[hpc-announce] IEEE Hot Interconnects: CFP IEEE HotI 26: IEEE Symposium on High Performance Interconnects

[khaled hamidouche]

-----------------------------------------------------------------------------------------
*HOT Interconnects 26 - August 14-16, 2019*
*CALL FOR PRESENTATIONS*
*A Symposium on High-Performance Interconnects*
Location: Intel SC12, Santa Clara, CA
Hot Interconnects 26: SCHEDULE for submissions:
Deadline for submissions: May 10, 2019
Notification of acceptance: May 31, 2019
Deadline for slide submission: July 29, 2019
The conference will consist of two full days of presentations,
Aug. 15 and 16, including a reception on Aug. 15. The
conference is preceded by a day of tutorials on Aug. 14.

 --------------------------------------------------------------------------------------

The conference will be highlighted by these exciting Keynotes:
*Day 1: From Microns to Miles - The Broad Spectrum of Intel's*
*Interconnect Technology Strategy*
*Sailesh Kottapalli, Intel Senior Fellow, Intel Architecture,*
*Graphics and Software, Chief Architect, Datacenter*
*Processor Architecture*
*Day 2: Rosetta: A 64-port Switch for Cray's Slingshot Interconnect*
*Steve Scott, Senior Vice President and Chief Technology*
*Officer, Cray Inc*.

---------------------------------------------------------------------------------------
This is your chance to present at what will be a very exciting
program. Submit your abstract for consideration by May 10 at:
https://easychair.org/conferences/?conf=hoti26
*If you want to submit but do not yet have management approval,*
*please send an email to the Program co-chairs at program at hoti.org
<program at hoti.org>*
*with the title of your proposed presentation. Please follow up with the*
*abstract as described below as soon as possible afterward.*

TOPICS OF INTEREST:
* Novel and innovative interconnect architectures
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Advanced chip-to-chip communication technologies
* Optical interconnects
* Protocols and interfaces for inter-processor communication
* Survivability and fault-tolerance of interconnects
* High-speed packet processing engines and network processors
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Pb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance interconnects
* Traffic characterization for HPC systems and commercial data centers
* Software for Network/Fabric Bring-up, Configuration and Performance
Management, e.g., OpenFlow or OpenSM
* Data Center networking
-----------------------------------------------------------------------------------------
AUTHOR INFORMATION AND FORMAT
Presentations at HOT Interconnects are in the form of
30-minute talks in PowerPoint or .PDF. Presentation
slides will be mounted on the website www.hoti.org ,
accessible to attendees during and after the conference
by password.
A select group of presenters will be encouraged to submit
a full-length paper for publication in a special issue of IEEE Micro.
A $500 award will be given for the best student presentation.
Support will be offered for student travel.
Regular Presentations consist of a title, an extended
abstract (two to four pages) and the presenter's
contact information (name, affiliation, job title, address,
phone(s), fax, and email). Please indicate whether you
have submitted, intend to submit, or have already
presented or published a similar or overlapping
submission to another conference or journal. Also
indicate if you would like the submission to be held
confidential. If so indicated, these submissions
remain confidential until the first day of the conference.
Submissions are evaluated by the Program Committee on
the basis of their impact on network and overall interconnect
performance, the degree of innovation, use of advanced technology,
potential market significance, and anticipated interest to the audience.
Research and software contributions will be evaluated
with similar criteria. To the extent that you are
describing a product, indicate its status - design,
development, tape out, silicon, shipping, etc.
To submit, go to https://easychair.org/conferences/?conf=hoti26
Authors will be notified of acceptance decisions by May 31,
2019. Send questions relating to the program to the
program chairs Khaled Hamidouche and Ryan Grant at:
program at hoti.org .
and questions relating to conference operation
to the general chairs, Eitan Zahavi and Don Draper, at:
info at hoti.org
Check the HOT INTERCONNECTS 26 web page for updates:
www.hoti.org
-----------------------------------------------------------------------------------------
Sponsor Hot Interconnects! Email: sponsor at hoti.org
Many thanks to Intel who is sponsoring by supplying an excellent
venue in SC12.
----------------------------------------------------------------------------------------
Sponsored by the Technical Committee on Microprocessors and
Microcomputers of the IEEE Computer Society
-----------------------------------------------------------------------------------------
To unsubscribe from the HOT-INTERCONNECT list, click the following link:
https://cs-listserv.ieee.org/cgi-bin/wa?SUBED1=HOT-INTERCONNECT&A=1
------------------------------------------------------------------------------------------

-- 
 K.H