[hpc-announce] Extended Deadline: CFP - ReCoSoC 2016

[Almeida, Gabriel]

Dear All,

Please note that the deadline of the ReCoSoC paper submission deadline has been extended by 2 weeks.


[logoRECgreen.png]

11th International Symposium on
Reconfigurable Communication-centric Systems-on-Chip
(ReCoSoC 2016)

June 27-29, 2016, Tallinn - ESTONIA
www.recosoc.org<http://www.recosoc.org>

Call for Papers

Over the past decade ReCoSoC has established itself as a international reference event for research in the areas of reconfigurable and communication-centric systems-on-chip. Its informal and dynamic philosophy encourages technical and scientific interactions of both academic and industrial participants through presentations and special sessions reporting latest advances in the related areas.

PDF version of the CfP<http://ati.ttu.ee/recosoc2016/files/cfp-ReCoSoC16-v1.pdf>

The areas of interest include (but are not limited to) :
                • New paradigms for reconfigurable and communication-centric computing
                • Reconfigurable and adaptive embedded SoCs
                • Communication-centric design techniques at different abstraction levels
                • On-chip communication architectures
                • Low power design of reconfigurable and multiprocessor SoCs
                • Communication-aware multiprocessor embedded systems
                • OS and middleware for reconfigurable and multicore SoCs
                • Specification languages and design methodologies
                • Verification and evaluation techniques
                • Industrial case studies

ReCoSoC organizes several special sessions. You are cordially invited to submit your papers to the following special sessions:
                • Secure multi/many-core architectures in the era of Internet-of-Things
                • Emerging Technologies for Reconfigurable Systems in the Manycore Era
                • System Design for Heterogeneous 3D-Architectures
                • Smart Health

Authors are invited to submit contributions as maximum 8 page papers in IEEE conference format. ReCoSoC 2016 follows a double-blind review process: author's should not reveal their identity in the manuscript. Contribution(s) have to be submitted electronically through the EasyChair portal of the conference: https://easychair.org/conferences/?conf=recosoc2016

All accepted papers will be published in IEEE Xplore. The authors of the best papers will be invited to submit an extended version of their contribution to the journal Microprocessors and Microsystems: Embedded Hardware Design (MICPRO, Elsevier).

Important Dates:

Abstract submission deadline: April 15th, 2016 (extended!)
Full paper submission deadline: April 20th, 2016 (extended!)
Author notification: May 15th, 2016
Camera-ready due: June 5th, 2016

Committees

General Chairs:
Gert Jervan (TU Tallinn, EE)
Thomas Hollstein (TU Tallinn, EE / Frankfurt UAS, DE)

Program Chairs:
Diana Göh­rin­ger (Ruhr-Uni­ver­si­ty Bo­chum, DE)
Masoud Daneshtalab (KTH, SE)

Publicity Chair:
Gabriel Marchesan Almeida (Harman International, DE)

Publication Chair:
Kalle Tammemäe (TU Tallinn, EE)

Local Organization:
Liisi Ilu (TU Tallinn, EE)

Steering Committee:
Gilles Sassatelli (LIRMM-CNRS, France)
Manfred Glesner (TU Darmstadt, Germany)
Leandro Soares Indrusiak (University of York, UK)
Thomas Hollstein (Tallinn TU, Estonia)
Lionel Torres (LIRMM-CNRS, France)
Michel Robert (LIRMM-CNRS, France)
Peter Zipf (Univ. Kassel, Germany)
Michael Huebner (Univ. Bochum, Germany)
Juergen Becker (ITIV, KIT, Germany)
Guy Gogniat (LabStiCC - Univ Brittany, France)

Program Committee:
Pascal Benoit (LIRMM, University of Montpellier 2)
Lilian Bossuet (University of Lyon)
Eduardo de La Torre (Technical University of Madrid)
Jean-Luc Dekeyser (Inria)
Peeter Ellervee (Tallinn University of Technology)
Abdoulaye Gamatie (CNRS)
Alberto Garcia-Ortiz (U. Bremen / TEM.IDS)
Guy Gogniat (Université de Bretagne Sud - UEB)
Sergei Gontscharov (Universität Bremen)
Daniel Gregorek (University of Bremen)
Jan Haase (Helmut-Schmidt-Universität der Bundeswehr)
Jim Harkin (University of Ulster)
Dominic Hillenbrand (KIT)
Michael Huebner (Ruhr-University Bochum)
Leandro Indrusiak (University of York)
Athanasios Kakarountas (University of Central Greece)
Chrysovalantis Kavousianos (University of Ioannina)
Loic Lagadec (Lab-STICC, UMR 6285, ENSTA-Bretagne)
Sébastien Le Beux (Lyon Institute of Nanotechnology (INL))
Heiner Litz (Stanford University)
Vagelis Mariatos (TEI of Mesolonghi)
Fernando Moraes (PUCRS)
Jari Nurmi (Tampere University of Technology)
Kyprianos Papadimitriou (Technical University of Crete)
Sebastien Pillement (University of Nantes - IETR)
Achim Rettberg (University Oldenburg)
Marco Domenico Santambrogio (Politecnico di Milano)
Tiberiu Seceleanu (ABB Corporate Research)
Kostas Siozios (National Technical University of Athens)
Dimitrios Soudris (NTUA)
Dirk Stroobandt (Ghent University)
Marc Stöttinger (Continental Teves AG oHG)
Peter Zipf (Uni Kassel)
Lionel Torres (LIRMM)
Chao Wang (University of Science and Technoglogy of China)
Nikolaos Voros (Technological Educational Institute of Western Greece)

Best Regards,

DR. GABRIEL ALMEIDA | Software Architect, CoC Platform Software | +49 7248 71 3012<tel:+49%207248%2071%203012>
[Harman_Email_Signature_8_18 FINAL]

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