEEE ICTE 2020 should be in 
PDF, US Letter (8.5 x 11 inches) double column format with a maximum 
length of eight (6+2) pages including figures and references. Namely, 
regular submission length is 6 pages, but up to two (2) extra pages are 
permissible with an additional fee paid at registration time. At least 
one author must register with payment of a regular (no student) 
registration fee.  Total file size for each submission cannot exceed 10 
MB.  There is a maximum of 2 papers per author.
The formats and templates information is the standard conference 
template on the IEEE web at 

*Important Dates:*
Paper Submission Due: *15 January 2020*
Notification of Acceptance: 15 February 2020
Author Registration Due: 15 March 2020
Normal Registration/Hotel Block Deadline: 20 March 2020
Late Registration Begins: 21 March 2020

*Organizing Committee:*
General Co-chairs: Antonio Corradi (Italy, Bologna University), Bruno 
Iafelice (USA, TVLP), Michael Condry (USA, IEEE TEMS President),
Program Co-chairs Luca Foschini (Italy, Bologna University), Tugrul 
Diam(USA, Portland State University), Marios Antoniou (Cyprus)
Treasurers: Dilip Kotak (Canada), Tijana Kovijanic (Montenegro) , Peter 
Nagy (Hungary)
Webmasters: Antonio Siea (Italy)
Publication Chair: Rabiz Foda (Canada)
Publicity Chair: Hyunbum Kim (USA, University of North Carolina at 
Industry Forum Chairs: Erik Jung (Germany), Claudio Bergamini(Italy), 
Carlos Roberto de Rolt (Latin America)


Luca Foschini, Ph.D.
DISI -- Dipartimento di Informatica - Scienza e Ingegneria
Università degli Studi di Bologna
Viale Risorgimento, 2 - 40136 Bologna (ITALY)
Ph.: (+39) 051 20 93541 Fax: (+39) 051 20 93073
E-mail: luca.foschini at unibo.it <mailto:luca.foschini at unibo.it>
Web: http://lia.deis.unibo.it/Staff/LucaFoschini/

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