[hpc-announce] IEEE Hot Interconnects 2015 - Call for Participation

Torsten Hoefler htor at inf.ethz.ch
Tue Jul 21 15:25:36 CDT 2015

     23rd International Symposium on High Performance Interconnects

                                HotI 2015

                    Oracle Santa Clara Agnews Campus
                         Santa Clara, California
                            August 26-28, 2015
                          (following Hot Chips)

                              Register now at

                    Early registration ends July 31st!

              Advance Program - Hot Interconnects 23 - 2015

Come join us for the 23rd annual IEEE Symposium on High-Performance
Interconnects (Hot Interconnects), to be held August 26-27 (with
tutorials on August 28), 2015, generously hosted by Oracle at the
historic Oracle Agnews Campus, Santa Clara, California. Please
visit http://www.hoti.org for more details.

Hot Interconnects (HotI) is the premier international forum for
researchers and developers of state- of-the-art hardware and
software architectures and implementations for interconnection
networks of all scales, ranging from multi-core on-chip
interconnects to those within systems, clusters, data centers, and
clouds. This yearly conference is attended by leaders in industry
and academia, creating a wealth of opportunities to interact with
individuals at the forefront of this field.

This year's Hot Interconnects features keynotes from Oracle's Vice
President of Hardware Development Rick Heatherington, and David
Meyer, the CTO and Chief Scientist of Brocade Communications. There
will be a great lineup of exciting talks, Intel will be discussing
their upcoming OmniPath technology, Facebook will discuss their
efforts in interconnects and VMWare will talk about NFV.

A panel "HPC vs. Datacenter Networks" discussing the intersection
of HPC networking technologies and Data center networking from
experts in both areas from world-leading companies and institutions
will provide a lively debate on what each group can learn from each
other and areas in which they are already converging.

There will be four technical paper sessions covering the cutting
edge in interconnect research and development on cross-cutting
issues spanning computer systems, networking technologies, and
communication protocols for high-performance interconnection
networks. This conference is directed particularly at new and
exciting technology and product innovations in these areas.

Building on last year's successful technical program comprising
keynotes, technical sessions, and panels on networking for
data centers and high-performance computing, the 2015 edition of Hot
Interconnects will be located at Oracle Agnews Campus in Santa
Clara, CA. This year's conference focuses on HPC Interconnects and
their use in traditional and non-traditional applications. We hope
you can join us.

                        Wednesday, August 26, 2015


Keynote 1

Commercial Computing Trends and Their Impact on Interconnect

Rick Heatherington, Oracle

+++ Best Papers +++

- NUMA Aware I/O in Virtualized Systems
   A. Banerjee, R. Mehta and Z. Shen

- The BXI Interconnect Architecture
   S. Derradji, A. Poudes, J.-P. Panziera and F. Wellenreiter

- Exploiting Offload Enabled Network Interfaces
   S. Di Girolamo, P. Jolivet, K. D. Underwood and T. Hoefler

+++ Short Papers +++

- A Brief Introduction to the OpenFabrics Interfaces - A New Network
   API for Maximizing High Performance Application Efficiency

   P. Grun, S. Hefty, S. Sur, D. Goodell, R. Russell, H. Pritchard
   and J. Squyres

- UCX: An Open Source Framework for HPC Network APIs and Beyond

   P. Shamis, M. G. Venkata, M. G. Lopez, M. B. Baker, O. Hernandez,
   Y. Itigin, M. Dubman, G. Shainer, R. Graham, L. Liss, Y. Shahar,
   S. Potluri, D. Rossetti, D. Becker, D. Poole, C. Lamb, S. Kumar,
   C. Stunkel, G. Bosilca and A. Bouteiller

+++ Invited Paper +++

Intel Omni-Path Architecture: Enabling Scalable, High Performance

T. Rimmer et al.

+++ Panel +++

HPC vs. Data Center Networks

Concentrating on what the HPC and Data center interconnects
communities can learn from each other, this panel will have
participants from leading HPC and Data center networking companies.


