[hpc-announce] IEEE HotI 26: Extended Deadline - 26th International Symposium on High Performance Interconnects HotI 2019

[khaled hamidouche]

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                            CALL FOR PAPERS
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    26th International Symposium on High Performance Interconnects
                               HotI 2019
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                          Intel Headquarters
                        Santa Clara, California
                          August 14-16, 2019

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Hot Interconnects is the premier international forum for researchers
and developers of state-of-the-art hardware and software architectures
and implementations for interconnection networks of all scales, ranging
from multi-core on-chip interconnects to those within systems,
clusters, data centers, and clouds. This yearly conference is attended
by leaders in industry and academia. The atmosphere provides for a
wealth of opportunities to interact with individuals at the forefront
of this field.

Themes include cross-cutting issues spanning computer systems,
networking technologies, and communication protocols for
high-performance interconnection networks. This conference is directed
particularly at new and exciting technology and product innovations in
these areas. Contributions should focus on real experimental systems,
prototypes, or leading-edge products and their performance evaluation.
In past years the best papers on interconnect microarchitecture have
been invited to submit extended versions of their papers to a special
edition of IEEE Micro, we are pursuing this once again this year.

Building on the last conference’s successful technical program,
keynotes, sessions, and panels on datacenter networking, requirements,
and solutions, in 2019 Hot Interconnects will be held at the Intel
Headquarters in Santa Clara, CA. This year's conference focuses on
data-center, virtualized, and cloud networking. We hope you can join us
there.

SCHEDULE:

 * Deadline for submissions: 		May 17, 2019
 * Notification of acceptance: 	June 7, 2019
 * Deadline for slide submission: 	July 29, 2019

AWARDS:

An award will be given to the best student paper. To be eligible, at
least one of the paper's authors must be a full-time student at the
time of submission.

In addition, HotI will provide student travel awards. Information
on travel awards can be found on our web site.

TOPICS OF INTEREST:

 * Novel and innovative interconnect architectures
 * Multi-core processor interconnects
 * System-on-Chip Interconnects
 * Advanced chip-to-chip communication technologies
 * Optical interconnects
 * Protocols and interfaces for inter-processor communication
 * Survivability and fault-tolerance of interconnects
 * High-speed packet processing engines and network processors
 * System and storage area network architectures and protocols
 * High-performance host-network interface architectures
 * High-bandwidth and low-latency I/O
 * Pb/s switching and routing technologies
 * Innovative architectures for supporting collective communication
 * Novel communication architectures to support cloud computing
 * Centralized and distributed cloud interconnects
 * Requirements driving high-performance interconnects
 * Traffic characterization for HPC systems and commercial data centers
 * Software for Network/Fabric Bring-up, Configuration and Performance
    Management, e.g., OpenFlow or OpenSM
 * Data Center networking

SUBMISSION GUIDELINES:

Regular presentations consist of a title, an extended abstract (two to
four pages) and the presenter's contact information (name, affiliation,
job title, address, phone(s), fax, and email). Please indicate whether
you have submitted, intend to submit, or have already presented or
published a similar or overlapping submission to another conference or
journal. Also indicate if you would like the submission to be held
confidential. If so indicated, these submissions remain confidential
until the first day of the conference.

Submissions are evaluated by the Program Committee on the basis of
performance of the device(s), degree of innovation, use of advanced
technology, potential market significance, and anticipated interest
to the audience. Research and software contributions will be
evaluated with similar criteria.  To the extent that you are describing
a product, indicate its status - design, development, tape out,
silicon, shipping, etc.

Presentations at HOT Interconnects are in the form of 30-minute talks.

Papers should be submitted electronically through EasyChair
athttps://www.easychair.org/conferences/?conf=hoti26

GENERAL CHAIRS:

Don Draper, Oracle
Eitan Zahavi, Mellanox

TECHNICAL PROGRAM CHAIRS:

Ryan Grant, Sandia National Laboratories
Khaled Hamidouche, AMD

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Please contact us at info at hoti.org if you have any questions.
Visit the Hot Interconnects web site for updates: www.hoti.org
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