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CALL FOR PAPERS
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20th International IEEE Symposium on High Performance Interconnects
HotI 2012
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Huawei North America Headquarters
Santa Clara, California
August 22-23, 2012
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Follow us on Twitter: http://twitter.com/HotiConference
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Hot Interconnects is the premier international forum for researchers and
developers of state-of-the-art hardware and software architectures and
implementations for interconnection networks of all scales, ranging from
multi-core on-chip interconnects to those within systems, clusters, data
centers, and cloud facilities. This yearly conference is attended by
leaders in industry and academia. The atmosphere provides for a wealth
of opportunities to interact with individuals at the forefront of this
field. Themes include cross-cutting issues spanning computer systems,
networking technologies, and communication protocols for
high-performance interconnection networks. This conference is directed
particularly at new and exciting technology and product innovations in
these areas. Contributions should focus on real experimental systems,
prototypes, or leading-edge products and their performance evaluation.
In addition to those subscribing to the main theme of the conference,
contributions are also solicited in the topics listed below.
TOPICS OF INTEREST:
* Novel and innovative interconnect architectures
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Advanced chip-to-chip communication technologies
* Optical interconnects
* Protocols and interfaces for inter-processor communication
* Survivability and fault-tolerance of interconnects
* High-speed packet processing engines and network processors
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Tb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance interconnects
* Traffic characterization for HPC systems and commercial data centers
* Software for Network/Fabric Bring-up, Configuration and Performance
Management, e.g., OpenFlow or OpenSM
SCHEDULE AND SUBMISSION PROCEDURE:
* Submission deadline: May 13, 2012
* Notification of acceptance: June 16, 2012
* Papers need sufficient technical detail to judge quality and
suitability for presentation
* Paper limit: 8 pages, 2 columns
* Submit title, author, abstract, and full paper (8 pages, double-
column, IEEE format)
* Papers should be submitted electronically through EasyChair at
https://www.easychair.org/conferences/?conf=hoti2012
TECHNICAL PROGRAM CHAIR
Torsten Hoefler, University of Illinois (UIUC)
TECHNICAL PROGRAM COMMITTEE
Dennis Abts, Google
Stu Bailey, Infoblox
Pavan Balaji, Argonne National Laboratory
Christian Bell, Myricom
Gil Bloch, Mellanox
David Cohen, Western Digital,
Hans Eberle, Oracle
Yashar Ganjali, University of Toronto
Ada Gavrilovska, Georgia Institute of Technology
Patrick Geoffray, Myricom
Paolo Giaccone, Politecnico di Torino
Brice Goglin, INRIA
Mitchell Gusat, IBM Research Zurich
Torsten Hoefler, University of Illinois (UIUC)
Mark Hummel, AMD
Pranay Koka, Oracle
Sameer Kumar, IBM Research Center (Yorktown)
John Lockwood, Algo-Logic
Rami Melhem, University of Pittsburgh
Cyriel Minkenberg, IBM Research Zurich
Mondrian Nuessle, University of Heidelberg
Fabrizio Petrini, IBM T.J. Watson
Greg Pfister, Colorado State University
Galen Shipman, Argonne National Laboratory
Tor Skeie, University of Oslo
Craig Stunkel, IBM Research Center (Yorktown)
Keith Underwood, Intel
Anujan Varma, University of California (Santa Cruz)
Eitan Zahavi, Mellanox
Please contact us at info at hoti.org if you have any questions.
Go to the Hot Interconnects web site for updates: http://www.hoti.org
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