[hpc-announce] Deadline Extension: HotI 2017 - May 19, Abstracts Due May 12th

[Grant, Ryan Eric (-EXP)]

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                 CALL FOR PAPERS - DEADLINE EXTENSION
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   25th International Symposium on High Performance Interconnects 2017
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          Ericsson, Santa Clara, California, August 23-25, 2017
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* Paper abstract deadline:     EXTENDED: May 12th, 2017
* Submission deadline:         EXTENDED: May 19th, 2017
* Notification of acceptance:  June 16th, 2017

Hot Interconnects is the premier international forum for researchers and
developers of state-of-the-art hardware and software architectures and
implementations for interconnection networks of all scales, ranging from
multi-core on-chip interconnects to those within systems, clusters,data
centers, and clouds.  This yearly conference is attended by leaders in
industry and academia. The atmosphere provides for a wealth of
opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, networking
technologies, and communication protocols for high-performance
interconnection networks. This conference is directed particularly at new
and exciting technology and product innovations in these areas.
Contributions should focus on real experimental systems, prototypes, or
leading-edge products and their performance evaluation. In past year¹s the
best papers on interconnect microarchitecture have been invited to submit
extended versions of their papers to special journal editions, we are
pursing this once again this year.

Building on last year's successful technical program comprising keynotes,
technical sessions, and panels on networking for datacenters and
high-performance computing, the 2017 edition of Hot Interconnects is
generously hosted by Ericsson at their campus in Santa Clara, CA.

This year's conference focuses on HPC and Hyperscale Data Centers
Interconnects and their use in traditional and non-traditional
applications, such as large scale machine learning. We hope you can join us
there.

We invite paper submissions across a wide range of topics and levels,
ranging from fundamentals to the latest advances in hot topic areas.

Topics of interest include, but are not limited to:

* Novel and innovative interconnect architectures
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Advanced chip-to-chip communication technologies
* Optical interconnects Protocol and interfaces for inter-processor
  communication 
* Survivability and fault-tolerance of inter-connects
* High-speed packet processing engines and network processors
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Pb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud & grid computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance inter-connects
* Traffic characterization for HPC systems and commercial data centers
* Software-defined networking and software overlay networks
* Software for network bring-up, configuration and performance management
  (OpenFlow, OpenSM)
* Data Center Networking

SCHEDULE AND SUBMISSION PROCEDURE:

* Paper abstract deadline:      EXTENDED: May 12th, 2017
* Submission deadline:          EXTENDED: May 19th, 2017
* Notification of acceptance:   June 16th, 2017
* Symposium:                    August 29-30, 2017
* Tutorials:                    August 28, 2017

This year we invite papers to be submitted either as regular, long papers
(6-8 pages) or as short papers (3-4 pages). Short papers could be
positional papers, industry papers, or papers describing hot-off-the-press
breaking research results, and will judged accordingly and independently
from the regular long papers.

* Papers need sufficient technical detail to judge quality and
  suitability for presentation.
* Submissions should include title, author, abstract, and paper in
  double-column, IEEE format.
* Long paper limit: 8 pages, single-spaced, 2 columns.
* Short paper limit: 4 pages, single-spaced, 2 columns.
* Papers should be submitted electronically through EasyChair at
  https://www.easychair.org/conferences/?conf=hoti25
* Paper title and abstract should be submitted by May 12th.
* Full paper manuscript should be submitted by May 19th.
* Accepted papers will be published in proceedings by the
  IEEE Computer Society.
* Regular paper presentations are 30-minute talks in a single-track
  conference format.

AWARDS:

An award will be given to the best student paper. To be eligible for the
best paper award at least one of the paper authors must be a full-time
student at the time of submission. In addition, HotI will provide Student
Travel Awards. Information on travel awards can be found on our web site.

GENERAL CHAIRS 
Ada Gavrilovska, Georgia Tech
Eitan Zahavi, Mellanox
James Kempf, Ericsson


TECHNICAL PROGRAM CHAIRS
Jitu Padhye, Microsoft
Ryan E. Grant, Sandia National Laboratories

Please contact us at info at hoti.org if you have any questions.

Go to the Hot Interconnects web site for updates: www.hoti.org
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