[hpc-announce] CFP of SI: CPC_HPCMS 2015 (High Performance Computing for Advanced Modeling and Simulation of Materials)

Junchao Zhang junchao.zhang at gmail.com
Mon Oct 12 15:26:42 CDT 2015

Supercomputers are rapidly evolving as advances in architecture and
semiconductor technology. High performance computing has been applied to
accelerate the advanced modeling and simulation of materials. The current
will provide challenges in parallelism because of increased processing
accelerators, complex hierarchical memory systems, interconnection networks,
storage and uncertainties in programming models. The interdisciplinary
collaboration is becoming more and more important in high performance
computation. Realistic material modeling and simulation need to combine
material modeling methods, mathematical models, parallel algorithms and
for exploiting supercomputers effectively.

The workshop focuses on novel mathematical modeling, parallel algorithms,
performance computing tools and experiences in large-scale material
and supercomputers. The program aims at bringing different expertise
domain experts, applied mathematicians and computer scientists together to
discuss the interdisciplinary research of modeling methods and parallel
algorithm design for the simulation performance of materials on current and
future supercomputers.

About the Topics of Interest

In particular, the topic of interest includes but is not limited to

* Numerical methods and parallel algorithms for the advanced modeling and
simulation of materials
* Use of hardware accelerators (MIC、GPUs、FPGA) and heterogeneous hardware
in computational material science
* Mathematical modeling and high performance computing tools in large-scale
material simulation
* Programming model for material algorithm scalability and resilience
* Visualization on material data
* Multi-scale modeling and simulation in materials science
* Performance modeling and auto-tuning methods in material simulation
* Big data of materials science
* Accelerate dissipative particle dynamics by hardware accelerators
* Large-scale material modeling based on the new features of message
passing programming model

Important dates

Submission deadline: 2016.1.20
Acceptance deadline: 2016.4.20
Publication: 2016.6.20

Submission Format and Guideline

All submitted papers must be clearly written in excellent English and
only original work, which has not been published by or is currently under
review for any other journal or conference. Papers must not exceed 25 pages
(one-column, at least 11pt fonts) including figures, tables, and
references. A
detailed submission guideline is available as "Guide to Authors" at:


All manuscripts and any supplementary material should be submitted through
Elsevier Editorial System (EES). The authors must select as "CPC_HPCMS 2015"
when they reach the "Article Type" step in the submission process. The EES
website is located at:


All papers will be peer-reviewed by three independent reviewers. Requests
additional information should be addressed to the guest editors.

Editors in Chief

N. Stanley. Scott

Guest Editors

Fei Gao: gaofeium at umich.edu
Jose Luis Vazquez-Poletti: jlvazquez at fdi.ucm.es
Jianjiang Li: jianjiangli at gmail.com
Jue Wang: wangjue at sccas.cn
-------------- next part --------------
An HTML attachment was scrubbed...
URL: <https://lists.mcs.anl.gov/mailman/private/hpc-announce/attachments/20151012/d9d018a1/attachment.html>

More information about the hpc-announce mailing list