[hpc-announce] TSP 2018 | IEEE R8 | Special Session on Multivariate Data Analysis and Knowledge Discovery – From Theory to Applications in Athens, Greece, July 4-6, 2018

[IEEE Technically Co-Sponsored TSP 2018]

***   Special Session on Multivariate Data Analysis and Knowledge 
Discovery – From Theory to Applications   ***
***        http://tsp.vutbr.cz/documents/TSP2018_CfP_SS4_v1.pdf ***


2018 41st International Conference on Telecommunications and Signal 
Processing (TSP)
July 4-6, 2018, Athens, Greece
Web: http://tsp.vutbr.cz/

Full Paper Submission: February 15, 2018

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Technically co-sponsored by IEEE Region 8 (Europe, Middle East and 
Africa), IEEE Greece Section, IEEE Czechoslovakia Section, and IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2018 Proceedings, containing presented papers at the Conference, 
will be submitted for indexing to the IEEE Xplore® Digital Library 
registered under IEEE Conference Record #43564, SCOPUS, Conference 
Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google 
Scholar databases.

Authors of the best rated and presented papers will be invited for 
publishing in special issues of international journals.
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Dear Colleague,

Data analysis and knowledge discovery are research areas at the 
intersection of artificial intelligence, machine learning, data mining 
and statistics. Many areas in science and engineering have become 
dependent on multivariate data, e.g., biomedical signal processing, 
geoscience and remote sensing, multimedia data mining. With the 
continuous technological improvements of sensors, large volumes of data 
have been collected. This fact requires the development of powerful 
tools and methods to process and interpret the available information. 
Under the framework of 2018 41st International Conference on 
Telecommunications and Signal Processing (TSP) held during July 4-6, 
2018 in Athens, Greece, the aim of this special session is to extend the 
use of data analysis and knowledge discovery tools among the signal 
processing community, to bridge the gap between researchers from 
academia and industry professionals and to identify possible 
collaborations. This special session will provide a forum of discussion 
on the recent advances in the multivariate data analysis and pattern 
recognition domains and on the impact that these techniques have on 
adjacent domains. Topics include, but are not limited to:

- Models and method for extracting relevant information
- Pattern Recognition
- Data Mining
- Information retrieval
- Dimensionality reduction
- Frequent pattern mining
- Multisensor diversity in remote sensing, biomedical engineering, 
multimedia
- Big Data
- Data visualization and communication

For more details please visit the Conference website at 
http://tsp.vutbr.cz/?page_id=3754#SS4-18 .

EDITORIAL BOARD:

- Prof. Corneliu Burileanu — University Politehnica of Bucharest, 
Romania (E-mail: corneliu.burileanu at upb.ro)
- Dr. Anamaria Radoi — University Politehnica of Bucharest, Romania 
(E-mail: anamaria.radoi at upb.ro)

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint 
Chapter, to recognize outstanding technical contributions by students, 
as evidenced by the quality of papers, their presentations, and their 
technical excellence, the authors of the Best 3 Student Papers will be 
awarded during the conference by the Technical Committee. The Best 
Student Paper Award consists in a Certificate of Appreciation Plaque and 
an IEEE Student or IEEE Graduate Student membership for 2019.

ORGANIZERS:

The TSP 2018 is IEEE technically co-sponsored Conference organized in 
cooperation with seventeen universities:

- Brno University of Technology, Department of Telecommunications, Brno, 
Czech Republic
- Budapest University of Technology and Economics, Department of 
Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication 
Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, 
Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication 
Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and 
Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of 
Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and 
Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, 
Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, 
Bulgaria
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de 
Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, 
Slovenia
- University of Osijek, Faculty of Electrical Engineering, Computer 
Science and Information Technology Osijek, Osijek, Croatia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of 
Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical 
Engineering, Szczecin, Poland

IMPORTANT DATES:

Full Paper Submission: February 15, 2018
Notification of Paper Acceptance: April 15, 2018
Final Paper Submission: April 30, 2018
Authors' Early Registration and Payment: May 10, 2018
Authors' Late Registration and Payment: May 20, 2018
Listeners' Registration: July 4, 2018
Conference: July 4-6, 2018

CONTACTS:

For more information please visit the Conference website at 
http://tsp.vutbr.cz/. We are also ready to answer your questions emailed 
to tsp at feec.vutbr.cz.

Looking forward to meeting you in Athens, Greece.

With best regards,

Norbert Herencsar and Costas Psychalinos
TSP 2018 General Co-Chairs

Web: http://tsp.vutbr.cz/
E-mail: tsp at feec.vutbr.cz

Follow us on:
  - Facebook https://www.facebook.com/tspconf/
  - Twitter https://twitter.com/tspconf/
===================================================
doc. Ing. Norbert Herencsar, Ph.D., IEEE Senior Member - IEEE 
Czechoslovakia Section SP/CAS/COM Joint Chapter Chair
Department of Telecommunications
Faculty of Electrical Engineering and Communication
Brno University of Technology
Technicka 3082/12
616 00 Brno
Czech Republic

&

Prof. Dr. Costas Psychalinos, IEEE Senior Member
Physics Department
University of Patras
26504 Rio Patras
Greece

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TSP Organizers reserve the right to exclude a paper from distribution 
after the Conference (e.g., non-indexing in IEEE Xplore® and other 
databases) if the paper is not presented at the Conference. However, 
this paper will be distributed as part of the Conference proceedings 
issued on an USB drive.
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