[hpc-announce] Bench'18 (Co-located with IEEE Big Data 2018) Call for Papers

[gaowanling]

---Apologies if you receive multiple copies of this CFP---
Bench'18 (2018 International Symposium on Benchmarking, Measuring and Optimizing) Call for Papers URl: http://prof.ict.ac.cn/Bench18 Co-located with IEEE Big Data 2018 December 10-13, 2018, Seattle, WA, USA Introduction Benchmarking, measuring, and optimizing are fundamental activities in human being’s lives. This symposium (Bench 18) is dedicated to benchmarking, measuring, and optimizing complex systems, including (but not limited to) Big Data, AI, chainblock, datacenter, cloud and warehouse-scale computing, high performance computing, Mobile Robotics, edge and frog computing，Big Scientific data, IoT, and the other miscellaneous things, i.e., education systems, financial systems, and power systems. In addition, we encourage publishing benchmark specifications and the summaries of the open-source benchmarking projects. Improtant Dates
There are two submission opportunities:

Deadline for authors who need a U.S. visa
TimeEvent
August 20, 2018Electronic submission of full papers
Oct 9, 2018Notification of paper acceptance
Nov 25, 2018Camera-ready of accepted papers
Dec 10-12, 2018Conference

Deadline for authors who do not need a U.S. visa
TimeEvent
Sep 20, 2018Electronic submission of full papers
Nov 9, 2018Notification of paper acceptance
Nov 25, 2018Camera-ready of accepted papers
Dec 10-12, 2018Conference
Paper Submission
https://wi-lab.com/cyberchair/2018/bigdata18/scripts/submit.php?subarea=SP04undisplay_detail=1wh=/cyberchair/2018/bigdata18/scripts/ws_submit.php
Papers should be no more than 10 pages, and be formatted to IEEE Computer Society Proceedings Manuscript Formatting Guidelines (see link to "formatting instructions" below).

Formatting Instructions
8.5" x 11" (DOC,PDF)
LaTex Formatting Macros
Topics of Interest
We solicit papers in all areas related to benchmarking, measuring, and optimizing systems. Topics of interest include (but are not limited to):
Big data domains
Artificial intelligence
NewSQL and distributed database systems
Blockchain
Datacenter, cloud and warehouse-scale computing
High performance computing
Mobile Robotics
Edge and fog computing
Big scientific data
Internet of Things (IoT)
Education, financial and power system
Program Committee
Lizy K. John, The University of Texas at Austin USA
Vijay Janapa Reddi, University of Texas at Austin USA and Google
Wenguang Chen, Tsinghua University China
Yunji Chen, ICT, CAS China
Piotr Luszczek, University of Tennessee USA
Rui Hou, Institute of Information Engineering, CAS China
Yueguo Chen, Renmin University of China
H. Peter Hofstee, IBM USA
Cheqing Jin, East China Normal University China
Junzhao Du, Xidian University China
Hyogi Sim, Oak Ridge National Laboratory USA
Weining Qian, East China Normal University China
Zheng Cao, Alibaba China
Matthias Nicola, IBM Germany
Zhihui Du, Tsinghua University China
Bin Ren, College of William and Mary USA
Hua Chen, ICT, CAS China
Jiaquan Gao, Nanjing Normal University China
Jiannan Ouyang, Facebook USA
Xueming Si, Fudan University China
Yanjun Wu, Institute of Software Chinese Academy of Sciences China
Lucas Mello Schnorr, Federal University of Rio Grande do Sul (UFRGS) Brazil
Yunquan Zhang, ICT, CAS China
Shengzhong Feng, Shenzhen Institutes of Advanced Technology, CAS China
Zhen Jia, Princeton University USA
Zhibin Yu, Shenzhen Institutes of Advanced Technology, CAS China
Dapeng Wang, Institute of Software Chinese Academy of Sciences China
Bo Wu, Colorado School of Mines USA
Shaoliang Peng, National University of Defense Technology China
Yong Qi, Xi'an jiaotong University China
Gwangsun Kim, Arm Inc., Austin, Texas USA
Zujie Ren, Hangzhou Dianzi University China
Xiaoyi Lu, The Ohio State University USA
Lei Wang, ICT, CAS China
Jianhui Li, Computer Network Information Center, CAS China
Jianwu Wang, University of Maryland, Baltimore County USA
Kenli Li, Hunan University China
Rui Han, ICT, CAS China
Jungang Xu, Chinese academy of sciences China
Xu Liu, College of William and Mary USA
Tong Wu, National Institute of Metrology, China
Li ZHA, University of the Chinese Academy of Sciences
Lei Liu, ICT, CAS China
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