[hpc-announce] CfP - 6th International Embedded Systems Symposium (IESS) 2019 - Submission Deadline: May 24th (last extension)

[Pimentel, Andy]

(sorry for duplicates)
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6th International Embedded Systems Symposium (IESS) 2019
September 9 - 11, 2019
Friedrichshafen, Germany

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Important Dates
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- Paper Submissions (extension):    May  24, 2019 (last extension)
- Acceptance of Notifications:      July 01, 2019
- Camera Ready Papers:              July 15, 2019
- Symposium Dates:                  September 09-11, 2019

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Conference Theme
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Over recent years, embedded systems have gained an enormous amount of
processing power and functionality.
Many of the formerly external components can now be integrated into a
single System-on-Chip.
This tendency has resulted in a dramatic reduction in the sizeand cost
of embedded systems.
As a unique technology, the design of embedded systems is an essential
element of many innovations.

Embedded systems meet their performance goals, including real-time constraints,
through a combination of special-purpose hardware and software
components tailored to the system requirements.
Both the development of new features and the reuse of existing
intellectual property components are essential to keeping up with ever
demanding customer requirements.
Furthermore, design complexities are steadily growing with an
increasing number of components that have to cooperate properly.
Embedded system designers have to cope with multiple goals and
constraints simultaneously, including timing, power, reliability,
dependability, maintenance, packaging and, last but not least, price.
The significance of these constraints varies depending on the
application area a system is targeted for. Typical embedded
applications include multi-media, automotive, medical, and
communication devices.

The goals of the International Embedded Systems Symposium are to
present exchange and discuss the state of the art, novel ideas, actual
research results, and future trends in the field of embedded systems.
Contributors and participants from both industry and academia are
encouraged to take active part in this symposium.

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Topics of Interest:
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- Design methods and tools for embedded systems design;
- Novel and dedicated architectures for embedded systems (IoT, deep
learning, etc);
- Challenges on moving architectures to the edge of clouds;
- Application specific processors: architectures, design tools and
HW/SW Co-design
- Processing/Communication trade-offs at architectural level;
- Domain Specific languages
- MDE methods and languages targeting embedded systems design at
different abstraction levels;
- Case studies of innovative Embedded Systems
- Reconfigurable architectures and applications
- Low power processing and communication architectures
- Embedded Systems Applications: Automotive, Avionic, Medical,
Internet-of-Things (IoT),
 Industry 4.0, Smart Cities, Smart Grids, Computer Vision, Intelligent Systems;
- Real-time challenges for embedded systems and systems-of-systems
- Human Machine Interface techniques and methods tailored for Embedded Systems
- Security issues for embedded and real-time systems

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Submission and Publication
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- All submitted papers will follow a blind review process.
- The Proceedings will be published by Springer, the official publisher of IFIP.
- Top ranking papers will also be invited for publication in a special
edition journal (TBA).
-Submission page: http://iess.org/?page=submission

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Organization committee:
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General Chairs
Marco Aurelio Wehrmeister, Federal University of Technology (UTFPR), Brazil
Andy D. Pimentel, University of Amsterdam, Netherlands

Program Chairs
Stefan Henkler, University of Applied Sciences Hamm-Lippstadt, Germany
Marcio Kreutz, Federal University of Rio Grande do Norte (UFRN), Brazil

Local Arrangement Chair:
Mauro C. Zanella, ZF Friedrichshafen AG, Friedrichshafen, Germany

Publicity Chairs
Marcelo Götz, Federal University of Rio Grande do Sul (UFRGS), Brazil

Web Chair:
Tayfun Gezgin, MBition GmbH - Mercedes-Benz Innovation Lab, Germany
Charles Steinmetz, University of Applied Sciences Hamm-Lippstadt, Germany

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Venue
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IESS 2019 will take place at Friedrichshafen (Germany). Besides its industrial
and economic strengths, Friedrichshafen is a marvellous place for both holidays
and relaxation activities. It is located on the northerly banks of magnificent
Lake Constance (the Bodensee) in Southern Germany. A visit to Lake Constance
allows enjoying a unique panorama view of the lake and the mountains tempt.
A great number of holiday activities and free-time offers are provided on and
around the lake, as well as in the air: the town is the home of the Zeppelin
and a dream destination for technology and aviation enthusiasts.