Ariel Hendel, Broadcom
Michael Kagan, Mellanox
Jeff Squyres, Cisco
Keith Underwood, Intel

+++ Banquet +++

Enjoy an evening banquet at the beautiful Oracle Agnews campus

                        Thursday, August 27, 2015

Keynote 2

Recent Advances in Machine Learning and their Application to

David Meyer, Brocade

+++ Optics and NoC +++

- Design of Cluster-based Architectures for
   3D Mesh-based Networks-on-Chip

   P. Bahrebar and D. Stroobandt

- OWN: Optical and Wireless Network-on-Chips (NoCs) for Kilo-core

   A. Kodi, A. Sikdar, A. Louri, S. Kaya and M. Kennedy

- AMON: Advanced Mesh-like Optical NoC
   S. Werner and J. Navaridas

++ Efficient Network Design +++	

- Impact of InfiniBand DC Transport Protocol on Energy Consumption
   of All-to-all Collective Algorithms

   H. Subramoni, A. Venkatesh, K. Hamidouche, K. Tomko and D. Panda

- Implementing Ultra Low Latency Data Center Services with
   Programmable Logic

   J. Lockwood and M. Monga

- Enhanced Overloaded CDMA Interconnect (OCI) Bus Architecture for
   on-Chip Communication

   K. Ahmed and M. Farag

+++ Invited Talk +++


+++ Invited Talk +++

Challenges and Opportunities for NFV in Cloud Infrastructure

Bhavesh Davda, VMWare

+++ Awards Presentation +++

Best Student Paper Award

                         Friday, August 28, 2015

Morning Tutorials

Accelerating Big Data Processing with Hadoop, Spark, and Memcached
Over High-Performance Interconnects

D. K. Panda & X. Lu, Ohio State University

ONOS Tutorial Hot Interconnect

T. Vachuska, M. Jampani, A. Al-Shabibi & B. O'Connor, ONOS

Afternoon Tutorials

Flow and Congestion Control for High Performance Clouds: How to
Design and Tune the Datacenter Fabric & SDN for Big Data

M. Gusat, IBM Research, Zurich Laboratory

Software-defined Wide-Area Networking: Challenges, Opportunities
and Reality

I. Monga, Energy Sciences Network & S. Seetharaman, Infinera


This is a preliminary program; changes may occur. For the most up-to-
the-minute details on presentations, schedules, and registration
information, please visit our web site:

                       Website: http://www.hoti.org

Early Registration: Ends at 11:59 PM (PDT) on Friday July 31st, 2015
Last Day for Refunds: 11:59 PM (PDT) Wednesday August 12, 2015.

Press representatives please contact: info at hoti.org

Registration fees for Tutorials include tutorial notes, continental
breakfast, lunch, and coffee breaks. Registration fees for the
conference include web access the conference proceedings. There will
be no printed proceedings. The conference registration fee includes a
reception on Wednesday night (August 26, 2015), continental breakfasts,
lunches and coffee breaks during the two days of the conference (August
26 & 27).


*** Hot Interconnects Corporate Sponsors ***

Host Sponsor
  Oracle Corp.

  Mellanox Technologies

  Warthman Associates


*** Organizing Committee ***

  Fabrizio Petrini, IBM T.J. Watson

Technical Program Chairs
  Ada Gavrilovska, Georgia Tech
  Ryan Grant, Sandia National Laboratories

Tutorial Chair
  Vikram Dham, Kamboi Technologies

Publication Chair
  Luca Valacarenghi, Scuola Superior Sant'Anna

Awards Chair
  Xin Huang, Cyan

Finance Chairs
  Madeleine Glick, University of Arizona
  Xinyu Que, IBM T.J. Watson

Registration Chair
  Charlie Perkins, Huawei

Media Chair
  Torsten Hoefler, ETH Zurich

Local Arrangements Chair
  Don Draper, Oracle

  Natalia Berezneva


*** Steering Committee ***

  Allen Baum, Mill Computing
  Keren Bergman, Columbia University
  Raj Channa, RBC Capital Markets
  Lily Jow, Hewlett Packard
  Mark Laubach, Broadcom
  John Lockwood, Algo-Logic Systems
  Fabrizio Petrini, IBM T.J. Watson
  Dan Pitt, Open Networking Foundation


*** Sister Conferences ***

  Hot Chips
  Cool Chips

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