[hpc-announce] Call for Papers – ISVLSI 2018 - July 9-11, 2018, Hong Kong SAR, China

[Jingtong Hu]

IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI

July 9-11, 2018   Hong Kong SAR, China

www.isvlsi.org <http://www.isvlsi.org/>
http://www.eng.ucy.ac.cy/theocharides/isvlsi18/ <http://www.eng.ucy.ac.cy/theocharides/isvlsi18/>
 

CALL FOR PAPERS

 

Paper Submission Deadline: February 2, 2018

Acceptance Notification: April 2, 2018

Submission of Final Version: May 12, 2018

Special Session Proposal Deadline: February 23, 2018

The Symposium explores emerging trends and novel ideas and concepts covering a broad range of topics in the area of VLSI: from VLSI circuits, systems and design methods, to system level design and system-on-chip issues, to bringing VLSI methods to new areas and technologies like nano- and molecular devices, hardware security, etc. ISVLSI 2018 highlights a special theme of Internet-of-Things. Future design methodologies are also one of the key topics at the Symposium, as well as new EDA tools to support them. Over three decades the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI, bringing together leading scientists and researchers from academia and industry. Selected high quality papers from ISVLSI 2018 will be considered for two Journal Special Issues: 1) IEEE Transactions on Nanotechnology (impact factor 2.485), and 2) IEEE Consumer Electronics Magazine (impact factor 1.153). The Symposium has established a reputation in bringing together well-known international scientists as invited speakers; the emphasis on high quality will continue at this and future editions of the Symposium.

 

Contributions are sought in the following areas:

1) Analog and Mixed-Signal Circuits (AMS): Analog/mixed-signal circuits, RF and communication circuits, adaptive circuits, interconnects, VLSI aspects of sensor and sensor network.

2) Computer-Aided Design and Verification (CAD): Hardware/software co-design, logic and behavioral synthesis, simulation and formal verification, physical design, signal integrity, power and thermal analysis, statistical approaches.

3) Digital Circuits and FPGA based Designs (DCF): Digital circuits, chaos/neural/fuzzy-logic circuits, high speed/low-power circuits, energy efficient circuits, near and sub-threshold circuits, memories, FPGA designs, FPGA based systems.

4) Emerging and Post-CMOS Technologies (EPT): Nanotechnology, molecular electronics, quantum devices, optical computing, spin-based computing, biologically-inspired computing, CNT, SET, RTD, QCA, reversible logic, and CAD tools for emerging technology devices and circuits.

5) System Design and Security (SDS): Structured and Custom Design methodologies, microprocessors/micro-architectures for performance and low power, embedded processors, analog/digital/mixed-signal systems, NoC, power and temperature aware designs, Hardware security, Cryptography, watermarking, and IP protection, TRNG and security oriented circuits, PUF circuits.

6) Testing, Reliability, and Fault-Tolerance (TRF): Analog/digital/mixed-signal testing, design for testability and reliability, online testing techniques, static and dynamic defect- and fault-recoverability, and variation aware design.

 

The Symposium Program will include contributed papers and speakers invited by the Program Committee as well as a poster session. The keynotes, special sessions and Student Research Forum are planned as well. Authors are invited to submit full-length, original, unpublished papers. To enable blind review, the author list should be omitted from the main document. Initial submissions to the conference are limited to six pages in PDF format.

 

 

ISVLSI 2018 ORGANIZING COMMITTEE

 

General Chairs

Wei Zhang, Hong Kong University of Science and Technology, Hong Kong

Jason Xue, City University of Hong Kong, Hong Kong

Zili Shao, Hong Kong Polytechnic University, Hong Kong

 

TPC Chairs

Hai Li, Duke University, USA

Yu Wang, Tsinghua University, China

Wujie Wen, Florida International University, USA

 

Special Session Chairs

Bei Yu, The Chinese University of Hong Kong, China

Yuan-Hao Chang, Academia Sinica, Taiwan

 

Web Chair

Theocharis Theocharides, University of Cyprus, Cyprus

 

PhD Forum Chair

Anupam Chattopadhyay, Nanyang Technological University, Singapore

 

Publication Chairs

Mahdi Nikdast, Colorado State University at Boulder, USA

Chenchen Liu, Clarkson University, USA

 

Publicity Chairs

Guangyu Sun, Peking University, China

Muhammad Shafique, Vienna University of Technology, Austria

Jingtong Hu, University of Pittsburgh, USA

Masaaki Kondo, The University of Tokyo, Japan

Chun-Yi Lee, National Tsinghua University, Taiwan

 

Financial Chair

Duo Liu, Chongqing University, China

 

Registration Chair

Weichen Liu, Nanyang Technological University, Singapore

 

Local Arrangement Chair

Nan Guan, Hong Kong Polytechnic University, Hong Kong

Ray Chak-Chung Cheung, City University of Hong Kong, Hong Kong

 

Industrial Liaison Chairs

Wei Zhang, Hong Kong University of Science and Technology, Hong Kong

Jürgen Becker, Karlsruhe Institute of Technology, Germany

 

Steering Committee

Jürgen Becker, Karlsruhe Institute of Technology, Germany, Chair

Saraju P. Mohanty, University of North Texas, USA, Vice-Chair

.

Hai (Helen) Li, Duke University, USA

Lionel Torres, University of Montpellier, France

Michael Hübner, Ruhr-University of Bochum, Germany

Nikos Voros, Technological Educational Institute of Western Greece, Greece

Ricardo Reis, Universidade Federal do Rio Grande do Sul, Brazil

Sandip Kundu, University of Massachusetts, Amherst, USA

Sanjukta Bhanja, University of South Florida, USA

Susmita Sur-Kolay, Indian Statistical Institute, Kolkata, India

Vijaykrishnan Narayanan, Pennsylvanian State University, USA





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