[hpc-announce] Call for Papers: IEEE Hot Interconnects 2012

Torsten Hoefler htor at illinois.edu
Mon Mar 19 17:23:18 CDT 2012

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                            CALL FOR PAPERS
  20th International IEEE Symposium on High Performance Interconnects
                               HotI 2012

                   Huawei North America Headquarters
                        Santa Clara, California 
                           August 22-23, 2012

        Follow us on Twitter: http://twitter.com/HotiConference

Hot Interconnects is the premier international forum for researchers and
developers of state-of-the-art hardware and software architectures and
implementations for interconnection networks of all scales, ranging from
multi-core on-chip interconnects to those within systems, clusters, data
centers, and cloud facilities. This yearly conference is attended by
leaders in industry and academia. The atmosphere provides for a wealth
of opportunities to interact with individuals at the forefront of this
field. Themes include cross-cutting issues spanning computer systems,
networking technologies, and communication protocols for
high-performance interconnection networks. This conference is directed
particularly at new and exciting technology and product innovations in
these areas. Contributions should focus on real experimental systems,
prototypes, or leading-edge products and their performance evaluation.
In addition to those subscribing to the main theme of the conference,
contributions are also solicited in the topics listed below.


* Novel and innovative interconnect architectures
* Multi-core processor interconnects
* System-on-Chip Interconnects
* Advanced chip-to-chip communication technologies
* Optical interconnects
* Protocols and interfaces for inter-processor communication
* Survivability and fault-tolerance of interconnects
* High-speed packet processing engines and network processors
* System and storage area network architectures and protocols
* High-performance host-network interface architectures
* High-bandwidth and low-latency I/O
* Tb/s switching and routing technologies
* Innovative architectures for supporting collective communication
* Novel communication architectures to support cloud computing
* Centralized and distributed cloud interconnects
* Requirements driving high-performance interconnects
* Traffic characterization for HPC systems and commercial data centers
* Software for Network/Fabric Bring-up, Configuration and Performance 
  Management, e.g., OpenFlow or OpenSM


* Submission deadline:          May 13, 2012
* Notification of acceptance:   June 16, 2012

* Papers need sufficient technical detail to judge quality and
  suitability for presentation
* Paper limit: 8 pages, 2 columns
* Submit title, author, abstract, and full paper (8 pages, double-
  column, IEEE format)
* Papers should be submitted electronically through EasyChair at


Torsten Hoefler, University of Illinois (UIUC)


Dennis Abts, Google
Stu Bailey, Infoblox
Pavan Balaji, Argonne National Laboratory
Christian Bell, Myricom
Gil Bloch, Mellanox
David Cohen, Western Digital,
Hans Eberle, Oracle
Yashar Ganjali, University of Toronto 
Ada Gavrilovska, Georgia Institute of Technology
Patrick Geoffray, Myricom
Paolo Giaccone, Politecnico di Torino
Brice Goglin, INRIA
Mitchell Gusat, IBM Research Zurich
Torsten Hoefler, University of Illinois (UIUC)
Mark Hummel, AMD
Pranay Koka, Oracle
Sameer Kumar, IBM Research Center (Yorktown)
John Lockwood, Algo-Logic
Rami Melhem, University of Pittsburgh
Cyriel Minkenberg, IBM Research Zurich
Mondrian Nuessle, University of Heidelberg
Fabrizio Petrini, IBM T.J. Watson
Greg Pfister, Colorado State University
Galen Shipman, Argonne National Laboratory
Tor Skeie, University of Oslo
Craig Stunkel, IBM Research Center (Yorktown)
Keith Underwood, Intel
Anujan Varma, University of California (Santa Cruz)
Eitan Zahavi, Mellanox

Please contact us at info at hoti.org if you have any questions.

Go to the Hot Interconnects web site for updates: http://www.hoti.org
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