[hpc-announce] HotI'15 CFP: 23rd Symposium on Hot Interconnects -- Abstract Registration 5/4

[Ada Gavrilovska]

Hot Interconnects 2015 with IEEE MICRO Special Issue - Deadline Extension 

Abstracts due: May 4th 11:59PM AOE (extended)
Papers due: May 11th 11:59AM AOE (extended)
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The best architecture papers from HotI 2015 will be invited to a special issue of IEEE MICRO

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CALL FOR PAPERS 23rd International Symposium on High Performance Interconnects 2015
with IEEE MICRO Special Issue on Microarchitecture
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Oracle Agnews Campus, Santa Clara, California, August 26-28, 2015
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* Paper abstract deadline:     May 4th, 11:59PM AOE
* Submission deadline:         May 11th, 11:59PM AOE
* Notification of acceptance:  June 15th, 2015
* IEEE Micro special issue
  invited submissions due:     January 6th, 2016
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Hot Interconnects is the premier international forum for researchers and developers of state-of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip interconnects to those within systems, clusters,data centers, and clouds. This yearly conference is attended by leaders in industry and academia. The atmosphere provides for a wealth of opportunities to interact with individuals at the forefront of this field.

Themes include cross-cutting issues spanning computer systems, 
networking technologies, and communication protocols for high-performance interconnection networks. This conference is directed particularly at new and exciting technology and product innovations in these areas. Contributions should focus on real experimental systems, prototypes, or leading-edge products and their performance evaluation. This year's best papers on interconnect microarchitecture will be invited to submit extended versions of their papers to a special edition of IEEE Micro.

Building on last year's successful technical program comprising 
keynotes, technical sessions, and panels on networking for datacenters and high-performance computing, the 2015 edition of Hot Interconnects is generously hosted by Oracle at their Agnews Campus in Santa Clara, CA. 
This year's conference focuses on HPC Interconnects and their use in traditional and non-traditional applications. We hope you can join us there.

We invite paper submissions across a wide range of topics and levels,
ranging from fundamentals to the latest advances in hot topic areas. 
Topics of interest include, but are not limited to:

TOPICS OF INTEREST:

* Novel and innovative interconnect architectures
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Advanced chip-to-chip communication technologies
* Optical interconnects
* Protocol and interfaces for inter-processor communication
* Survivability and fault-tolerance of inter-connects
* High-speed packet processing engines and network processors
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Pb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud & grid computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance inter-connects
* Traffic characterization for HPC systems and commercial data centers
* Software-defined networking and software overlay networks
* Software for network bring-up, configuration and performance
†† management (OpenFlow, OpenSM)
* Data Center Networking

SCHEDULE AND SUBMISSION PROCEDURE:

* Paper abstract deadline:      May 4th, 2015
* Submission deadline:          May 11th, 2015
* Notification of acceptance:   June 15th, 2015
* Symposium:                    August 26-27, 2015
* Tutorials:                    August 28, 2015
* IEEE Micro special issue
  invited submissions due:      January 6th, 2016

This year we invite papers to be submitted either as regular, long 
papers (6-8 pages) or as short papers (3-4 pages). Short papers could 
be positional papers, industry papers, or papers describing 
hot-off-the-press breaking research results, and will judged accordingly 
and independently from the regular long papers.

* Papers need sufficient technical detail to judge quality and 
  suitability for presentation.
* Submissions should include title, author, abstract, 
  and paper in double-column, IEEE format.
* Long paper limit: 8 pages, single-spaced, 2 columns.
* Short paper limit: 4 pages, single-spaced, 2 columns.
* Papers should be submitted electronically through EasyChair at
††https://www.easychair.org/conferences/?conf=hoti23
* Paper title and abstract should be submitted by April 27th.
* Full paper manuscript should be submitted is by May 4th.
* Accepted papers will be published in proceedings by the 
  IEEE Computer Society.
* Regular paper presentations are 30-minute talks in a 
  single-track conference format.

AWARDS: 

An award will be given to the best student paper. To be eligible for the best paper award at least one of the paper authors must be a full-time student at the time of submission. In addition, HotI will provide Student Travel Awards. Information on travel awards can be found on our web site.

GENERAL CHAIR
Fabrizio Petrini, IBM T.J. Watson

TECHNICAL PROGRAM CHAIRS
Ada Gavrilovska, Georgia Tech
Ryan Grant, Sandia National Laboratories

Please contact us at info at hoti.org if you have any questions.

Go to the Hot Interconnects web site for updates: www.hoti.org
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