[hpc-announce] Deadline Extension for ACM GLSVLSI'18 and Call for Special Sessions

Yi-Chung Chen cheny at newpaltz.edu
Mon Dec 4 11:16:37 CST 2017


[Apologies if you receive multiple copies of this email]
***************

DEADLINE EXTENSION: New Paper Submission Deadline: December 21, 2017. (Final Deadline)

IN ADDITION, CALL FOR SPECIAL SESSIONS: http://www.glsvlsi.org/GLSVLSI18-Special-Session-CFP.pdf


The 28th Edition of the ACM Great Lakes Symposium on VLSI (GLSVLSI), Sponsored by ACM SIGDA

Conference dates: May 23-25, 2018

Location: Chicago, USA

http://www.glsvlsi.org/


The 28th edition of GLSVLSI will be held in Chicago. Original, unpublished papers describing research in the general areas of VLSI and hardware design are solicited. Please visit http://www.glsvlsi.org/·for more information. In addition to the traditional topic areas of GLSVLSI listed below, papers are solicited for a special theme of IoT Hardware and Heterogeneous Computing for Artificial Intelligence.

- Track 1: VLSI Design
- Track 2: VLSI Circuits and Power Aware Design
- Track 3: Computer-Aided Design (CAD)
- Track 4: Testing, Reliability, Fault-Tolerance
- Track 5: Emerging Computing & Post-CMOS Technologies
- Track 6: Hardware Security
- Track 7: VLSI for Machine Learning and Artificial Intelligence

Details of the requirements that each track places on submitted papers can be found on the conference website.

Paper Submission Guidelines
============================

Authors are invited to submit full-length (6 pages maximum), original, unpublished papers along with an abstract of at most 200 words. To enable blind review, the author list should be omitted from the main document. Previously published papers or papers currently under review for other conferences/journals should NOT be submitted and will not be considered. Electronic submission in PDF format to the http://www.glsvlsi.org/ website is required. Author and contact information (name, affiliation, mailing address, telephone, fax, e-mail) must be entered during the submission process.

Paper Format: Submissions should be in camera-ready two-column format, following the ACM proceedings specifications located at: http://www.acm.org/publications/proceedings-template-16dec2016and the classification system detailed at: http://www.acm.org/publications/class-2012.

Paper Publication and Presenter Registration: Papers will be accepted for regular or poster presentation at the symposium. Every accepted paper MUST have at least one author registered to the symposium by the time the camera-ready paper is submitted; at least one of the authors is also expected to attend the symposium and present the paper.

Important Dates
============================

Paper submission deadline:   December 21, 2017
Acceptance Notification:        February 13, 2018
Camera-Ready Paper Due:     March 13, 2018

Special Session Proposal submission deadline: January 15, 2018
Notification of acceptance/rejection:               January 31, 2018


Organizers
============================

General Chair:
Deming Chen
University of Illinois at Urbana-Champaign, USA

Program Co-Chairs:
Houman Homayoun
George Mason University, USA

Baris Taskin
Drexel University, USA

Finance Chair:
Weisheng Zhao
Beihang University, China

Local Chair:
Qi Zhu
Northwestern University, USA

Publicity Co-Chairs:
Robert Wille
Johannes Kepler University, Austria

Yuan-Hao Chang
Academia Sinica, Taiwan

Miao Hu
Binghamton University, USA

Special Sessions Chair:
Yanjing Li
University of Chicago, USA

Web & Registration Chair:
Yi-Chung Chen
SUNY at New Paltz, USA

Proceedings Chair:
Kyle Rupnow
Inspirit IoT, Inc., USA



More information about the hpc-announce mailing list