[hpc-announce] CFP: Heterogeneity in Computing Workshop (HCW; collocated with IPDPS 2018)
Mohsen Amini
mohsen.amini at gmail.com
Sun Dec 31 15:40:13 CST 2017
Call for Papers:
27th
Heterogeneity in Computing Workshop (HCW; collocated with IPDPS 2018)
<http://goog_1285231540/>
http://hcw.eecs.wsu.edu/
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The Twenty Seventh International Heterogeneity in Computing Workshop (HCW),
May 21, 2018
Collocated with 32nd IEEE IPDPS 2018, May 21 - 25, 2018, Vancouver, British
Columbia Canada
Sponsored by the IEEE Computer Society, through the Technical Committee on
Parallel Processing (TCPP), and by the U.S. Office of Naval Research (ONR).
SUMMARY
Most modern computing systems are heterogeneous, either for organic reasons
because components grew independently as it is the case in desktop grids,
or by design to leverage the strength of specific hardware as it is the
case in accelerated systems. In any case, all computing systems have some
form of hardware or software heterogeneity that must been managed,
leveraged and understood. HCW is a venue to discuss and innovate in all
theoretical and practical aspects of heterogeneous computing:
programmability, modeling, design, applications, efficient utilization,
algorithms, etc.
TOPICS
Topics of interest include but are not limited to the following areas:
Heterogeneous multicore systems and architectures: Design, exploration, and
experimental analysis of heterogeneous computing systems such as GPGPUs,
heterogeneous systems-on-chip (SoC), accelerator systems (e.g., Xeon Phi),
FPGAs, big.LITTLE, and application-specific architectures.
Heterogeneous parallel and distributed systems: Design and analysis of
computing grids, cloud systems, hybrid clusters, datacenters,
geo-distributed computing systems, and supercomputers.
Algorithms for heterogeneous systems: Parallel algorithms for solving
problems on heterogeneous systems (multicores, hybrid clusters, grids or
clouds); strategies for scheduling and allocation on heterogeneous 2D and
3D multicore architectures; scheduling and resource management on
large-scale and parallel heterogeneous systems.
Deep-memory hierarchies: Design and analysis of memory hierarchies with
SRAM, DRAM, Flash/SSD and HDD technologies; NUMA architectures; cache
coherence strategies; novel memory systems such as phase-change RAM,
magnetic (e.g., STT) RAM, 3D Xpoint/crossbars, and memristors.
On-chip and off-chip network architectures: Network-on-chip (NoC)
architectures and protocols for heterogeneous multicores and heterogeneous
applications; energy, latency, reliability, and security optimizations for
NoCs; off-chip (chip-to-chip) network architectures and optimizations;
large scale parallel and distributed network design, evaluation, and
optimizations.
Programming models and tools: Programming paradigms and tools for
heterogeneous systems; middleware and runtime systems;
performance-abstraction tradeoff; interoperability of heterogeneous
software environments; workflows; dataflows.
Modeling, characterization, and optimizations: Performance models and their
use in the design of parallel and distributed algorithms for heterogeneous
platforms, characterizations and optimizations for improving the time to
solve a problem (throughput, latency, runtime), modeling and optimizing
electric consumption (power, energy); modeling for failure management
(fault tolerance, recovery, reliability); modeling for security in
heterogeneous platforms.
Applications on heterogeneous systems: Case studies; confluence of Big Data
systems and heterogeneous systems; data-intensive computing; deep learning;
scientific computing.
IMPORTANT DATES
*Paper submission: January 25, 2018
*Author notification: February 28, 2018
*Camera Ready: March 15, 2018
PAPER SUBMISSIONS
Submissions will be done through the EasyChair. The page limit is 12 pages
(papers can range from 6 to 12 pages). Please visit the HCW 2018 website (
http://hcw.eecs.wsu.edu) for instructions on how to submit.
TECHNICAL PROGRAM COMMITTEE
Sudeep Pasricha, Colorado State University, USA (TPC CHAIR)
Domingo Gimenez, University of Murcia, Spain
Florina M. Ciorba, University of Basel, Switzerland
Hatem Ltaief, KAUST, Saudi Arabia
Francois Tessier, Argonne National Laboratory, USA
Matthias Diener, University of Illinois at Urbana-Champaign, USA
C.J. Newburn, NVidia, USA
Alexey Lastovetsky, University College Dublin, Ireland
Dana Petcu, West University of Timisoara, Romania
Daniel Cordeiro, University of São Paulo, Brazil
Ioana Banicescu, Mississippi State University, USA
Achim Streit, Karlsruhe Institute of Technology, Germany
Louis-Claude Canon, Université de Franche-Comté, France
Samuel Thibault, LaBRI, Université Bordeaux, France
Ryan Friese, Pacific Northwest National Laboratory, USA
Devesh Tiwari, Northeastern University, USA
Mohsen Amini Salehi, University of Louisiana Lafayette, USA
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