[hpc-announce] Call for Position Papers: ModSim-18

[Bayyapu, Neelima]

This post is edited by the admin on behalf of ahoisie at bnl.gov

Call for Position Papers

ModSim 2018
Workshop on Modeling & Simulation of Systems and Applications
August 15-17, 2018, at the University of Washington, Seattle

To promote advancements in ModSim research, we are soliciting community input in the form of position papers. If accepted, author(s) will be invited to offer a presentation at the annual gathering of our community, the ModSim 2018 Workshop.

Workshop URL: https://www.bnl.gov/modsim2018/
Submission URL: https://www.bnl.gov/modsim2018/callforpapers.php
EasyChair Submission Deadline: Friday, June 01, 2018
Notification of acceptance: Friday, June 29, 2018

Submission Guidelines: Abstracts should be submitted according to the guidelines described at https://www.bnl.gov/modsim2018/callforpapers.php and in EasyChair.

The ModSim 2018 Organizing Committee will review these abstracts and invite selected contributors to participate in the workshop. Responsive submissions will be made public via the workshop website, and selected papers may be included in post-workshop proceedings (pending final publication decision).

ModSim 2018 Topics

ModSim of Subsystems
Memory device, storage, and input/output (I/O) manufacturing and design, as well as how these technologies are used by application software, profoundly impact current and future computing systems in terms of their performance, function, reliability, predictability, power dissipation, and cost. Existing technologies are perceived as limited in terms of power, capacity, and bandwidth. Meanwhile, emerging approaches offer the potential to overcome both technology- and design-related limitations to answer the requirements of many different applications. Hence, modeling these subsystems is tremendously important, especially in affording the ability to characterize and quantify data movement behavior in large-scale systems. Submissions should relate to subsystems technology areas and their characterization or provide use cases that describe how ModSim can help overcome significant challenges.

ModSim of Resilience
This thrust area will tackle modeling of resilience for the entire stack from architecture to system software to applications. Some themes of interest include: fault models for architectural features (post-14-nm CMOS, undervolting, overclocking, etc.), application- and system-level fault modeling and injection, modeling of resilience solutions that address the performance-power-resilience triad holistically, and new approaches to resilience ModSim and associated validation.

Methodology for Modeling, Simulation, and Emulation of Performance, Power, and Reliability
This thrust area will address new methods, tools, and frameworks for modeling, simulation, and emulation, as well as new areas for applying ModSim of performance, power, and reliability at all scales of computing. Emphasis will be placed on the novelty of the approach and use of ModSim rather than specific successes of existing methodologies.

ModSim of Open Hardware
Over the last decade, there has been notable growth in an open-source ecosystem of models (cores, caches, etc.) and design tools (HDL simulators, languages, etc.). At the same time, there also has been a slowing of the advantages of process technology and significant increases in cost of moving to a new technology node. These trends suggest the emergence of an Internet-Protocol-based hardware design flow for high-performance computing nodes based on open-source component models and design tools, which is motivated, in large part, by successes of the open-source software movement. Submissions can address all aspects of the open-source hardware design ecosystem from ModSim challenges, IP component availability, design tools, interfaces, and methodologies.