[hpc-announce] IEEE Trans. on Computers Special Issue on Non-volatile Memory Technologies (Submission Deadline: Feb. 28, 2018)
Yuan-Hao Chang
johnson at iis.sinica.edu.tw
Mon Feb 19 19:57:51 CST 2018
Dear Colleagues,
The IEEE Transactions on Computers Special Issue on: “Emerging
Non-volatile Memory Technologies: from Devices to Architectures and
Systems” is open for submissions through 28 February 2018.
The Call For Papers lists the topics within the scope of the Special
Issue:
https://www.computer.org/cms/Computer.org/transactions/cfps/cfp_tcsi_enmt.pdf
Submissions can be made through the
https://mc.manuscriptcentral.com/tc-cs website by choosing "Special
Section on Emerging Non-volatile Memory Technologies" and also
specifying within the cover letter accompanying the submission.
Best Regards,
Yuan-Hao Chang, Guest Editor
Jingtong Hu, Guest Editor
Mehdi B. Tahoori, Guest Editor
Ronald F. DeMara, Topical Editor
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CALL FOR PAPERS
IEEE Transactions on Computers
Special Section on Emerging Non-volatile Memory Technologies:
from Devices to Architectures and Systems
Important Dates:
Submission deadline: February 28, 2018
First decision to authors: May 15, 2018
Revision due: July 15, 2018
Acceptance notification: August 31, 2018
Publication material due: September 30, 2018
Special Section publication: First half of 2019
Call for Papers:
Emerging non-volatile memory (NVM) technologies (e.g., 3D NAND flash,
STT-MRAM,
ReRAM, PCM, FeRAM) have attracted significant interest in recent years
because
of the fast-growing performance and capacity demands on memory and
storage in
the big data era. Well-known examples are the 3D XPoint memory (or Optane
storage devices), along with various NVDIMM hybrid memory and MRAM device
technologies. They have shown potential towards larger memory and storage
capacities with nearly zero leakage power, while extending memory/system
architecture design approaches. The unique characteristics of NVM
technologies
not only introduce new opportunities, but simultaneously create
challenges to
the designs at multiple levels of abstraction in computer systems,
including
those of device management, memory/storage architecture, and system design.
Thus, for the emerging NVM technologies, there is an urgent need for
technology
innovation, modeling, analysis, design, and application, ranging from
device-level to system-level.
In this special section, IEEE Transactions on Computers seeks original
manuscripts which explicitly advance the topics listed below. However,
purely
theoretical papers will not be suitable for consideration in this
special section.
Memory/Storage Architecture:
- Non-volatile register/cache design
- Non-volatile processor design
- NVM memory architectures
- NVM memory/storage management
- NVM device management regarding the issues of reliability, power,
performance, etc.
- Unification of memory and storage via NVM
- Neuromorphic architectures and processing-in-memory using
non-volatile
devices
- Hybrid NVM design, e.g., NVDIMM
System Design and Middleware:
- Compiler optimization for NVM
- System virtualization with NVM
- Non-volatile computing systems
- File system design for NVM
- NVM-based system modeling
- NVM-based system analysis
- NVM-aware algorithms (e.g., machining learning and neural network)
designs
- In-memory computing applications leveraging NVM
Submission:
The submitted papers must describe original research which is not published
nor currently under review by other journals or conferences. Extended
conference papers should contain at least 50% new content and should
include a list of changes and a copy of the previously published
manuscript.
All submissions will be peer-reviewed for originality, significance,
technical soundness, practical contribution, and clarity. Authors are
invited to submit their manuscripts to IEEE Transactions on Computers
at https://mc.manuscriptcentral.com/tc-cs.
Please address all correspondence regarding this Special Section to the
Guest Editors at tcsinvm at iis.sinica.edu.tw
Guest Editors
- Yuan-Hao Chang, Institute of Information Science, Academia Sinica
- Jingtong Hu, Department of Electrical and Computer Engineering,
University of Pittsburgh
- Mehdi B. Tahoori, Institute of Computer Science & Engineering,
Karlsruhe Institute of Technology
Topical Editor
- Ronald F. DeMara, Department of Electrical and Computer
Engineering, University of Central Florida
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