[hpc-announce] CFP: ACM International Workshop on Manycore Embedded Systems (MES) @ ISCA-13
masdan at utu.fi
Thu Apr 4 14:21:04 CDT 2013
(Please accept our apologies for multiple postings of this announcement)
Call for Paper
ACM International Workshop on Manycore Embedded Systems (MES)
in conjunction with the 40th International symposium on Computer Architecture (ISCA-2013)
Special Issue: Elsevier's Microprocessors and Microsystems Journal (MICPRO)
23-27 June 2013, Tel-Aviv
submission deadline extension: 14th April, 2013
Many-core embedded systems (MES) are moving towards the integration of hundreds cores on a single chip and hold the promise of increasing performance through parallelism. As the number of cores integrated into a chip increases, the on-chip communication becomes power and performance bottleneck in future MES. Network-on-Chip (NoC) architecture has been proposed as the most viable solution to meet the performance and design productivity requirements of the complex on-chip communication infrastructure. NoC provides an infrastructure for better modularity, scalability, fault-tolerance, and higher bandwidth compared to traditional infrastructures. On the other hand, developing applications using the full power of NoC-based MES requires software developers to transition from writing serial programs to writing parallel programs. On top of that, for managing many-core resources, contemporary Operating Systems (OS) have been designed to run on a small number of reliable cores and are not able to scale up to hundreds of cores. Therefore, designing scalable and faultless OSs will be a tremendous challenge in future MES.
The goal of this workshop is to bring together the researchers from academia and the experts from industry to present and discuss innovative ideas and solutions in the design, modeling, prototyping, programming, and implementation of MES. Topics of interest include, but are not limited to:
* NoCs (routing, arbitration, switch architecture, etc.)
* Mapping of applications (static, dynamic, etc.)
* OS (centralized, distributed, scheduling, allocation, memory management, etc.)
* Reliability issues
* Physical design
* 3D stacked technology
* Synthesis, verification, debug & test
* Performance and power issues
* Reconfigurability aspects
* FPGA implementation
* Programming model and scalable software
* Compiler technologies
* Many-core as accelerators
* Heterogeneity challenges
* Cyber-Physical Systems
* Low power and power management
Submissions from EU projects in progress as well as seminal work in the field are also encouraged. Submissions should not exceed 8 pages, including tables and figures, and must be formatted in accordance to the ACM two column style. Submission of a paper should be regarded as an undertaking that, should the paper be accepted, at least one of the authors will register for the conference and present the work. Short papers (up to 4 pages) will also be accepted.
Proceeding and Special Issue:
The accepted papers will be published in the ACM Digital Library.
Selected papers will be considered to appear in a special issue of the Elsevier's Microprocessors and Microsystems Journal (MICPRO).
Instruction for Paper Submissions:
You are invited to submit original and unpublished research works on topics related to many-core embedded systems. Submitted papers must not have been published or simultaneously submitted elsewhere. Please submit a PDF copy of your full manuscript, not to exceed 8 double-column ACM formatted pages, and include up to 6 keywords and an abstract of no more than 400 words. Papers must be formatted in accordance to the ACM two column style. ACM Word or LaTeX style templates are available here<http://www.acm.org/sigs/publications/proceedings-templates>. In addition, Authors should apply ACM Computing Classification<http://www.acm.org/about/class/1998> categories and terms.
Submit a PDF copy of your full manuscript to the Workshop EasyChair link at:
Submission deadline: 1st April 2013 -> 14th April, 2013
Notification of acceptance: 10th May 2013
Camera ready: 20th May 2013
Masoud Daneshtalab, University of Turku, Finland
Ahmed Hemani, Royal Institute of Technology, Sweden
Maurizio Palesi, Kore University, Italy
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