[hpc-announce] IEEE Trans. on Computers Special Issue on Non-volatile Memory Technologies (Submission Deadline: Feb. 28, 2018)

Yuan-Hao Chang johnson at iis.sinica.edu.tw
Mon Feb 19 19:57:51 CST 2018

Dear Colleagues,

The IEEE Transactions on Computers Special Issue on: “Emerging 
Non-volatile Memory Technologies: from Devices to Architectures and 
Systems” is open for submissions through 28 February 2018.

The Call For Papers lists the topics within the scope of the Special 

Submissions can be made through the 
https://mc.manuscriptcentral.com/tc-cs website by choosing "Special 
Section on Emerging Non-volatile Memory Technologies" and also 
specifying within the cover letter accompanying the submission.

Best Regards,
Yuan-Hao Chang, Guest Editor
Jingtong Hu, Guest Editor
Mehdi B. Tahoori, Guest Editor
Ronald F. DeMara, Topical Editor

                             CALL FOR PAPERS

                    IEEE Transactions on Computers
     Special Section on Emerging Non-volatile Memory Technologies:
               from Devices to Architectures and Systems

Important Dates:
     Submission deadline: February 28, 2018
     First decision to authors: May 15, 2018
     Revision due: July 15, 2018
     Acceptance notification: August 31, 2018
     Publication material due: September 30, 2018
     Special Section publication: First half of 2019

Call for Papers:
Emerging non-volatile memory (NVM) technologies (e.g., 3D NAND flash, 
ReRAM, PCM, FeRAM) have attracted significant interest in recent years 
of the fast-growing performance and capacity demands on memory and 
storage in
the big data era. Well-known examples are the 3D XPoint memory (or Optane
storage devices), along with various NVDIMM hybrid memory and MRAM device
technologies. They have shown potential towards larger memory and storage
capacities with nearly zero leakage power, while extending memory/system
architecture design approaches. The unique characteristics of NVM 
not only introduce new opportunities, but simultaneously create 
challenges to
the designs at multiple levels of abstraction in computer systems, 
those of device management, memory/storage architecture, and system design.
Thus, for the emerging NVM technologies, there is an urgent need for 
innovation, modeling, analysis, design, and application, ranging from
device-level to system-level.

In this special section, IEEE Transactions on Computers seeks original
manuscripts which explicitly advance the topics listed below. However, 
theoretical papers will not be suitable for consideration in this 
special section.

Memory/Storage Architecture:
     - Non-volatile register/cache design
     - Non-volatile processor design
     - NVM memory architectures
     - NVM memory/storage management
     - NVM device management regarding the issues of reliability, power,
       performance, etc.
     - Unification of memory and storage via NVM
     - Neuromorphic architectures and processing-in-memory using 
     - Hybrid NVM design, e.g., NVDIMM

System Design and Middleware:
     - Compiler optimization for NVM
     - System virtualization with NVM
     - Non-volatile computing systems
     - File system design for NVM
     - NVM-based system modeling
     - NVM-based system analysis
     - NVM-aware algorithms (e.g., machining learning and neural network)
     - In-memory computing applications leveraging NVM

The submitted papers must describe original research which is not published
nor currently under review by other journals or conferences. Extended
conference papers should contain at least 50% new content and should
include a list of changes and a copy of the previously published 
All submissions will be peer-reviewed for originality, significance,
technical soundness, practical contribution, and clarity.  Authors are
invited to submit their manuscripts to IEEE Transactions on Computers
at https://mc.manuscriptcentral.com/tc-cs.
Please address all correspondence regarding this Special Section to the
Guest Editors at tcsinvm at iis.sinica.edu.tw

Guest Editors
     - Yuan-Hao Chang, Institute of Information Science, Academia Sinica
     - Jingtong Hu, Department of Electrical and Computer Engineering, 
University of Pittsburgh
     - Mehdi B. Tahoori, Institute of Computer Science & Engineering, 
Karlsruhe Institute of Technology

Topical Editor
     - Ronald F. DeMara, Department of Electrical and Computer 
Engineering, University of Central Florida

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