[hpc-announce] [CFP] SUBMISSION DEADLINE: Jan. 15, 2020, IEEE ICTE 2020 (International Conference on Technology and Entrepreneurship)
Luca Foschini
luca.foschini at unibo.it
Tue Nov 12 10:43:44 CST 2019
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*Call for Papers*
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IEEE International Conference on Technology and Entrepreneurship 2020 -
Connecting IoT, AI, the Cloud with Entrepreneurship
Bologna, Italy, April 19 – 22, 2020
Conference link: https://icte.ieee-tems.org
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*Scope and Motivation*
Technology evolution opens novel opportunities to employ the technology
in many businesses. The internet opened e-commerce and marketing and
that also changed global marketing strategies as well as discovery of
new application areas.
Now, Internet of Things devices (IoT) gives us information collected
from billions of devices, the cloud lets us store, process and forward
this and AI gives us tools to analyze information, predict and make
smart decisions. Utilizing these technologies, entrepreneurs can build
products that enable essentials so we can make advanced solutions for
biomedical systems, transportation, education, manufacturing,
agriculture, and many other areas.
*Main Topics of Interest:*
- Entrepreneurship and its ecosystem
- Business Model Innovation in new Technologies
- Technology Advancements in IoT devices
- Technology Advancements in Artificial Intelligence
- New Opportunities using Technology in BioMedical, Farming,
Transportation, and Cyber Physical Systems
- Managing Globalization Challenges
- People and Organizations
- Legal, Ethics, and Social Issues
There will be an opportunity to publish in a Special Issue of our
journal IEEE Transactions on
Engineering Management for selected papers submitted to the conference.
For further details, please refer to http://icte.ieee-tems.org/
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The conference will host an Industry Forum inviting speakers from
industry leaders around the world that will provide
visions and industry in a rapidly developing technology world.
*Paper Submission*
Authors submit papers on EDAS paper processing system at the link
http://edas.info/N26727
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Note that every author must have an EDAS account. It only requires an
email address and there is no cost, anyone can sign up at
htto://edas.info. All submitted papers for review are full papers not
abstracts.
All authors are advised to be familiar with IEEE guidelines before
submitting their manuscript, including the IEEE Policy on Plagiarism and
on Double Submission. The Technical Program Committee will verify the
originality of submitted manuscripts by using CrossCheck, which is an
antiplagiarism software, comparing submitted papers with previously
published work worldwide. Manuscripts that violate IEEE’s publication
principles will be immediately rejected. If the violation is deemed
severe, then disciplinary actions may also be taken by IEEE.
*Paper Format, Length, Template*
All paper submissions must be written in English and must be formatted
in standard IEEE 2-column format. The mandatory IEEE template in
Microsoft Word and LaTeX format can be found at the IEEE templates page.
Only PDF files will be accepted for the review process. All submissions
must be made electronically through EDAS.
In particular, submitted manuscripts for IEEE ICTE 2020 should be in
PDF, US Letter (8.5 x 11 inches) double column format with a maximum
length of eight (6+2) pages including figures and references. Namely,
regular submission length is 6 pages, but up to two (2) extra pages are
permissible with an additional fee paid at registration time. At least
one author must register with payment of a regular (no student)
registration fee. Total file size for each submission cannot exceed 10
MB. There is a maximum of 2 papers per author.
The formats and templates information is the standard conference
template on the IEEE web at
https://www.ieee.org/conferences_events/conferences/publishing/templates.html.
*Important Dates:*
Paper Submission Due: *15 January 2020*
Notification of Acceptance: 15 February 2020
Author Registration Due: 15 March 2020
Normal Registration/Hotel Block Deadline: 20 March 2020
Late Registration Begins: 21 March 2020
*Organizing Committee:*
General Co-chairs: Antonio Corradi (Italy, Bologna University), Bruno
Iafelice (USA, TVLP), Michael Condry (USA, IEEE TEMS President),
Program Co-chairs Luca Foschini (Italy, Bologna University), Tugrul
Diam(USA, Portland State University), Marios Antoniou (Cyprus)
Treasurers: Dilip Kotak (Canada), Tijana Kovijanic (Montenegro) , Peter
Nagy (Hungary)
Webmasters: Antonio Siea (Italy)
Publication Chair: Rabiz Foda (Canada)
Publicity Chair: Hyunbum Kim (USA, University of North Carolina at
Wilmington)
Industry Forum Chairs: Erik Jung (Germany), Claudio Bergamini(Italy),
Carlos Roberto de Rolt (Latin America)
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Luca Foschini, Ph.D.
DISI -- Dipartimento di Informatica - Scienza e Ingegneria
Università degli Studi di Bologna
Viale Risorgimento, 2 - 40136 Bologna (ITALY)
Ph.: (+39) 051 20 93541 Fax: (+39) 051 20 93073
E-mail: luca.foschini at unibo.it <mailto:luca.foschini at unibo.it>
Web: http://lia.deis.unibo.it/Staff/LucaFoschini/
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