[hpc-announce] [Deadline Extened] IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2018), March 4th, 2018

Jingtong Hu hujingtong at gmail.com
Mon Feb 26 10:29:20 CST 2018



July 9-11, 2018   Hong Kong SAR, China

www.isvlsi.org <http://www.isvlsi.org/>
www.isvlsi2018.org <http://www.isvlsi2018.org/>



Regular Paper Deadline: March 4th, 2018 (Final extension)

Acceptance Notification: April 2, 2018

Student Forum Paper Deadline: March 25th, 2018

Special Session Proposal Deadline: March 11th, 2018



The Symposium explores emerging trends and novel ideas and concepts covering a broad range of topics in the area of VLSI: from VLSI circuits, systems and design methods, to system level design and system-on-chip issues, to bringing VLSI methods to new areas and technologies like nano- and molecular devices, hardware security, etc. Future design methodologies are also one of the key topics at the Symposium, as well as new EDA tools to support them. Over three decades the Symposium has been a unique forum promoting multidisciplinary research and new visionary approaches in the area of VLSI, bringing together leading scientists and researchers from academia and industry. The conference proceeding will be indexed in the IEEE Xplore digital library. Selected high quality papers from ISVLSI 2018 will be further considered for two Journal Special Issues: 1) IEEE Transactions on Nanotechnology (impact factor 2.485), and 2) IEEE Consumer Electronics Magazine (impact factor 1.153). The Symposium has established a reputation in bringing together well-known international scientists as invited speakers; the emphasis on high quality will continue at this and future editions of the Symposium.


Contributions are sought in the following areas:

·      Analog and Mixed-Signal Circuits (AMS)

·      Computer-Aided Design and Verification (CAD)

·      Digital Circuits and FPGA based Designs (DCF)

·      Emerging and Post-CMOS Technologies (EPT)

·      System Design and Security (SDS)

·      Testing, Reliability, and Fault-Tolerance (TRF)


The Symposium Program will include contributed papers as well as a poster session. Authors are invited to submit full-length, original, unpublished papers. To enable blind review, the author list should be omitted from the main document. Initial submissions to the conference are limited to six pages in PDF format.



ISVLSI 2018 will also host a student research forum, like the past editions, to allow recently graduated or final-phase BS/MS/PhD students to showcase their research work to a broad audience in the VLSI community from both industry and academia. 



·      Students who have finished their BS/MS/PhD dissertation/thesis within the last 12 months or students who are currently enrolled in a final year BS/MS/PhD program.

·      Research topics of relevance to ISVLSI community.

·      Students, who presented in prior ISVLSI student research forum, must clearly indicate additional (30%) new technical content compared to the previous submission.


Benefits for the Selected Researchers

·      Up to 6-page publication in the ISVLSI 2018 proceedings (indexed in IEEE eXplore).

·      10 minutes oral presentation in the Student Research Forum poster session, and networking with industry representatives, such as Cadence.

·      50% discount on the registration fee for the top 5 submissions.

·      Travel support for selected researchers.

·      Best Student Research Forum paper award


Submission Guidelines:

Please submit a paper up to 6 pages in IEEE conference format describing problem addressed in the thesis, novelty of the solution, observations and analysis. Focus should be on the scientific challenges and the originality and quality of the solutions. Author count limits to 2 (BS/MS/PhD candidate and advisor). The submission should not include author information to enable blind review.


Submission Link: https://easychair.org/account/signin.cgi?key=64914828.G1ukmo9izfMyOCkZ <https://easychair.org/account/signin.cgi?key=64914828.G1ukmo9izfMyOCkZ>

Travel info: As a Special Administrative Region of China, visitors from most countries can enter Hong Kong without a visa for periods of 7 to 90 days, including US, Europe, Japan, South Korea, India, etc.


TPC Chairs

Hai (Helen) Li, Duke University, USA (hai.li at duke.edu)

Yu Wang, Tsinghua University, China (yu-wang at tsinghua.edu.cn)

Wujie Wen, Florida International University, USA (wwen at fiu.edu)


Student Research Forum Chairs

Anupam Chattopadhyay, Nanyang Technological University, Singapore

(anupam at ntu.edu.sg <mailto:anupam at ntu.edu.sg>)

Zheng Wang, Shenzhen Institutes of Advanced Technology of the Chinese Academy of Science, China (zheng.wang at siat.ac.cn)

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