[hpc-announce] [IEEE MCSoC-17, Seoul, Sep 18-20, 2017] Call For Papers(Final Deadline Extension : May 14, 2017)

CFP MCSoC mcsoc.cfp at gmail.com
Fri Apr 28 02:28:30 CDT 2017

IEEE 11th International Symposium on Embedded Multicore/Many-core

Hana Square (Science & Engineering Complex) Korea University, Seoul, Korea
September 18-20, 2017

Symposium Overview

The IEEE 11th International Symposium on Embedded Multicore/Many-core
Systems-on-Chip aims to provide world’s premier forum of leading
researchers in the embedded Multicore/Many-core SoCs software, tools and
applications design areas for academia and industries. Prospective authors
are invited to submit their contributions. Submission of a paper implies
that at least one of the authors will have a full registration to the
symposium upon acceptance of the paper.

Topic of Interests

Programming: Compilers, automatic code generation methods, cross
assemblers, programming models, memory management, runtime management,
object-oriented aspects, concurrent software.

Architectures: Multicore/Many-core re-configurable platforms, memory
management support, communication, protocols, real-time systems, SoCs and
DSPs, heterogeneous architectures with HW accelerators and GPUs,
deep-learning and neural networks.

Design: Hardware specification, modeling, synthesis, low power simulation
and analysis, reliability, variability compensation, thermal aware design,
performance modeling, security issues. Interconnection Networks:
Electronic/Photonic/RF NoC architectures, Power and energy issues in NoCs,
Application specific NoC design, Timing, Synchronous /asynchronous
communication, RTOS support for NoCs, modeling, simulation, NoC support for
MCSoC, NoC for FPGAs and structured ASICs, NoC design tools, photonic
components, virtual fabrications, photonic circuits, routing, filter

Testing: Design-for-test, test synthesis, built-in-self-test, embedded test
for MCSoC. Packaging Technologies: 3D VLSI packaging technology, vertical
interconnections in 3D

Electronics, periphery interconnection between stacked ICs, area
interconnection between stacked ICs, thermal management schemes.

Real-Time Systems: real-time system design, RTOS, compilation techniques,
memory/cache optimization, interfacing and software issues, distributed
real-time systems, real-time kernels, task scheduling, multitasking design.

Benchmarks: Parallel benchmarks, workload characterization and evaluation.

Applications: Bio-medical, health-care, computational biology, Internet of
Things, smart mobility, electric vehicles, smart and connected cars,
aviation, automobile, military, consumer electronics, and novel

Special Sessions: please visit http://www.mcsoc-forum.org/

Proceedings Publication and Indexing

MCSoC-17 proceedings will be published by IEEE CS Press, which will be
included in the Computer Society Digital Library CSDL and IEEE Xplore. All
CPS conference publications are also submitted for indexing to EI’s
Engineering Information Index, Compendex, and ISI Thomson’s Scientific and
Technical Proceedings, ISTP/ISI Proceedings, and ISI Thomson.

Important Dates

Paper submission: May 14, 2017(Final Deadline Extension) Acceptance
notification: June 23, 2017 Camera ready paper: July 14, 2017


For any questions, please contact: mcsoc17 at mcsoc-forum.org
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